B29K2827/12

Method for three-dimensional fabrication

A method of forming a three-dimensional object, is carried out by (a) providing a carrier and a build plate, the build plate comprising a semipermeable member, the semipermeable member comprising a build surface with the build surface and the carrier defining a build region therebetween, and with the build surface in fluid communication by way of the semipermeable member with a source of polymerization inhibitor; (b) filling the build region with a polymerizable liquid, the polymerizable liquid contacting the build surface, (c) irradiating the build region through the build plate to produce a solid polymerized region in the build region, while forming or maintaining a liquid film release layer comprised of the polymerizable liquid formed between the solid polymerized region and the build surface, wherein the polymerization of which liquid film is inhibited by the polymerization inhibitor; and (d) advancing the carrier with the polymerized region adhered thereto away from the build surface on the build plate to create a subsequent build region between the polymerized region and the build surface while concurrently filling the subsequent build region with polymerizable liquid as in step (b). Apparatus for carrying out the method is also described.

Methods For Making An Object And Formulations For Use In Said Methods
20180282544 · 2018-10-04 · ·

The present invention relates to formulations for use in 3-D printing using radiation from visual display screens. The formulations comprise titanocene photoinitators and co-initiators. The invention also relates to methods of forming 3-D objects using said formulations.

APPARATUS AND METHOD FOR FORMING THREE-DIMENSIONAL OBJECTS USING A TILTING SOLIDIFICATION SUBSTRATE
20180272610 · 2018-09-27 ·

An apparatus and method for making a three-dimensional object from a solidifiable material using a linear solidification device is shown and described. The apparatus includes a solidification substrate assembly that is tiltable about a tilting axis to peel a solidification substrate from a recently formed object surface and to level the solidification substrate assembly and squeeze out accumulated solidifiable material between the solidification substrate and the recently formed object surface. Intelligent peeling and leveling may also be provided by providing a tilting parameter database that is used to adjust tilting parameters based on object geometry and/or solidifiable material properties.

System and process for using a conductive, non-stick coating for automating tool touch-off

Systems and methods for using a non-stick conductive material to automate tool touch-off in an additive manufacturing process are provided. A substrate comprises a first conductive layer, an intermediate binder layer, and a second non-stick conductive layer. The non-stick conductive layer may comprise perfluoroalkoxy alkanes and carbon nanotubes. An electrical connection may be made between the first conductive layer and the second non-stick conductive layer. When used with an additive manufacturing device, when the nozzle of the device contacts the substrate, a circuit may close resulting in a detectable voltage drop. When the voltage drop is detected, a reference point for the additive manufacturing device may be set.

Apparatus and method for forming three-dimensional objects using a tilting solidification substrate

An apparatus and method for making a three-dimensional object from a solidifiable material using a linear solidification device is shown and described. The apparatus includes a solidification substrate assembly that is tiltable about a tilting axis to peel a solidification substrate from a recently formed object surface and to level the solidification substrate assembly and squeeze out accumulated solidifiable material between the solidification substrate and the recently formed object surface. Intelligent peeling and leveling may also be provided by providing a tilting parameter database that is used to adjust tilting parameters based on object geometry and/or solidifiable material properties.

Fluoropolymer hollow fiber membrane with fluoro-copolymer and fluoro-terpolymer bonded end portion(s)

A hollow fiber membrane fluid transport device is disclosed wherein the fibers are comprised of Polytetrafluoroethylene (PTFE), and the potting materials are comprised of fluorocopolymer and or fluoroterpolymer based materials. The potting of the device utilizes a compressed chemically resistant fluorocopolymer and or fluoroterpolymer film, allows for ease of manufacture without destruction of the PTFE hollow fibers, with high packing densities, and without the processing complexity of pre-melting, extruding, or chemical crosslinking of any polymeric adhesives. Furthermore, the PTFE hollow fibers can be treated with a fluoropolymeric solvent solution before the chemically resistant film is applied to enhance the adhesion of the PTFE fiber to the film. PTFE hollow fibers, and its respective fluoro-co and terpolymers as potting films impart high packing densities, superb chemical resistance and temperature resistance without membrane contamination, or low fiber pull strength, as is sometimes observed with standard potting materials such as polyurethane and epoxy.

