A product includes a fine periodic structure having a plurality of projection portions extending parallel to each other in a first direction in each of a first region and a second region adjacent in the first direction on a surface of a substrate. The fine periodic structure formed in an inner portion of the first region and the fine periodic structure formed in an inner portion of the second region are substantially the same periodic structures. End portions of the plurality of projection portions formed in the first region and end portions of the plurality of projection portions formed in the second region are formed in a boundary portion between the first region and the second region.

Surface material of a mold molding surface and surface treatment method. A molding surface of material including metal and in which the molding surface reaches 50° C. or higher during molding is subjected to rapid thermal processing by injecting a substantially spherical shot with a hardness equal to or greater than the surface hardness of the mold and a size of #220 (JIS R6001-1973) or smaller at an injection pressure of 0.2 MPa or more and bombarding the surface with the shot, causing the temperature to rise locally and instantaneously at a bombarded portion to refine the surface structure of the surface and to form numerous smooth arc-shaped indentations on the entire surface of the surface. Then, powder including titanium having size of #100 or smaller is injected at an injection pressure of 0.2 MPa or more to form a coating of titanium oxide on the surface of the surface.

Surface material of a mold molding surface and surface treatment method. A molding surface of material including metal and in which the molding surface reaches 50° C. or higher during molding is subjected to rapid thermal processing by injecting a substantially spherical shot with a hardness equal to or greater than the surface hardness of the mold and a size of #220 (JIS R6001-1973) or smaller at an injection pressure of 0.2 MPa or more and bombarding the surface with the shot, causing the temperature to rise locally and instantaneously at a bombarded portion to refine the surface structure of the surface and to form numerous smooth arc-shaped indentations on the entire surface of the surface. Then, powder including titanium having size of #100 or smaller is injected at an injection pressure of 0.2 MPa or more to form a coating of titanium oxide on the surface of the surface.

A composite manufacturing system and method are provided. The composite manufacturing system comprises a press and a bladder. The press has an upper portion having a desired shape for a composite structure and a lower portion configured to receive layers of composite material. The bladder is associated with the upper portion of the press and is configured to reach a superplastic state when heated such that the bladder forms to the composite structure by applying heat and pressure to the layers of composite material. The bladder cools without appreciable shrinkage, applying a desired amount of pressure to the composite structure during the entire cooling cycle. Once one composite structure is formed using the bladder, the bladder may be reused to form similar structures.

A resin product including an antireflection surface includes a plurality of first concave portions, a plurality of second concave portions, and a component surface. The first concave portions have opening widths equal to or larger than 1 μm and equal to or smaller than 300 μm. The second concave portions are formed on each of the plurality of first concave portions and have opening widths equal to or larger than 10 nm and equal to or smaller than 1 μm. The component surface is configured to surround each of the plurality of first concave portions.

A mold die includes: a mold die body that is configured to hold an object to be molded, the object including a substrate and a chip mounted in a central area of the substrate, and that has a cavity which is rectangular in a plan view and which is configured to receive a resin material, the mold die body including: a pot for containing the resin material; a gate disposed at one side of the cavity and configured to allow the resin material to flow into the cavity; and a flow-path restricting mechanism that is disposed on both lateral sides of the cavity that are perpendicular to the one side and that is configured to narrow lateral flow paths, the lateral flow paths being flow paths for the resin material flowing through the cavity in which the chip is not disposed.

A mold die includes: a mold die body that is configured to hold an object to be molded, the object including a substrate and a chip mounted in a central area of the substrate, and that has a cavity which is rectangular in a plan view and which is configured to receive a resin material, the mold die body including: a pot for containing the resin material; a gate disposed at one side of the cavity and configured to allow the resin material to flow into the cavity; and a flow-path restricting mechanism that is disposed on both lateral sides of the cavity that are perpendicular to the one side and that is configured to narrow lateral flow paths, the lateral flow paths being flow paths for the resin material flowing through the cavity in which the chip is not disposed.

The present invention relates to a preparation method for a microneedle patch. Specifically, the present invention provides a preparation method for a microneedle patch, and the method comprises steps: (1) milling a base into a master mold of the microneedle patch; (2) conducting surface treatment on the master mold, to obtain the treated master mold; (3) conducting reverse molding on a surface of the treated master mold, conducting deaeration, curing, and demolding, to obtain the cured daughter mold; and (4) casting the modification solution on the surface of the daughter mold, and then conducting deaeration, drying and curing, to obtain the microneedle patch. The method for preparing the microneedle patch in the present invention can greatly reduce the milling difficulty, and save the milling cost and time. The microneedle molds with different aspect ratios, areas and shapes can also be prepared as required, following with reverse molding to diverse microneedle patches. Therefore, a feasible implementation scheme is provided in present invention for the production application of the microneedles and the feasibility of the wide application is greatly enhanced.

A head mold for a wig may include a head mold body and an information pattern. The head mold body may be formed using a stack type three-dimensional (3D) printer into which head information of a user may be inputted. The information pattern may be provided to the head mold body to indicate information of the wig. The head mold may be manufactured using the stack type 3D printer to prevent a generation of dusts during manufacturing the head mold. Further, the stack type 3D printer may have a low price compared to a milling machine to reduce an initial investment cost for manufacturing the head mold.

A method of designing a package configured to securely accommodate one of two or more differently shaped objects. The method comprises: establishing a predetermined orientation for each of the two or more differently shaped objects relative to common axes; identifying dimensionally common points of the two or more differently shaped objects; and developing a design for a package configured to constrain the two or more differently shaped objects at the identified dimensionally common points.