An apparatus and method of manufacturing silicon seed rod in which two silicon seeds are joined into one long silicon seed rod by mechanical coupling. A mechanical seed coupler is a body in having an outer wall, an upper surface with an upper aperture, a lower surface with a lower aperture, and an inner wall surrounding an inner space. The mechanical seed couple can be of a shape including a cylinder shape, an elliptical tube shape, a rectangular tube shape and a square tube shape. Furthermore the mechanical seed coupler can be of unitary construction, made from one solid piece of material, or it can be composed of subparts.

A cut-out glass plate positioning apparatus includes: a cut line forming device 4 provided in a cut line forming position 4a; a bend-breaking and separating device 6 for cutting out unworked plate glasses 5 from an unworked plate glass 2 along the cut lines 3; a pair of position and angle correcting devices 8 for effecting correction of the position and angle with respect to the unworked plate glass 5; a pair of sucking and transporting devices 9 for suckingly lifting and transporting the unworked plate glass 5 to each position and angle correcting device 8; and two CCD cameras 10 respectively installed above the position and angle correcting devices 8.

A controller of a cutting apparatus includes: a storage section configured to preliminarily store as a threshold an arbitrary value based on a load current value of a motor detected when a cutting blade is rotated at a predetermined rotational speed while supplying a predetermined quantity of cutting water in a state in which a cutting water supply nozzle is positioned in an appropriate position; and a judgment section configured to judge normality or abnormality according to the result of comparison between a load current value detected when the cutting blade is rotated at the predetermined rotational speed while supplying the predetermined quantity of cutting water and the threshold stored in the storage section.

An apparatus and method of manufacturing silicon seed rod in which two silicon seeds are joined into one long silicon seed rod by mechanical coupling. A mechanical seed coupler is a body in having an outer wall, an upper surface with an upper aperture, a lower surface with a lower aperture, and an inner wall surrounding an inner space. The mechanical seed couple can be of a shape including a cylinder shape, an elliptical tube shape, a rectangular tube shape and a square tube shape. Furthermore the mechanical seed coupler can be of unitary construction, made from one solid piece of material, or it can be composed of subparts.

Provided is a dicing device capable of favorably performing a maintenance work, even when a workpiece is large. A dicing device includes a housing that accommodates inside thereof, a worktable configured to hold and move a workpiece, and a spindle configured to be rotatable while holding a blade, wherein the housing has: an end face provided in a moving direction of the worktable, the end face being on a side where a maintenance work of the dicing device is performed; and a slider constituting a part of the end face, and the slider is configured to be freely slidable in a direction to shorten a distance from the end face to the spindle.

Systems, methods, and techniques for patterning an assembly having a ferrite layer and a substrate using a blade or LASER beam to make cuts in the ferrite layer to form active regions of the ferrite layer and inactive regions of the ferrite layer. The cuts may be configured to relieve strain in the ferrite lattice structure. The cuts may be configured to achieve desired RF operating characteristic for the ferrite layer.

A dicing blade includes: a first blade portion and a second blade portion at least partially surrounding the first blade portion, wherein the first blade portion includes: a first bonding layer; first diamond particles disposed in the first bonding layer and having a first density in the first bonding layer; and first metal particles disposed in the first bonding layer, and wherein the second blade portion includes: a second bonding layer at least partially surrounding the first bonding layer; and second diamond particles disposed in the second bonding layer and having a second density in the second bonding layer, wherein the second density is higher than the first density.

A wafer is divided into device chips each of which is surrounded by a mold resin. The wafer has a plurality of devices arranged like a matrix with a spacing having a predetermined width, the front side of each device being covered with the mold resin, the spacing being filled with the mold resin to form a street between any adjacent ones of the devices. The wafer processing method includes a division start point forming step of forming a division start point along each street at the lateral center of the mold resin filling the spacing and a dividing step of applying an external force to the wafer after performing the division start point forming step, thereby laterally dividing each street into two parts at the division start point to obtain the device chips divided from each other, each device chip being surrounded by the mold resin.

A wafer is divided into device chips each of which is surrounded by a mold resin. The wafer has a plurality of devices arranged like a matrix with a spacing having a predetermined width, the front side of each device being covered with the mold resin, the spacing being filled with the mold resin to form a street between any adjacent ones of the devices. The wafer processing method includes a division start point forming step of forming a division start point along each street at the lateral center of the mold resin filling the spacing and a dividing step of applying an external force to the wafer after performing the division start point forming step, thereby laterally dividing each street into two parts at the division start point to obtain the device chips divided from each other, each device chip being surrounded by the mold resin.

A wafer having a substrate and a functional layer formed on the front side of the substrate is processed by attaching a protective tape curable by an external stimulation to the front side of the functional layer. The substrate is cut from the back side along each division line by using a cutting blade, thereby forming a cut groove having a depth not reaching the functional layer, with a part of the substrate left between the bottom of the cut groove and the functional layer. A laser beam is applied along the cut groove, thereby dividing the remaining part of the substrate to divide the wafer into device chips. When the groove is formed, an uncut portion in which the cut groove is not formed is left in a peripheral marginal area of the wafer.