A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

A method of fabricating a polishing layer of a polishing pad includes determining a desired distribution of particles to be embedded within a polymer matrix of the polishing layer. A plurality of layers of the polymer matrix is successively deposited with a 3D printer, each layer of the plurality of layers of polymer matrix being deposited by ejecting a polymer matrix precursor from a nozzle. A plurality of layers of the particles is successively deposited according to the desired distribution with the 3D printer. The polymer matrix precursor is solidified into a polymer matrix having the particles embedded in the desired distribution.

The invention is to a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method includes applying droplets of a liquid polymer against a substrate to form a plurality of pores. The liquid polymer contains a nonionic surfactant, the nonionic surfactant has a concentration sufficient to facilitate growth of pores within the liquid polymer and an ionic surfactant has a concentration sufficient to limit growth of the pores within the liquid polymer. Curing the solid polymer forms a polishing pad with final size of the plurality of pores controlled by the concentration of nonionic surfactant and ionic surfactants.

A method of manufacturing a polishing pad includes producing an urethane prepolymer having a viscosity of 20,000 cps (at 25 C.) to 40,000 cps (at 25 C.) by mixing a plurality of polymers, mixing the urethane prepolymer with an inert gas and a low-boiling blowing agent having a boiling point of 60 C. to 150 C., and manufacturing a polishing layer including porous pores by causing a mixture produced at the mixing to be subjected to gelation and curing in a predetermined cast.

A method for manufacturing a window for a polishing pad is disclosed. The method includes: a) mixing a curing agent with a polyurethane prepolymer having a temperature of 50 C. or higher to less than 100 C. to prepare a mixture; b) injecting the mixture into a mold heated to a temperature of 30 C. or higher to less than 100 C. to a thickness of 5 mm or less; c) demolding a polyurethane cured product from the mold; and d) processing the polyurethane cured product to a thickness of the window of the polishing pad. A polishing pad including the window is also disclosed.

An apparatus for fabricating a polishing pad includes a conveyor belt, a casting station to form a layer of the polishing pad and to deliver the layer of the polishing pad onto the conveyor belt, a printing station including one or more printheads configured to deposit one or more layers to form a polishing pad, a motor to drive the conveyor belt, and an energy source. The one or more printheads include a plurality of nozzles configured to eject droplets of a liquid polishing pad material precursor on the layer formed by the casting station. The motor drives the conveyor belt while the one or more printheads eject the droplets such that droplets provide a layer of polishing pad material precursor. The energy source at least partially cure the pad material precursor to form a solidified layer of polishing pad material.

A method of additive manufacturing includes dispensing successive layers of feed material to form a polishing pad, and directing first and second radiation beams toward the layers of feed material to form a polishing pad. Dispensing each successive layer of the layers of feed material includes dispensing a drop of feed material, and directing the first and second radiation beams toward the layers of feed material includes, for each successive layer, directing the first radiation beam toward the drop of feed material to cure an exterior surface of the drop of feed material, and directing the second radiation beam toward the drop of feed material to cure an interior volume of the drop of feed material.

An additive manufacturing apparatus for forming a polishing pad for chemical mechanical polishing includes a platform, an actuator system coupled to the platform to adjust a tilt of the platform, one or more printheads supported above the platform, the one or more printheads configured to dispense successive layers of feed material on the platform to be form the polishing pad, a sensing system to detect a height of a surface on or above the platform at each of a plurality of horizontally spaced points, and a controller configured to selectively operate the actuator system to adjust the tilt of the platform based on the detected height of the platform at each of the points such that the surface is moved closer to horizontal.

An additive manufacturing apparatus includes a platform, a plurality of printheads supported above the platform and configured to dispense successive layers of feed material on a top surface of the platform, the layers of feed material to be formed into a polishing pad, an optical sensor to monitor a dispensing operation of a first printhead of the plurality of printheads, and a controller configured to detect an error condition associated with the first printhead based on monitoring the dispensing operation of the first printhead while operating the printheads to successively dispense the layers of feed material, and adjust a dispensing operation of a second printhead of the plurality of printheads in response to detecting the error condition.

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.