B29D11/00663

Method and device for producing microstructures on optical fibers

The invention relates to a method and a device for producing at least one microstructure (5) on an axial end (1a) of an optical fiber (1). The method comprises the following steps: providing (S10) the optical fiber (1); wetting (S20) the axial end (1a) of the optical fiber (1) with photoresist (2); orienting (S30) the optical fiber (1) and a writing beam of a 3D printer with respect to one another; forming (S40) the at least one microstructure (5) by exposing the photoresist (2) to light with the aid of the 3D printer.

Microlayer coextrusion of optical end products

The disclosed embodiments generally relate to extruding multiple layers of micro- to nano-polymer layers in a tubular shape. In particular, the aspects of the disclosed embodiments are directed to a method for producing a Bragg reflector comprising co-extrusion of micro- to nano-polymer layers in a tubular shape.

Passive RF device including first and second core parts configured to be joined at mounting faces to each other by using an alignment pin and glue
10868348 · 2020-12-15 · ·

A passive radiofrequency device includes a core formed by the gluing of multiple parts in direct contact against one another. At least one of the parts includes a housing for glue. At least some of the parts are manufactured individually by additive manufacturing. A conductive metal jacket surrounds the core without separating the parts from one another.

OPTICAL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

An optical semiconductor device includes a semiconductor substrate, a first semiconductor layer provided on the semiconductor substrate, and a mesa waveguide provided on the principal surface of the first semiconductor layer. The semiconductor device also includes a buried layer covering the upper surface of the first semiconductor layer. Part of the upper surface of the first semiconductor layer is exposed. A mesa structure provided at the boundary between a part of the first semiconductor layer is covered with the buried layer and a part of the first semiconductor layer is exposed. One side of the mesa structure is covered with the buried layer, and the other side is exposed. The optical semiconductor device can reduce the generation of stress in the buried layer, for example, to suppress the occurrence of cracks in the buried layer and enhance the reliability.

Illumination unit and endoscope

An illumination unit includes a light guide and a light converter. Wettability which a distal end side surface of the light guide has for an enclosing member of the light converter is lower than wettability which a distal end face has for the enclosing member.

HIGH-THROUGHPUT MANUFACTURING OF PHOTONIC INTEGRATED CIRCUIT (PIC) WAVEGUIDES USING MULTIPLE EXPOSURES

In accordance with a method of forming a waveguide in a polymer film disposed on a substrate, a plurality of regions on a polymer film are selectively exposed to a first dosage of radiation. The polymer film is formed from a material having a refractive index that decreases by exposure to the radiation and subsequent heating. At least one region of the polymer film that was not previously exposed to the radiation is selectively exposing to a second dosage of radiation. The second dosage of radiation is less than the first dosage of radiation. The polymer film is heated to complete curing of the polymer film.

Laminate of optical elements having a layer of a pressure-sensitive adhesive, and a method for producing such laminate of optical elements

A laminate of optical elements comprises a transparent first optical element, a second optical element, and a transparent pressure-sensitive adhesive layer for bonding the first optical element to the second optical element. The pressure-sensitive adhesive layer comprises a base adhesive zone, a transparent refractive index-adjusting zone. The base adhesive zone is made essentially of a transparent base pressure-sensitive adhesive material and formed over a given range from a first principal surface of the pressure-sensitive adhesive layer facing the first optical element, in a thickness direction of the pressure-sensitive adhesive layer. The a transparent, adherent, refractive index-adjusting zone is formed over a given range from a second principal surface of the pressure-sensitive adhesive layer facing the second optical element.

METHOD OF MANUFACTURING MOLD SUBSTRATE FOR DIFFRACTION LATTICE LIGHT GUIDE PLATE, AND METHOD OF MANUFACTURING DIFFRACTION LATTICE LIGHT GUIDE PLATE

The present invention relates to a method of manufacturing a mold substrate for a diffraction lattice light guide plate, and a method of manufacturing a diffraction lattice light guide plate.

Method for manufacturing bent optical fiber
10836672 · 2020-11-17 · ·

Provided is a method for manufacturing bent optical fibers with which bent optical fibers having a quality difference effectively reduced can be manufactured without a reduction of the manufacturing yield. In the present embodiment, an elastic bending process and a heating process are alternately repeated. In the elastic bending process, a movement restricting member rotatable around a revolving shaft is rotated while an optical fiber having its leading end portion held by the movement restricting member is fed toward the revolving shaft to form bent portions at a part of the optical fiber. In the heating process, the optical fiber is irradiated with a laser beam to relieve stress at the bent portions. Thus, multiple bent portions at which the stress is relieved are formed in the optical fiber along the longitudinal direction of the optical fiber.

Method for encapsulating a light-guide optical element in a transparent capsule

Method for encapsulating at least partly a light-guide optical element in a transparent capsule, the method comprising at least: a transparent capsule providing step during which a transparent capsule is provided, a light-guide optical element providing step during which a light-guide optical element is provided, an adhesive deposing step during which an adhesive is deposited on at least part of a face of the transparent capsule and/or of a face of the light-guide optical element, a positioning step during which the transparent capsule and the light-guide optical element are positioned one relative to the other so as to form an optical system, a bonding step during which the light-guide optical element and the transparent capsule are made integral with the adhesive, wherein the method further comprises prior to the bonding step a control step during which at least one parameter of the optical system is controlled.