The present disclosure relates to a system for manufacturing a hybrid component including a first thermal supplier configured to heat a steel plate, a rolling roll for undercut configured to pressurize the steel plate heated by the first thermal supplier, and to form an undercut on one surface of the steel plate, a first molding roll configured to pressurize the steel plate formed with the undercut to mold the steel plate in a shape of a component to be manufactured, a composite material feeder configured to supply a composite material tape to be seated on one surface of the steel plate formed with the undercut through the first molding roll, and a composite material pressurization roll configured to pressurize the steel plate on which the composite material tape is seated.

Provided are devices and methods of applying a film (120) to a first panel of a vehicle wherein the first panel is connected to a second panel of the vehicle by a joint area containing a ditch portion (52) that is recessed relative to the first panel. The method includes the steps of placing into the ditch portion (52) an elongated jig (100) that comprises a shim (102) extending continuously along the length of the ditch portion (52), the shim (102) protruding above a height of the first panel, applying the film (120) to the first and second panels such that the film (120) extends over the elongated jig (100), and then using a tool (122) to apply pressure against the film (120) and toward a cutting edge of the shim (102) along the length of the shim (102) to trim the film (120) along a peripheral edge. The elongated jig (100) can then be removed from the ditch portion (52), and the peripheral edge of the film (120) adhered to the ditch portion (52).

A mold release composition is provided contains a minimum of three reactive moieties per molecule to provide for both mold adhesion and crosslink density. The composition is soluble in a VOC-free organic solvent or water, alone or with resort to an emulsifier. The composition can be used as a semi-permanent mold release in some embodiments.

A mold release composition is provided contains a minimum of three reactive moieties per molecule to provide for both mold adhesion and crosslink density. The composition is soluble in a VOC-free organic solvent or water, alone or with resort to an emulsifier. The composition can be used as a semi-permanent mold release in some embodiments.

A method of applying protective sheeting of polymer material to a pipeline extending along a longitudinal axis and having a cutback bounded at opposite axial ends by two end portions of respective protective coatings of polymer material, the method including directly heating the free faces of the end portions; extruding and simultaneously winding about the pipeline a protective sheeting wide enough to cover the cutback and the end portions; and compressing the protective sheeting against the pipeline, the end portions included.

A method of applying protective sheeting of polymer material to a pipeline extending along a longitudinal axis and having a cutback bounded at opposite axial ends by two end portions of respective protective coatings of polymer material, the method including directly heating the free faces of the end portions; extruding and simultaneously winding about the pipeline a protective sheeting wide enough to cover the cutback and the end portions; and compressing the protective sheeting against the pipeline, the end portions included.

Disclosed herein are exemplary embodiments of linings, liners, and methods of providing a liner or lining for a tank. An exemplary embodiment includes a method of providing a liner or lining for a tank. In this exemplary embodiment, the method includes extrusion welding a pair of sheets together by infusing a molten thermoplastic material along an interface and within a gap between the pair of sheets. The method also includes extrusion welding the pair of sheets to a bottom sheet by infusing the molten thermoplastic material along and between the pair of sheets and the bottom sheet.

A mold release composition is provided contains a minimum of three reactive moieties per molecule to provide for both mold adhesion and crosslink density. The composition is soluble in a VOC-free organic solvent or water, alone or with resort to an emulsifier. The composition can be used as a semi-permanent mold release in some embodiments.

A mold release composition is provided contains a minimum of three reactive moieties per molecule to provide for both mold adhesion and crosslink density. The composition is soluble in a VOC-free organic solvent or water, alone or with resort to an emulsifier. The composition can be used as a semi-permanent mold release in some embodiments.

A production line for producing components to a high standard of cleanliness and sealed and protected in that state includes a loading device, a cleaning device, a detecting device, a pasting device, a heat-sealing device, a packing device, and transfer devices of the production line. The production line automatically processes the components for obtaining components with the high cleanliness. By the processes of protective film pasting, heat-sealing, and packing, the components may be further protected from subsequent pollution. A method for producing components with a high cleanliness applied to the production line is also disclosed.