Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compression molding. The electrical circuit is disposed in a composite ply, in a lay-up of composite plies, and electrical leads are routed through the composite plies so that the lead are accessible in the molded fiber-composite part.

The invention relates to cross-linkable thermoplastics, processes of making such cross-linkable thermoplastics and products comprising such cross-linkable thermoplastics. Such cross-linkable thermoplastics provide articles made by the additive manufacturing (AM) process with increased strength, the desired in use temperature stability and the desired thermo-oxidative stability.

A composite structure is fabricated using a preform comprising a stack of unidirectional prepreg plies that are stitched together. During curing of the prepreg, the stitches melt and dissolve.

A composite structure is fabricated using a preform comprising a stack of unidirectional prepreg plies that are stitched together. During curing of the prepreg, the stitches melt and dissolve.

A composite structure is fabricated using a preform comprising a stack of unidirectional prepreg plies that are stitched together. During curing of the prepreg, the stitches melt and dissolve.

A composite structure is fabricated using a preform comprising a stack of unidirectional prepreg plies that are stitched together. During curing of the prepreg, the stitches melt and dissolve.

A method of assembling a first part made from a metal and a second part includes providing a first part comprising an assembly surface, and a second part comprising at least one through orifice. At least part of the second part is arranged on the assembly surface such that the orifice extends across from the assembly surface. A metal connecting part is positioned on the orifice to cover the orifice across from the assembly surface. The connecting part and/or the assembly surface are projected on one another to obtain high-speed plating and welding between the connecting part and the surface part.

A method of assembling a first part made from a metal and a second part includes providing a first part comprising an assembly surface, and a second part comprising at least one through orifice. At least part of the second part is arranged on the assembly surface such that the orifice extends across from the assembly surface. A metal connecting part is positioned on the orifice to cover the orifice across from the assembly surface. The connecting part and/or the assembly surface are projected on one another to obtain high-speed plating and welding between the connecting part and the surface part.

A method for making a carbon nanotube composite structure is related. A substrate having a first surface is provided. A carbon nanotube structure including a plurality of carbon nanotubes is placed on the first surface, wherein the plurality of carbon nanotubes is in direct contact with the first surface. A monomer solution is coated to the carbon nanotube structure, wherein the monomer solution is formed by dispersing a monomer into an organic solvent. The monomer is polymerized, and then the substrate is removed.

A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature.