A gas flow can be provided together with a liquid jet guided laser beam to remove accumulated liquid on the processing surface. The gas flow can be configured to have minimum interference with the liquid jet guided laser beam, while functions to blow away liquid generated by the liquid jet. Keeping the surface free from accumulated liquid can improve the efficiency of the liquid jet guided laser processing.

A gas flow can be provided together with a liquid jet guided laser beam to remove accumulated liquid on the processing surface. The gas flow can be configured to have minimum interference with the liquid jet guided laser beam, while functions to blow away liquid generated by the liquid jet. Keeping the surface free from accumulated liquid can improve the efficiency of the liquid jet guided laser processing.

A molding apparatus (10) for forming a retaining device. The molding apparatus (10) comprises a molding strip (12) and a molding support (24). The molding strip (12) has an inside face (14), an outside face (16), and a plurality of through cavities (18) extending from the outside face (16) to the inside face (14), the molding strip (12) extending in a longitudinal direction (X) and presenting both a transverse direction (Y) perpendicular to the longitudinal direction (X), and also a height direction (Z) perpendicular to the longitudinal direction (X) and to the transverse direction (Y). The inside face (14) is configured to press against a molding face (26) of the molding support (24), wherein the inside face (14) of the molding strip (12) and/or the molding face (26) of the molding support (24) includes an array of passages, the array of passages forming vents and connecting together the cavities (18) when the molding strip (12) is pressed against the molding support (24).

A molding apparatus (10) for forming a retaining device. The molding apparatus (10) comprises a molding strip (12) and a molding support (24). The molding strip (12) has an inside face (14), an outside face (16), and a plurality of through cavities (18) extending from the outside face (16) to the inside face (14), the molding strip (12) extending in a longitudinal direction (X) and presenting both a transverse direction (Y) perpendicular to the longitudinal direction (X), and also a height direction (Z) perpendicular to the longitudinal direction (X) and to the transverse direction (Y). The inside face (14) is configured to press against a molding face (26) of the molding support (24), wherein the inside face (14) of the molding strip (12) and/or the molding face (26) of the molding support (24) includes an array of passages, the array of passages forming vents and connecting together the cavities (18) when the molding strip (12) is pressed against the molding support (24).

A three-dimensional modeled object made of metal including a gas flow path is provided. The gas flow path includes a first structure portion with a lattice structure including a plurality of linear vent holes with a maximum width of equal to or greater than 0.01 mm and equal to or less than 0.10 mm and a frame body portion with a width of equal to or greater than 0.08 mm and equal to or less than 0.25 mm and with a solidification density of equal to or greater than 90%, and has a thickness of equal to or greater than 1 mm and equal to or less than 10 mm.

A three-dimensional modeled object made of metal including a gas flow path is provided. The gas flow path includes a first structure portion with a lattice structure including a plurality of linear vent holes with a maximum width of equal to or greater than 0.01 mm and equal to or less than 0.10 mm and a frame body portion with a width of equal to or greater than 0.08 mm and equal to or less than 0.25 mm and with a solidification density of equal to or greater than 90%, and has a thickness of equal to or greater than 1 mm and equal to or less than 10 mm.

A mold for encapsulating an electrical component. The mold includes an encapsulation chamber and an air inlet. The encapsulation chamber is defined by a housing, an open top, and a solid bottom. The housing includes a solid outer wall, a permeable inner wall, and an air chamber between the solid outer wall and the inner wall. The air inlet is configured to introduce a gas into the air chamber. The encapsulation chamber is sized and shaped to receive the electrical component while leaving a gap for the introduction of encapsulant around the electrical component. The encapsulant may be silicone rubber. To remove an encapsulated electrical component, pressurized air may be introduced through the air inlet into the air chamber, passing through the permeable inner wall, separating the outer surface of the encapsulant from the housing, and allowing the combination casting to be removed from the mold.

A molding apparatus (10) for forming a retaining device. The molding apparatus (10) comprises a molding strip (12) and a molding support (24). The molding strip (12) has an inside face (14), an outside face (16), and a plurality of through cavities (18) extending from the outside face (16) to the inside face (14), the molding strip (12) extending in a longitudinal direction (X) and presenting both a transverse direction (Y) perpendicular to the longitudinal direction (X), and also a height direction (Z) perpendicular to the longitudinal direction (X) and to the transverse direction (Y). The inside face (14) is configured to press against a molding face (26) of the molding support (24), wherein the inside face (14) of the molding strip (12) and/or the molding face (26) of the molding support (24) includes an array of passages, the array of passages forming vents and connecting together the cavities (18) when the molding strip (12) is pressed against the molding support (24).

A molding apparatus (10) for forming a retaining device. The molding apparatus (10) comprises a molding strip (12) and a molding support (24). The molding strip (12) has an inside face (14), an outside face (16), and a plurality of through cavities (18) extending from the outside face (16) to the inside face (14), the molding strip (12) extending in a longitudinal direction (X) and presenting both a transverse direction (Y) perpendicular to the longitudinal direction (X), and also a height direction (Z) perpendicular to the longitudinal direction (X) and to the transverse direction (Y). The inside face (14) is configured to press against a molding face (26) of the molding support (24), wherein the inside face (14) of the molding strip (12) and/or the molding face (26) of the molding support (24) includes an array of passages, the array of passages forming vents and connecting together the cavities (18) when the molding strip (12) is pressed against the molding support (24).

An example system is configured to photocure a photocurable material to form a polymer film. The system includes a first chuck configured to support a first substantially planar mold, a second chuck configured to support a second substantially planar mold, and an actuable stage coupled to the first chuck and/or the second chuck. The actuable stage is configured to position the first chuck and/or the second chuck so that the first and second molds are separated by a gap. The system also includes a sensor arrangement for obtaining measurement information indicative of a distance between the first and second molds and/or a pressure between the first and second chucks at each of at least three locations. The system also includes a control module configured control the gap between the first and second molds based on the measurement information.