A method of manufacturing a dual-cured polymer component includes additively manufacturing a green state component from a liquid photopolymerizable material; and dual post-curing the green state component by UV curing and thermal curing such that the dual-cured component is formed. The liquid photopolymerizable material has a composition includes an oligomer with a glass transition temperature greater than about 100 C., a monomer, and a photoinitiator. The thermal curing step is completed in a nitrogen environment to a temperature greater than the glass transition temperature of the oligomer. The dual-cured component has a heat deflection temperature between about 100 C. and 250 C. and an elongation at break between about 5% and 20%.

The present invention relates to radiation of dual radiation/moisture curable compositions based on (meth)acrylate- and silane-terminated polymers that can be used as 3D printing materials and provide isotropic and elastomeric properties. The invention further relates to the use thereof as 3D printing materials and printing methods using said compositions.

The present invention relates to a composition for injection molding, comprising Polyamide 6; and an inorganic nucleation agent. The present invention also provides an injection molded accessory, such as a button, a zipper puller, a buckle, a cord lock, a cord end, and a stopper, comprising the composition. The present invention also provides a method for preparing an article, such as an accessory, comprising injection molding of the composition.

An object of the present invention is to provide a polyphenylene ether melt extrusion formed body which can be obtained by melt forming without mixing other resin components and has excellent properties such as mechanical strength, and a method for producing the same. The present invention relates to a polyphenylene ether melt extrusion formed body comprising a polyphenylene ether component which has a rearrangement structure having a continuous structure bonded at an ortho-position in a repeating unit continuously bonded at a para-position.

The present disclosure is directed to providing a thermoplastic resin composition that serves as a material for a component for a telecommunication apparatus with excellent performance as an antenna and that exhibits excellent antenna performance regardless of injection molding conditions, particularly when injection molding is performed at high temperatures. The present disclosure contains a polyphenylene ether-based resin and a laser direct structuring additive (LDS additive), wherein the inter-particle distance of the LDS additive is 2.2 to 3.2 m, the Vicat softening temperature is 90 C. or higher, and the water absorption rate is 1.5% or less.