The invention relates to a tool for transferring positions of a measuring reference from a construction frame (not shown) to a surface of a tile or a number of adjacent tiles (31) for making cut-outs in said tile or tiles (31), said tool (1) comprising a frame-like structure (3) and a grid structure (6) having openings in a raster pattern or a grid pattern made up by laser beams, said grid structure or pattern (6) extending between elements of the frame-like structure (3). The tool is distinctive in that the tool (1) further comprises at least one leg arrangement (2) with an end portion (7), said end portion (7) having spacer element (7b) having a width equal to normal spacing between two adjacently mounted tiles (31) or between a mounted tile and a construction element, such that when measuring the position (34) for the cut-out to be transferred, when transferring the cut out positions to the tile (31) or tiles (31) to be mounted, said end portion (7b) is adapted to rest against a mounted tile (31) or an end construction element at the opposite side of the spacer element (7b).

The invention relates to a tool for transferring positions of a measuring reference from a construction frame (not shown) to a surface of a tile or a number of adjacent tiles (31) for making cut-outs in said tile or tiles (31), said tool (1) comprising a frame-like structure (3) and a grid structure (6) having openings in a raster pattern or a grid pattern made up by laser beams, said grid structure or pattern (6) extending between elements of the frame-like structure (3). The tool is distinctive in that the tool (1) further comprises at least one leg arrangement (2) with an end portion (7), said end portion (7) having spacer element (7b) having a width equal to normal spacing between two adjacently mounted tiles (31) or between a mounted tile and a construction element, such that when measuring the position (34) for the cut-out to be transferred, when transferring the cut out positions to the tile (31) or tiles (31) to be mounted, said end portion (7b) is adapted to rest against a mounted tile (31) or an end construction element at the opposite side of the spacer element (7b).

A wafer is processed by irradiating a region to be divided with a pulse laser beam with a wavelength having absorbability to generate a thermal stress wave and propagate the wave to the inside of the region to be divided. A crushed layer is formed by executing irradiation, with a pulse laser beam with a wavelength having transmissibility with respect to the wafer, matching with a time when the thermal stress wave is generated and reaching a depth position at which a point of origin of dividing is to be generated at a sonic speed according to the material of the wafer. Absorption of the pulse laser beam with the wavelength having the transmissibility in a region in which the band gap is narrowed due to a tensile stress of the thermal stress wave forms a crushed layer that serves as the point of origin of dividing.

Cutting apparatuses and methods of use thereof are discussed. For example, the cutting apparatus may include a chassis with one or more substrate interfaces and a scribe guide. The cutting apparatuses also may include a plurality of support pistons, a deformable support, a locking mechanism, and/or an anchor extension. The support pistons may be adjustable to generally conform to a substrate, such as a non-planar substrate.

A base for manual ceramic cutters, which is provided with a support surface for the ceramic parts to be cut, the base including a rigid profile in the central longitudinal area, which rigid profile is secured to the supports of longitudinal displacement guides for a tool-holder head; and two lateral platforms mounted on the rigid profile by longitudinal shafts, which lateral platforms can be lowered between a horizontal use position, in which they form a support surface for the ceramic parts to be cut, and an inoperative position, in which the base defines a smaller surface area.

A cutting system for slabs which includes a longitudinal guide having a pair of surfaces opposite to each other, the pair made up of a lower surface and an opposite upper surface, a suction cup coupled to the lower surface of the longitudinal guide suitable to selectively adhere to a slab and defining a contact surface of the longitudinal guide on the slab, the longitudinal guide further including a pair of rails parallel to each other coupled to the upper surface of the longitudinal guide and suitable for slidably coupling to a scoring slider. The rails are arranged on opposite sides with respect to a median plane of the suction cup perpendicular to the contact surface thereof.

The invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the following steps: providing a donor substrate (2), producing at least one modification (10) within the donor substrate (2) by means of at least one LASER beam (12), wherein the LASER beam (12) penetrates the donor substrate (2) via a planar surface (16) of the donor substrate (2), wherein the LASER beam (12) is inclined with respect to the planar surface (16) of the donor substrate (2) such that it penetrates the donor substrate at an angle of not equal to 0° or 180° relative to the longitudinal axis of the donor substrate, wherein the LASER beam (12) is focused in order to produce the modification (10) in the donor substrate (2) and the solid-body slice (1) detaches from the donor substrate (2) as a result of the modifications (10) produced or a stress-inducing layer (14) is produced or arranged on the planar surface (16) of the donor substrate (2) and mechanical stresses are produced in the donor substrate (2) by a thermal treatment of the stress-inducing layer (14), wherein the mechanical stresses produce a crack (20) for separating a solid-body layer (1), which crack propagates along the modifications (10).

Methods of separating a glass web that is moving at a glass web velocity. The method includes exposing a separation path on the glass web to at least one laser beam spot that moves with a laser beam spot velocity vector that is equal to a glass web velocity vector in a conveyance direction. The method also includes creating a defect on the separation path while the separation path is under thermal stress from the laser beam spot, whereupon the glass web spontaneously separates along the separation path in response to the defect. In further examples, a glass web separation apparatus includes a first reflector that rotates such that a laser beam spot repeatedly passes along a separation path and a second reflector that rotates such that the laser beam spot moves in a conveyance direction of the glass web.

The present invention relates to a cuttable cladding panel with a matching pattern, the use, and the design method thereof. The cladding panel comprises an irregular pattern (10) of elongated lines, veins, and/or strips; transverse cutting lines (20) all of them cutting through the pattern at identical transverse intersecting points symmetrical with respect to a longitudinal axis of symmetry (SL); pairs of longitudinal cutting lines (30) symmetrical with respect to the longitudinal axis of symmetry (SL), each pair of longitudinal cutting lines cutting through the pattern at identical longitudinal intersecting points; with said cutting lines crossing one another at corner points (P); wherein each transverse intersecting point (21) is at the same distance from a corner point (P) as a corresponding longitudinal intersecting point (31); with two parts obtained by cutting the cladding panel (1) along any cutting line having a matching and continuous irregular pattern (10).

A frangibility device for creating a preferred breakage plane or weakness within cured columns such as rigid inclusions (RIs) and/or vibratory concrete columns (VCCs) comprises a cutting disc, an elongate strut attached to the center of the disc, and a detachable handle for turning. The disc comprises a thin geometric plate slit from center to periphery, so that a slicing wing can be bent downward at a shallow angle from the slit. The slicing wing advances the cutting disc through the cementious material of the uncured column. When the disc reaches the desired depth, the handle is removed and both disc and strut are left in place during curing.