Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

A method of fabricating a polishing pad using an additive manufacturing system includes receiving data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection. The desired shape defines a profile including a polishing surface and one or more grooves on the polishing pad. Data indicative of a modified pattern of dispensing feed material is generated to at least partially compensate for distortions of the profile caused by the additive manufacturing system, and a plurality of layers of the feed material are dispensed by droplet ejection in accordance to the modified pattern.

The present disclosure provides bonded abrasive articles including abrasive particles retained in a binder. The abrasive particles are oriented at a predetermined angle greater than 0 degrees and less than 90 degrees with respect to a longitudinal axis of the bonded abrasive article. Fifty percent or more of the abrasive particles are oriented within 15 degrees above or below the angle, as measured using microscopy image analysis under magnification. The present disclosure further provides a method of making a bonded abrasive article, the method comprising sequential steps. The steps include (a) a sub-process comprising sequentially: i) depositing a layer of loose powder particles in a confined region, wherein the loose powder particles comprise matrix particles and abrasive particles; ii) spreading the layer of loose powder particles with a spreading bar or roller to provide a substantially uniform thickness, wherein a gap between the spreading bar or roller and a base plane of the confined region is selected to be shorter than an average length of the abrasive particles; and iii) selectively treating an area of the layer of loose powder particles to bond powder particles together. Step b) includes independently carrying out step a) a number of times to generate a bonded abrasive article preform including the bonded powder particles and remaining loose powder particles. Step c) includes separating remaining loose powder particles from the bonded abrasive article preform. Step d) includes heating the bonded abrasive article preform to provide the bonded abrasive article. Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying a bonded abrasive article; and generating, with the manufacturing device by an additive manufacturing process, a bonded abrasive article preform based on the digital object. A system is also provided, including a display that displays a 3D model of a bonded abrasive article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of a bonded abrasive article preform.

The embodiments provide a process for preparing a polishing sheet, a polishing pad using the same, and a process for preparing a semiconductor device using the same. The process for preparing a polishing sheet comprises forming a pattern on the surface of a polymer sheet and winding the patterned polymer sheet to form a wound roll in a cylindrical shape. Thus, there are great advantages in that it is possible to control the size and distribution ratio of a fine and uniform pattern at a desired location in an economical and efficient way and to freely design the type, size, structure, physical properties, and the like of the polishing sheet according to the purpose, whereby the application field can be expanded, and a bulk structure can be manufactured.

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

A method of manufacturing a polishing pad includes producing an urethane prepolymer having a viscosity of 20,000 cps (at 25 C.) to 40,000 cps (at 25 C.) by mixing a plurality of polymers, mixing the urethane prepolymer with an inert gas and a low-boiling blowing agent having a boiling point of 60 C. to 150 C., and manufacturing a polishing layer including porous pores by causing a mixture produced at the mixing to be subjected to gelation and curing in a predetermined cast.

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.