Provided is a melamine decorative board having a milky-white core layer and less warpage. When the melamine decorative board is bonded onto a base plate such as a plywood, a particle board, and a steel board, a color tone of the base plate does not appear through to a decorative layer. Stacked and thermal-pressure-formed are: a resin-impregnated patterned paper as the decorative layer; multiple sheets of a resin-impregnated core paper, as the core layer, produced by impregnating a whitish fibrous base material with a resin liquid including: a condensate of melamine and formaldehyde, and a divalent polyalkylene glycol or a derivative thereof, or a tri- or more valent polyalkylene glycol polyvalent ether, and drying the whitish fibrous base material; and a resin-impregnated backside paper, as a backside layer, produced by impregnating a fibrous base material with a condensate of melamine and formaldehyde and drying the fibrous base material.

A composite foam article is disclosed herein. The composite foam article comprises a polyurethane foam core presenting a first surface and a second surface facing opposite the first surface. A first skin is disposed on the first surface and a second skin is disposed on the second surface. The polyurethane foam core has a density of 15-80 kg/m.sup.3. The first and second skins comprise a plurality of fibers and a polymeric binder. The composite foam article has a weight per unit area of 500-1000 g/m.sup.2 and a strength of greater than 17 N at a post-compression thickness of greater than 2 mm when tested in according with SAE J949 at 23° C.

Chemically anchoring long-chain polymer networks of tough hydrogels on solid surfaces can represent a general strategy to design tough and functional bonding between hydrogels and solid materials, achieving interfacial toughness over 1000 Jm.sup.−2.

A beaded composite panel is fabricated using composite plies. An opening is formed in each of plies, and each ply is laid up on a bead feature and drawn down over the bead feature in the area of the opening so as to widen the opening into a gap allowing the ply to conform to the contour of the bead feature. Patches are fabricated and placed on the plies overlying over the openings. The laid-up plies are compacted and cured.

A beaded composite panel is fabricated using composite plies. An opening is formed in each of plies, and each ply is laid up on a bead feature and drawn down over the bead feature in the area of the opening so as to widen the opening into a gap allowing the ply to conform to the contour of the bead feature. Patches are fabricated and placed on the plies overlying over the openings. The laid-up plies are compacted and cured.

A strip-form toilet cleaning product comprising a width (B), a height (H) and a thickness (S), wherein the ratio between width (B), height (H) and thickness (S) is between 1:1:0.01 and 1:0.1:0.2, a first extruded phase and at least one second extruded phase, wherein at least the contour of a contact surface (4, 4a, 4b) along the center axis (8) takes the form of a sine wave which has an amplitude of A.sub.1,O, wherein the ratio of amplitude to width (B) A.sub.1,O:B amounts to between 1:10 and 1:25 and the periodic length of the sine wave corresponds to 0.1-1 times the width (B) of the toilet cleaning product.

A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.

A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.

Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.

A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.