In manufacturing a magnet embedded core, creation of flash, and problems associated with flash are prevented. A device for manufacturing the magnet embedded core comprises a base (32) comprising an upper surface at which a resin pot chamber (64) for storing molten resin opens, a separator plate (36) detachably placed on the upper surface of the base (32) to support a rotor core (2) thereon and having a gate (50) and a cull opening (52) communicating the magnet insertion hole (4) of the rotor core (2) with the resin pot chamber (64), and a plunger (62) movably provided in the resin pot chamber (64) to press the molten resin in the resin pot chamber (64) into the magnet insertion hole (4) via the gate (50) and the cull opening (52), wherein an annular recess (66) is formed on the upper surface of the base (32) so as to extend outward of the resin pot chamber (64) and communicate with the resin pot chamber (64).

Provided is a method for manufacturing a fiber reinforced resin molded article capable of effectively suppressing formation of a weld line, and such a manufacturing device thereof. Even with multiple gates (resin inlets), resin is poured from a second gate (second resin inlet) when resin flow is detected at the second gate (second resin inlet), and then the resin poured from a first gate (first resin inlet) and the resin poured from the second gate (second resin inlet) are made smoothly meet.

Provided is a method for manufacturing a fiber reinforced resin molded article capable of effectively suppressing formation of a weld line, and such a manufacturing device thereof. Even with multiple gates (resin inlets), resin is poured from a second gate (second resin inlet) when resin flow is detected at the second gate (second resin inlet), and then the resin poured from a first gate (first resin inlet) and the resin poured from the second gate (second resin inlet) are made smoothly meet.

A mold die includes: a mold die body that is configured to hold an object to be molded, the object including a substrate and a chip mounted in a central area of the substrate, and that has a cavity which is rectangular in a plan view and which is configured to receive a resin material, the mold die body including: a pot for containing the resin material; a gate disposed at one side of the cavity and configured to allow the resin material to flow into the cavity; and a flow-path restricting mechanism that is disposed on both lateral sides of the cavity that are perpendicular to the one side and that is configured to narrow lateral flow paths, the lateral flow paths being flow paths for the resin material flowing through the cavity in which the chip is not disposed.

A semiconductor module includes a substrate, a semiconductor die arranged on the substrate, at least one first bond wire loop, wherein both ends of the at least one first bond wire loop are arranged on and coupled to a first electrode of the semiconductor die, and a molded body encapsulating the semiconductor die, wherein a top portion of the at least one first bond wire loop is exposed from a first side of the molded body.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

According to one embodiment, a mold includes a substrate clamping surface, a cavity, a suction part, a vent, an intermediate cavity, and an opening/closing part. The substrate clamping surface contacts a surface of a processing substrate. The cavity is recessed from the substrate clamping surface. The suction part is recessed from the substrate clamping surface. The vent is provided on a path between the cavity and the suction part, communicates with the cavity, is recessed from the substrate clamping surface to a vent depth. The intermediate cavity is provided between the vent and the suction part on the path, communicates with the vent, and is recessed from the substrate clamping surface to an intermediate cavity depth deeper than the vent depth. The opening/closing part opens and closes the path and is provided between the intermediate cavity and the suction part on the path.

The present disclosure relates to a modular mat system. More particularly, the disclosure is directed to a modular mat system with that may be built out using common pieces of mats. Specifically, a modular mat system with a mat piece with a top plate with inserts, a bottom plate with a plurality of tabs and recesses operative to engage with further mat pieces to build a mat system is discussed. The modular mat system is operative to remove water and other detritus from shoes of a user or other such platform moving across the mat system and feed it to a perimeter drain below the system.

The present disclosure relates to a modular mat system. More particularly, the disclosure is directed to a modular mat system with that may be built out using common pieces of mats. Specifically, a modular mat system with a mat piece with a top plate with inserts, a bottom plate with a plurality of tabs and recesses operative to engage with further mat pieces to build a mat system is discussed. The modular mat system is operative to remove water and other detritus from shoes of a user or other such platform moving across the mat system and feed it to a perimeter drain below the system.

The present disclosure relates to a modular mat system. More particularly, the disclosure is directed to a modular mat system with that may be built out using common pieces of mats. Specifically, a modular mat system with a mat piece with a top plate with inserts, a bottom plate with a plurality of tabs and recesses operative to engage with further mat pieces to build a mat system is discussed. The modular mat system is operative to remove water and other detritus from shoes of a user or other such platform moving across the mat system and feed it to a perimeter drain below the system.