The present invention relates to a mould for encapsulating a carrier with electronic components, comprising: at least two mould parts, one of which with at least one mould cavity recessed into a contact side for enclosing electronic components placed on a carrier, and a feed channel for moulding material recessed into the contact surface of the mould part provided with the mould cavity. The invention also relates to a moulding apparatus, a method for at least partially encapsulating a carrier with electronic components and a carrier with electronic components encapsulated with moulding material.

The present invention relates to a mould for encapsulating a carrier with electronic components, comprising: at least two mould parts, one of which with at least one mould cavity recessed into a contact side for enclosing electronic components placed on a carrier, and a feed channel for moulding material recessed into the contact surface of the mould part provided with the mould cavity. The invention also relates to a moulding apparatus, a method for at least partially encapsulating a carrier with electronic components and a carrier with electronic components encapsulated with moulding material.

The invention provides a method for preparing a fiber-reinforced part based on cyanate ester or a cyanate ester/epoxy blend, comprising the steps of (i) providing a liquid mixture comprising (a) from 15 to 99.9 wt. % of at least one di- or polyfunctional cyanate ester, (b) from 0 to 84.9 wt. % of at least one di- or polyfunctional epoxy resin, and (c) from 0.1 to 25 wt. % of a metal-free catalyst; (ii) providing a fiber structure (iii) placing said fiber structure in a mold or in a substrate, (iv) impregnating said fiber structure with said liquid mixture, (v) curing said liquid mixture by applying a temperature of 30 to 300° C. Using the method of the invention it is possible to produce in a short cycle time, using composite manufacturing processes such as resin transfer molding and infusing technology, fiber reinforced composite parts based on a cyanate ester or cyanate ester/epoxy resin formulation. The fiber-reinforced parts obtainable by the above method are also an object of the invention.

The invention provides a method for preparing a fiber-reinforced part based on cyanate ester or a cyanate ester/epoxy blend, comprising the steps of (i) providing a liquid mixture comprising (a) from 15 to 99.9 wt. % of at least one di- or polyfunctional cyanate ester, (b) from 0 to 84.9 wt. % of at least one di- or polyfunctional epoxy resin, and (c) from 0.1 to 25 wt. % of a metal-free catalyst; (ii) providing a fiber structure (iii) placing said fiber structure in a mold or in a substrate, (iv) impregnating said fiber structure with said liquid mixture, (v) curing said liquid mixture by applying a temperature of 30 to 300° C. Using the method of the invention it is possible to produce in a short cycle time, using composite manufacturing processes such as resin transfer molding and infusing technology, fiber reinforced composite parts based on a cyanate ester or cyanate ester/epoxy resin formulation. The fiber-reinforced parts obtainable by the above method are also an object of the invention.

A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

A molding apparatus is configured for molding a semiconductor device and includes a lower mold and an upper mold. The lower mold is configured to carry the semiconductor device. The upper mold is disposed above the lower mold for receiving the semiconductor device and includes a mold part and a dynamic part. The mold part is configured to cover the upper surface of the semiconductor device. The dynamic part is disposed around a device receiving region of the upper mold and configured to move relatively to the mold part. A molding method and a molded semiconductor device are also provided.

In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.

The molding material of the present invention contains (A) resin and (B) filler, in which provided that a total amount of the molding material is 100 parts by volume, a content of the (B) filler is equal to or greater than 35 parts by volume and equal to or less than 80 parts by volume, the (B) filler contains (B1) fibrous filler and (B2) spherical filler, provided that a total amount of the (B) filler is 100 parts by volume, a content of the (B2) spherical filler is equal to or greater than 40 parts by volume and equal to or less than 95 parts by volume, and provided that a number-average fiber diameter of the (B1) fibrous filler is d, an average particle size of the (B2) spherical filler is within a range of equal to or greater than 2.5 d and equal to or less than 6.5 d.

The molding material of the present invention contains (A) resin and (B) filler, in which provided that a total amount of the molding material is 100 parts by volume, a content of the (B) filler is equal to or greater than 35 parts by volume and equal to or less than 80 parts by volume, the (B) filler contains (B1) fibrous filler and (B2) spherical filler, provided that a total amount of the (B) filler is 100 parts by volume, a content of the (B2) spherical filler is equal to or greater than 40 parts by volume and equal to or less than 95 parts by volume, and provided that a number-average fiber diameter of the (B1) fibrous filler is d, an average particle size of the (B2) spherical filler is within a range of equal to or greater than 2.5 d and equal to or less than 6.5 d.

The present invention relates to a process for the production of reinforced plastics components. The process includes a) provision of at least one reinforcing material in a cavity of a molding device, b) provision of at least one starting material in a container, c) insertion of the container into the molding device, d) introduction of the at least one starting material from the container into the cavity, wherein the at least one starting material penetrates at least to some extent through the at least one reinforcing material, e) hardening of the at least one starting material with the at least one reinforcing material to give a reinforced plastics component, and f) demolding of the reinforced plastics component. The invention further relates to a device and to an assembly for the production of reinforced plastics components.