B29C65/02

Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same

The present invention relates to a method for manufacturing an insulating layer for a semiconductor package which can improve reliability and have excellent heat resistance by removing pores generated in the insulating layer during manufacture of an insulating layer for a semiconductor package using magnetic characteristics, and an insulating layer for a semiconductor package obtained using the method for manufacturing the insulating layer for a semiconductor package.

Method for manufacturing insulating layer for semiconductor package and insulating layer for semiconductor package using the same

The present invention relates to a method for manufacturing an insulating layer for a semiconductor package which can improve reliability and have excellent heat resistance by removing pores generated in the insulating layer during manufacture of an insulating layer for a semiconductor package using magnetic characteristics, and an insulating layer for a semiconductor package obtained using the method for manufacturing the insulating layer for a semiconductor package.

Protective gloves and method of making protective gloves
11589627 · 2023-02-28 · ·

A protective guard for a hand, finger or thumb includes a first thermoplastic layer heat welded to second thermoplastic layer. The second thermoplastic layer has a thickness that is greater than the thickness of the first thermoplastic layer.

Method for monitoring the function of a tubular bag machine
11504919 · 2022-11-22 · ·

A method for monitoring a tubular bag machine having a drive control system and independently controlled electronic drive units controlled by a drive control system for driving functional elements of the packing machine in a cycle time-synchronous manner in predefined motion sequences, one drive unit being a transverse sealing unit with a drive motor and two transverse sealing jaws for transversely sealing a film tube, and the drive motor torque measured using a drive controller, and the drive motor position measured using a position sensor, the method including moving the film tube into the sealing zone between the transverse sealing jaws, closing the jaws according to a predefined target torque stored in the drive control system, measuring the actual position of the drive motor upon reaching the target torque, and comparing the measured position to a target position stored in the drive control system associated with the predefined target torque.

Polymer Composite Layered Structure And Melt Functional Fastener
20220363016 · 2022-11-17 · ·

An article is formed by joining two or more layers in a stable structure, containing at least one composite layer that can be melted, with tensile and shear strength. The article is assembled by one or more mechanical fasteners and melt adhesion regions.

Method for discrete assembly of cuboctahedron lattice materials

A method for the design, manufacture, and assembly of modular lattice structures composed of cuboctahedron unit cells.

Method for discrete assembly of cuboctahedron lattice materials

A method for the design, manufacture, and assembly of modular lattice structures composed of cuboctahedron unit cells.

Microchip affixing probe and method of use

Provided among other things is a method of affixing a small, single chip to a plastic item, the chip having a top surface having length and width dimensions, and having a height, the method comprising: (1) vacuum adhering a top-oriented surface of the chip to a probe of outer dimensions comparable to or smaller than those of the length and width; (2) conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; (3) applying via the probe the chip to the plastic such that the chip embeds in the plastic; and (4) releasing the chip from the probe, wherein the largest of the length and width is about 500 microns or less, and height is no more than about the smallest of length and width.

Microchip affixing probe and method of use

Provided among other things is a method of affixing a small, single chip to a plastic item, the chip having a top surface having length and width dimensions, and having a height, the method comprising: (1) vacuum adhering a top-oriented surface of the chip to a probe of outer dimensions comparable to or smaller than those of the length and width; (2) conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; (3) applying via the probe the chip to the plastic such that the chip embeds in the plastic; and (4) releasing the chip from the probe, wherein the largest of the length and width is about 500 microns or less, and height is no more than about the smallest of length and width.

Pipe Fusion Machine
20230095782 · 2023-03-30 ·

One fusion machine can butt or socket fuse polyolefin pipes and fittings in straight alignment or at inwardly or outwardly mitered universal angles from 0° to 45° for butt fusion and from 0° to 10° for socket fusion. The machine is manually driven, hydraulically monitored and operated in all configurations from one side of the machine.