Fluoropolymer hollow fiber membrane with fluoro-copolymer and fluoro-terpolymer bonded end portion(s)

A hollow fiber membrane fluid transport device is disclosed wherein the fibers are comprised of Polytetrafluoroethylene (PTFE), and the potting materials are comprised of fluorocopolymer and or fluoroterpolymer based materials. The potting of the device utilizes a compressed chemically resistant fluorocopolymer and or fluoroterpolymer film, allows for ease of manufacture without destruction of the PTFE hollow fibers, with high packing densities, and without the processing complexity of pre-melting, extruding, or chemical crosslinking of any polymeric adhesives. Furthermore, the PTFE hollow fibers can be treated with a fluoropolymeric solvent solution before the chemically resistant film is applied to enhance the adhesion of the PTFE fiber to the film. PTFE hollow fibers, and its respective fluoro-co and terpolymers as potting films impart high packing densities, superb chemical resistance and temperature resistance without membrane contamination, or low fiber pull strength, as is sometimes observed with standard potting materials such as polyurethane and epoxy.

Fluoropolymer hollow fiber membrane with fluoro-copolymer and fluoro-terpolymer bonded end portion(s)

A hollow fiber membrane fluid transport device is disclosed wherein the fibers are comprised of Polytetrafluoroethylene (PTFE), and the potting materials are comprised of fluorocopolymer and or fluoroterpolymer based materials. The potting of the device utilizes a compressed chemically resistant fluorocopolymer and or fluoroterpolymer film, allows for ease of manufacture without destruction of the PTFE hollow fibers, with high packing densities, and without the processing complexity of pre-melting, extruding, or chemical crosslinking of any polymeric adhesives. Furthermore, the PTFE hollow fibers can be treated with a fluoropolymeric solvent solution before the chemically resistant film is applied to enhance the adhesion of the PTFE fiber to the film. PTFE hollow fibers, and its respective fluoro-co and terpolymers as potting films impart high packing densities, superb chemical resistance and temperature resistance without membrane contamination, or low fiber pull strength, as is sometimes observed with standard potting materials such as polyurethane and epoxy.

Fluoropolymer hollow fiber membrane with fluoro-copolymer and fluoro-terpolymer bonded end portion(s)

A hollow fiber membrane fluid transport device is disclosed wherein the fibers are comprised of Polytetrafluoroethylene (PTFE), and the potting materials are comprised of fluorocopolymer and or fluoroterpolymer based materials. The potting of the device utilizes a compressed chemically resistant fluorocopolymer and or fluoroterpolymer film, allows for ease of manufacture without destruction of the PTFE hollow fibers, with high packing densities, and without the processing complexity of pre-melting, extruding, or chemical crosslinking of any polymeric adhesives. Furthermore, the PTFE hollow fibers can be treated with a fluoropolymeric solvent solution before the chemically resistant film is applied to enhance the adhesion of the PTFE fiber to the film. PTFE hollow fibers, and its respective fluoro-co and terpolymers as potting films impart high packing densities, superb chemical resistance and temperature resistance without membrane contamination, or low fiber pull strength, as is sometimes observed with standard potting materials such as polyurethane and epoxy.

EVACUABLE MOLD FOR FIBER COMPOSITE PLASTIC COMPONENTS
20180056549 · 2018-03-01 · ·

Evacuable, stable mold having a design obtained by thermal deformation at temperatures 240 C. and corresponding to a fiber composite plastic component to be produced, consisting of an at least two-layered thermoplastic, vacuum-tight plastic film from a surface layer which is made of at least one thermoplastic polyamide or copolyimide, which has optionally functional groups, and a separating layer which form the inner side and is made of at least one thermoplastic fluorinated copolymer which has functional groups.