A mosaic tile design and manufacturing system is comprised of a mosaic design application, a network server and a tile cutting apparatus. A mosaic artist can use the mosaic design application to specify the placement, color and shapes of a plurality of mosaic tile comprising a mosaic design. The tile shapes can be a combination of standard and non-standard shapes, and the design tool can generate instructions that can be applied by the server to the tile cutting apparatus to control the cutting apparatus to make custom tile cuts that result in a tile with a non-standard shape.

A mosaic tile design and manufacturing system is comprised of a mosaic design application, a network server and a tile cutting apparatus. A mosaic artist can use the mosaic design application to specify the placement, color and shapes of a plurality of mosaic tile comprising a mosaic design. The tile shapes can be a combination of standard and non-standard shapes, and the design tool can generate instructions that can be applied by the server to the tile cutting apparatus to control the cutting apparatus to make custom tile cuts that result in a tile with a non-standard shape.

The invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the following steps: providing a donor substrate (2), producing at least one modification (10) within the donor substrate (2) by means of at least one LASER beam (12), wherein the LASER beam (12) penetrates the donor substrate (2) via a planar surface (16) of the donor substrate (2), wherein the LASER beam (12) is inclined with respect to the planar surface (16) of the donor substrate (2) such that it penetrates the donor substrate at an angle of not equal to 0? or 180? relative to the longitudinal axis of the donor substrate, wherein the LASER beam (12) is focused in order to produce the modification (10) in the donor substrate (2) and the solid-body slice (1) detaches from the donor substrate (2) as a result of the modifications (10) produced or a stress-inducing layer (14) is produced or arranged on the planar surface (16) of the donor substrate (2) and mechanical stresses are produced in the donor substrate (2) by a thermal treatment of the stress-inducing layer (14), wherein the mechanical stresses produce a crack (20) for separating a solid-body layer (1), which crack propagates along the modifications (10).

A cutting system (10; 10; 10) for slabs (50) which comprises: a longitudinal guide (20; 20; 20) comprising a pair of surfaces (23,24; 23,24; 23,24) opposite to each other, of which a lower surface (24; 24; 24) and an opposite upper surface (23; 23; 23); a suction cup (41; 41; 41) coupled to the lower surface (24; 24; 24) of the longitudinal guide (20; 20; 20) suitable to selectively adhere to a slab (50) and defining a contact surface of the longitudinal guide (20; 20; 20) on the slab (50); the longitudinal guide further comprising a pair of rails (231; 231; 231) parallel to each other coupled to the upper surface (23; 23; 23) of the longitudinal guide (20; 20; 20) and suitable for slidably coupling to a scoring slider (30; 30; 30). The rails (231; 231; 231) are arranged on opposite sides with respect to a median plane (A-A) of the suction cup (41; 41; 41) perpendicular to the contact surface thereof.

Methods of separating a glass web that is moving at a glass web velocity. The method includes exposing a separation path on the glass web to at least one laser beam spot that moves with a laser beam spot velocity vector that is equal to a glass web velocity vector in a conveyance direction. The method also includes creating a defect on the separation path while the separation path is under thermal stress from the laser beam spot, whereupon the glass web spontaneously separates along the separation path in response to the defect. In further examples, a glass web separation apparatus includes a first reflector that rotates such that a laser beam spot repeatedly passes along a separation path and a second reflector that rotates such that the laser beam spot moves in a conveyance direction of the glass web.

A method for producing layers of solid material is contemplated. The production method may include the following: Providing a solid body to be split into a number of layers of solid material, introducing or generating defects in the solid body in order to determine a first detachment plane (8) along which a first layer of solid material is separated from the solid body, providing a receiving layer for holding the layer of solid material on the solid body, applying heat to the receiving layer in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the first layer of solid material from the solid body, then providing a second receiving layer for holding another layer of solid material on the solid body reduced by the first layer of solid material, introducing or generating defects in the solid body in order to determine a second detachment plane (9) along which a second layer of solid material is separated from the solid body, applying heat to the second receiving layer in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the second detachment plane, which crack separates the second layer of solid material from the solid body.

A glass plate separating apparatus, as one example, includes: a trigger device that forms a start point flaw in a first main surface of a glass ribbon on a division-planned line; a pair of holding members disposed at the first main surface side of the glass ribbon; and a heater disposed at a second main surface side of the glass ribbon. The pair of holding members, each of which extends parallel to the division-planned line, is brought into contact with the glass ribbon at both sides of the division-planned line while being lowered together with the glass ribbon. The heater extends along the division-planned line, and is brought into contact with and pressed onto the glass ribbon on the division-planned line while being lowered together with the glass ribbon.

Improved methods and apparatuses for singulating integrated circuit (IC) dies that reduce or eliminate die collisions and work well with very small dies. Embodiments simultaneously separate dies in two dimensions by utilizing a break and expansion system that avoids die collisions by maintaining IC die separation after singulation. Singulation is achieved by placing the joined dies of the wafer substrate on a dicing tape, scoring the wafer substrate between the joined dies, and imposing a bending action by pressing a curved surface against the scored wafer substrate, which also expands the wafer substrate by stretching the dicing tape. After breaking, an inner expansion grip ring is pressed into an outer expansion grip ring in a nested configuration so as to maintain the stretched state of the dicing tape after the curved surface is fully removed, thereby maintaining the dicing tape in tension and the singulated die in spaced apart relation.

A cutting tool includes a cutting-wheel handle with an uniform cross-section with an outer contour including points arranged following two opposed straight rows and points arranged following one or more curved line segment of the edge of a circle enclosing an area into which the opposed straight rows lie and a cutting wheel mounted on the cutting-wheel handle to rotate along a rotation plane parallel or substantially parallel to the two opposed straight rows. A cutting-wheel handle holder has a body including a through hole for the insertion therethrough of the cutting-wheel handle, to a cutting assembly including the cutting tool and the cutting-wheel handle holder, and to a ceramic cutting device including the cutting assembly pivotably mounted to a support movably mounted on longitudinal guides mounted to a base.

The invention relates to a cutting and separating device applicable to manual ceramic cutters, comprising: a carriage; a collapsible handle with a cutting tool; a toothed part comprising a separator for separating ceramic parts; springs for holding the toothed part in an inoperative position as well as a toothed actuator in an engaged position with the toothed part; and a manual trigger element for disengaging the toothed actuator. The rotation of the handle past a pre-determined angle causes the engagement of the toothed actuator in the toothed part; the descending rotation causes the toothed actuator to rotate the toothed part until an operative position of the separator is reached; and the actuation of the trigger element causes the release of the toothed part and the return thereof to the inoperative position.