The present invention discloses an artificial graphite flake manufacturing method, which uses the PI (polyimide) films as the material; via a stacking step, a first heating step and a second heating step, the PI films are processed to form the artificial graphite flakes so as to increase the lubrication and the hardness, improve the heat conduction for balancing temperature increase and better the smoothness; in addition, via a perforation step, a hole structure is formed on the artificial graphite flakes so as to increase the heat diffusion area and the air permeability of the artificial graphite flakes, and then increase the defect-free rate and the smoothness thereof.

The present invention discloses an artificial graphite flake manufacturing method, which uses the PI (polyimide) films as the material; via a stacking step, a first heating step and a second heating step, the PI films are processed to form the artificial graphite flakes so as to increase the lubrication and the hardness, improve the heat conduction for balancing temperature increase and better the smoothness; in addition, via a perforation step, a hole structure is formed on the artificial graphite flakes so as to increase the heat diffusion area and the air permeability of the artificial graphite flakes, and then increase the defect-free rate and the smoothness thereof.

A multi-layer film includes a first-seal layer and a second-seal layer. The multi-layer film may be used to form a package for consumer-care products.

A multi-layer film includes a first-seal layer and a second-seal layer. The multi-layer film may be used to form a package for consumer-care products.

An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

An anisotropic conductive film has a three-layer structure in which a first connection layer is sandwiched between a second connection layer and a third connection layer that each are formed mainly of an insulating resin. The first connection layer has a structure in which conductive particles are arranged in a single layer in the plane direction of an insulating resin layer on a side of the second connection layer, and the thickness of the insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than that of the insulating resin layer in regions in proximity to the conductive particles.

The decorative panel includes a substrate and a top layer. The substrate has at least one of polyvinyl chloride layer. The top layer includes a decorative textile layer providing the surface of the decorative panel. The top layer is laminated onto the substrate by thermal bonding of the top layer onto the substrate; or by a polyvinyl chloride based adhesive layer. The substrate is provided at a first pair of opposite edges with coupling parts, substantially in the form of male coupling parts and female coupling parts, for coupling two such panels to each other at their first pair of opposite edges. The coupling parts are provided with locking means which effects a locking in coupled condition of two such panels in the direction perpendicular to the surface of the coupled panels and/or into the direction perpendicular to the respective edges in the plane of the panels.

The decorative panel includes a substrate and a top layer. The substrate has at least one of polyvinyl chloride layer. The top layer includes a decorative textile layer providing the surface of the decorative panel. The top layer is laminated onto the substrate by thermal bonding of the top layer onto the substrate; or by a polyvinyl chloride based adhesive layer. The substrate is provided at a first pair of opposite edges with coupling parts, substantially in the form of male coupling parts and female coupling parts, for coupling two such panels to each other at their first pair of opposite edges. The coupling parts are provided with locking means which effects a locking in coupled condition of two such panels in the direction perpendicular to the surface of the coupled panels and/or into the direction perpendicular to the respective edges in the plane of the panels.

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.

Novel polyamide-metal laminates which have desirable hydrolysis resistance are provided. The laminates comprise (A) a metal, (B) a tie layer, and (C) a polyamide composition. The tie layer is formed from a composition containing (B1) a polymer containing a comonomer having at least two adjacent carboxylic acid groups and (B2) an amino-silane containing a primary amine and at least one hydroxyl group.