A housing comprising a ceramic material to which a plastic layer is firmly bonded includes a substrate, a plastic member, and a porous layer. The porous layer is pitted and formed between the substrate and the plastic member by coating and sintering a porous ceramic slurry on a surface of the ceramic substrate. The present disclosure also provides a method for manufacturing the housing.

A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

A piston for a heavy duty diesel engine including a composite layer forming at least a portion of a combustion surface is provided. The composite layer has a thickness greater than 500 microns and includes a mixture of components typically used to form brake pads, such as a thermoset resin, an insulating component, strengthening fibers, and an impact toughening additive. According to one example, the thermoset resin is a phenolic resin, the insulating component is a ceramic, the strengthening fibers are graphite, and the impact toughening additive is an aramid pulp of fibrillated chopped synthetic fibers. The composite layer also has a thermal conductivity of 0.8 to 5 W/m.Math.K. The body portion of the piston can include an undercut scroll thread to improve mechanical locking of the composite layer. The piston can also include a ceramic insert between the body portion and the composite layer.

According to one example, a ceramic housing for an electronic device includes a surface and an elastomer, where the elastomer covers from ten percent to eighty-five percent of a total surface area of the surface.

A composite structure for stab protection includes layers of flat structures placed on top of each other, and an embedding material, wherein, in at least some of the layers placed on top of each other, the flat structures of adjacent layers are offset relative to one another, the flat structures of the composite structure are at least partially embedded in the embedding material, and the composite structure includes separated connecting elements, wherein before they are separated, the separated connecting elements have connected at least some of the flat structures of adjacent layers with one another.

The invention relates to an anchoring element for a dental prosthetic arrangement, which anchoring element can be anchored in a jaw bone or implant in a first subregion (TB1) and is suitable for receiving or forming a dental prosthetic element (ZK) in a second subregion (TB2), wherein the anchoring element has, between the first subregion (TB1) and the second subregion (TB2), a radially projecting collar (KR) which at least partially encloses the circumference of the anchoring element, such that the region above the collar (KR) of the anchoring element is at least in part fully covered with a thermoplastic material. The invention further relates to a method for producing an abutment or implant, and to a method for producing a dental prosthetic arrangement using the abutment.

A chassis defines a system housing that houses a processing system and a display system. A chassis wall provided on the chassis includes a first carbon fiber layer that provides an outer surface of the chassis that is located opposite the chassis wall from the housing and a ceramic layer that is bonded to the first carbon fiber layer and located opposite the first carbon fiber layer from the outer surface. The ceramic layer provides additional stiffness to the chassis wall to resist deflection of the chassis wall into at least one of the display system and the processing system in response to a force. The chassis wall may include a second carbon fiber layer that is bonded to the ceramic layer and located opposite the ceramic layer from the first carbon fiber layer to provide an inner surface of the chassis wall.

A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.

A composite material forming device includes a pressurizing unit, heating unit, a movement mechanism, and a control unit. The device processes a composite material in which reinforced fibers have been impregnated with a thermosetting resin from a softened state or semi-cured state into a cured state while forming the composite material into a prescribed size and prescribed shape. The pressurizing unit applies pressure to a prescribed region of the composite material. The heating unit applies a magnetic field to the prescribed region of the composite material to which pressure has been applied by the pressurizing unit, thereby heating a prescribed region of the composite material. The movement mechanism causes the pressurization region and heating region to synchronously move by simultaneously changing the position of a first member relative to the composite material and the position of the heating unit relative to the composite material.

A ceramic and plastic composite and a method for fabricating the same are disclosed. A chemical cleaning treatment, a microetching treatment, a hole reaming treatment, and a surface activating treatment are performed on the surface of a ceramic matrix to form nanoholes with an average diameter ranging between 150 nm and 450 nm. Plastics are injected onto the surface of the baked ceramic matrix to form a plastic layer. The plastic layer more deeply fills the nanoholes to have higher adhesion. Thus, the higher combined strength and air tightness exist between the ceramic matrix and the plastic layer to improve the reliability and the using performance of the ceramic and plastic composite.