Apparatus (10) for vertical (72) slip forming of concrete walls and columns (55). The apparatus comprises an attachment portion (23) for a frame with a slipform assembly inside comprising an extrusion form providing side walls defining a cavity and actuators (20) to adjust the position of the side walls forms essentially arranged along the longitudinal axis of the slipform assembly. A concrete supply (45) is connected with the slipform assembly for delivering concrete (52, 53, 54) to that cavity through the top open surface. A mechanism (20) is provided for vertically displacing (72) that slipform assembly incrementally relative to the frame. Thus, a concrete structure (55) having a vertical orientation is continuously cast. The actuators (20) adjust the position of the side walls during the incremental vertical movement (72) of the slipform assembly to create new forms for a column or wall with variable diameter, variable form and/or twisted.

Methods of manufacturing a cementitious structure, such as a structure for supporting a wind turbine, include additively printing, via an additive printing device, one or more contours that include a cementitious material so as to form a cementitious structure in a layer by layer manner such that a first portion of the plurality of contours comprises a first plurality of contour coupling features that engage with a second plurality of contour coupling features of a second portion of the plurality of contours.

A method for manufacturing an electronic device casing having a coupling structure is provided. The electronic device casing is made of a casing material including a supportive substrate and a first thermoplastic substrate. A preliminary connecting section is formed on the first thermoplastic substrate by a hot-pressing molding process, and a molding plastic material is injected onto the preliminary connecting section by an in-mold injection process. After being cooled, the molding plastic material engages with the preliminary connecting section to form a secondary connecting section for a coupling element to couple with. Thus, the coupling structure of the electronic device casing can be directly formed during a manufacturing process without any additional procedures, thereby overall manufacturing time and costs are reduced.

Material processing systems are disclosed. Some systems include methods of eliminating or reducing defects in elongate workpieces that can undergo large deformations during processing. Some systems include apparatus configured to facilitate such large deformations while maintaining internal stresses (e.g., tensile stresses) below a threshold stress. Some disclosed systems pertain to powder extrusion techniques. Continuous and batch processing systems are disclosed.

Material processing systems are disclosed. Some systems include methods of eliminating or reducing defects in elongate workpieces that can undergo large deformations during processing. Some systems include apparatus configured to facilitate such large deformations while maintaining internal stresses (e.g., tensile stresses) below a threshold stress. Some disclosed systems pertain to powder extrusion techniques. Continuous and batch processing systems are disclosed.

Methods use a catalytic composition built up from a ceramic material including a catalytic material and a first inorganic binder and a second inorganic binder and a catalytic structure made thereof. Preferably, the structure is made by a colloidal ceramic shaping technique. The structure is used for catalytic or ion exchange applications. The catalytic structures have excellent mechanical, physicochemical and catalytic properties.

Methods use a catalytic composition built up from a ceramic material including a catalytic material and a first inorganic binder and a second inorganic binder and a catalytic structure made thereof. Preferably, the structure is made by a colloidal ceramic shaping technique. The structure is used for catalytic or ion exchange applications. The catalytic structures have excellent mechanical, physicochemical and catalytic properties.

The manufacturing method includes a step of mixing a coarse particle zeolite, a fine particle zeolite, and a raw material of an inorganic bonding material to prepare a zeolite raw material; a step of forming the prepared zeolite raw material into a honeycomb shape to prepare a honeycomb formed body; and a step of firing the prepared honeycomb formed body to prepare the honeycomb structure. In the step of preparing the zeolite raw material, as the coarse particle zeolite, a chabazite type zeolite having a specific average particle diameter, the fine particle zeolite having a specific average particle diameter, the raw material of the inorganic bonding material which includes at least basic aluminum lactate is used.

The manufacturing method includes a step of mixing a coarse particle zeolite, a fine particle zeolite, and a raw material of an inorganic bonding material to prepare a zeolite raw material; a step of forming the prepared zeolite raw material into a honeycomb shape to prepare a honeycomb formed body; and a step of firing the prepared honeycomb formed body to prepare the honeycomb structure. In the step of preparing the zeolite raw material, as the coarse particle zeolite, a chabazite type zeolite having a specific average particle diameter, the fine particle zeolite having a specific average particle diameter, the raw material of the inorganic bonding material which includes at least basic aluminum lactate is used.

A honeycomb structure includes honeycomb segments each having a porous partition wall defining a plurality of cells, and includes a porous bonding layer containing a crystalline anisotropic ceramic and disposed so as to bond side surfaces of the honeycomb segments to each other. A ratio of a pore volume (cc/g) of a fine pore defined as a pore in the bonding layer having a pore diameter of 10 μm or more and less than 50 μm with respect to a pore volume (cc/g) of a coarse pore defined as a pore in the bonding layer having a pore diameter of 50 μm or more and 300 μm or less is from 2.0 to 3.5, the pore volume of the fine pore is from 0.15 to 0.4 cc/g, and the pore volume of the coarse pore is from 0.05 to 0.25 cc/g.