The present disclosure relates to a modular mat system. More particularly, the disclosure is directed to a modular mat system with that may be built out using common pieces of mats. Specifically, a modular mat system with a mat piece with a top plate with inserts, a bottom plate with a plurality of tabs and recesses operative to engage with further mat pieces to build a mat system is discussed. The modular mat system is operative to remove water and other detritus from shoes of a user or other such platform moving across the mat system and feed it to a perimeter drain below the system.

A multilayer core molding method includes an upstream process of molding using an upstream process molding apparatus, which includes a first upstream process mold including a first upstream process mold cavity surface, and a second upstream process mold including a second upstream process mold cavity surface. The upstream process includes an inner core arrangement step and a covering step to obtain an intermediate molded body, which includes the inner core, and the unvulcanized or semi-vulcanized first outer core material covering only part of a surface of the inner core and integrated with the inner core.

A heating apparatus for heating an object having a cylindrical outer peripheral surface includes: a support member for supporting the object to be heated; a covering member movable in the vertical directions relative to the support member and having inner wall surfaces with an open lower end, the inner wall surfaces defining an accommodation space for accommodating the object to be heated; the covering member closing the accommodation space when the covering member is disposed on the support member; the covering member allowing loading or unloading of the object to be heated when the covering member is separated from the support member; and a plurality of ring-shaped light sources each provided to surround the cylindrical outer peripheral surface of the object to be heated and arranged in the vertical direction in the accommodation space and radiating light for heating the object to be heated.

An apparatus for molding a part includes a plunger cavity, a plunger, and a mold cavity, wherein the plunger is oriented out-of-plane with respect to a major surface of the mold cavity, and first and second vents couples to respective first and second portions of the mold cavity. In a method, resin and fiber are forced into the mold cavity from a plunger cavity, and at least some of the fibers and resin are preferentially flowed to certain region in the mold cavity via the use of vents.

A foam molding apparatus and a foam molding method thereby are proposed. The foam molding apparatus includes a foaming agent supply unit configured to supply a foaming agent, a molten resin supply unit configured to supply molten resin, a fixed mixing unit configured to produce a foaming resin-critical solution by mixing a foaming agent supplied from the foaming agent supply unit and molten resin supplied from the molten resin supply unit through a rod-shaped body, and a molding unit configured to mold a foam molding product using the foaming resin-critical solution supplied from the fixed mixing unit. Accordingly, it is possible to produce a foaming resin-critical solution by uniformly mixing a large amount of high-viscosity gel-state molten resin and a high-pressure compressed and low-viscosity foaming agent, using high-strength multiple channels.

A heating apparatus for heating an object having a cylindrical outer peripheral surface includes: a support member for supporting the object to be heated; a covering member movable in the vertical directions relative to the support member and having inner wall surfaces with an open lower end, the inner wall surfaces defining an accommodation space for accommodating the object to be heated; the covering member closing the accommodation space when the covering member is disposed on the support member; the covering member allowing loading or unloading of the object to be heated when the covering member is separated from the support member; and a plurality of ring-shaped light sources each provided to surround the cylindrical outer peripheral surface of the object to be heated and arranged in the vertical direction in the accommodation space and radiating light for heating the object to be heated.

The device for feeding molten plastic material into a molding cavity (30) includes a melting chamber (20) in which metered solid plastic material is introduced, a sonotrode (10) provided for tightly inserting a portion thereof into said melting chamber (20), causing the plastic material to melt by means of vibration, and relative movement of the sonotrode (10) and melting chamber (20) allows driving the molten plastic material inside a molding cavity (30) communicated with said melting chamber (20), the device including resistance sensors (40) allowing an electronic control device (50) to know the resistance that the plastic material has against the movement of the sonotrode (10).

The present invention is intended to prevent resin from sticking to a molding surface of a first molding die that holds an object to be molded, without using a release film, and is a resin molding apparatus that performs resin molding on the object to be molded, the resin molding apparatus including: a first molding die that holds the object to be molded; a second molding die that is provided in a manner facing the first molding die and that has a cavity for holding resin material; and a cover plate that is provided between the object to be molded and the first molding die, that covers a molding surface of the first molding die, and that has rigidity for maintaining its own shape.

Disclosed is a technique capable of preventing an encapsulating material from covering a heat-dissipating surface of a semiconductor module, which releases heat of a switching element. Specifically disclosed a step for manufacturing a semiconductor module including a submodule having a collector and an emitter with heat-dissipating surfaces, including a step for placing the submodule in the cavity so that the submodule is pressed by the pressing device while covering the heat-dissipating surface of the emitter with the pressing device and covering the heat-dissipating surface of the collector with the lower mold, and a step for feeding the encapsulating material to the cavity by moving the piston so that the pressure of the cavity measured by the pressure measuring device does not exceed the pressure at which the pressing device presses the submodule.

Disclosed is a technique capable of preventing an encapsulating material from covering a heat-dissipating surface of a semiconductor module, which releases heat of a switching element. Specifically disclosed a step for manufacturing a semiconductor module including a submodule having a collector and an emitter with heat-dissipating surfaces, including a step for placing the submodule in the cavity so that the submodule is pressed by the pressing device while covering the heat-dissipating surface of the emitter with the pressing device and covering the heat-dissipating surface of the collector with the lower mold, and a step for feeding the encapsulating material to the cavity by moving the piston so that the pressure of the cavity measured by the pressure measuring device does not exceed the pressure at which the pressing device presses the submodule.