A composite includes a first layer of a first fluoropolymer; a second layer of at least one ply of a reinforcing fabric overlying the first layer; and a third layer of a second fluoropolymer overlying the second layer opposite to the first layer, wherein the first layer, the third layer, or combination thereof have an outer surface that is defect free; wherein the composite has a continuous length of at least about 3 meters. Embodiments of such composites can find applications, for example, as processing aids for an electronic device, a food, a polymer, insulating an electrical device, or heat sealing a polymer.

Wafer taping apparatuses and methods are provided for determining whether taping defects are present on a semiconductor wafer, based on image information acquired by an imaging device. In some embodiments, a method includes applying an adhesive tape on a surface of a semiconductor wafer. An imaging device acquires image information associated with the adhesive tape on the semiconductor wafer. The presence or absence of taping defects is determined by defect recognition circuitry based on the acquired image information.

In some implementations, an electronic device includes a display stack to display content. The display stack can include a number of substrates coupled using a liquid optically clear adhesive (LOCA). In some implementations, the LOCA can have a modulus of elasticity of no greater than 80,000 Pa. Additionally, the display stack can be formed using a process that includes applying an external force to the display stack by placing the display stack between two fixtures. In an implementation, the external force can be applied while heating the display stack at a temperature of at least 60° C. and cooling the display stack according to a particular cooling rate.

A method of manufacturing at least one structural panel (20) for an engineering structure comprises conveying a layered structure (40) through a roller assembly comprising at least one pair of heating rollers (50) and at least one pair of cooling rollers (52), where the cooling rollers are at a lower temperature than the heating rollers. The layer structure comprises a thermoplastic foam layer 24 and at least one skin layer (22). The heating rollers 0 heat the skin layer (22) to melt at least part of the foam layer (24) adjacent to the skin layer (22) and bond the foam layer (24) to the skin (22). The cooling rollers (52) cool the layered structure (40) so that the thermoplastic resolidifies, retaining its bond with the skin to form the bonded panel (20). This approach greatly reduces manufacturing costs for structural panels.

A method of manufacturing at least one structural panel (20) for an engineering structure comprises conveying a layered structure (40) through a roller assembly comprising at least one pair of heating rollers (50) and at least one pair of cooling rollers (52), where the cooling rollers are at a lower temperature than the heating rollers. The layer structure comprises a thermoplastic foam layer 24 and at least one skin layer (22). The heating rollers 0 heat the skin layer (22) to melt at least part of the foam layer (24) adjacent to the skin layer (22) and bond the foam layer (24) to the skin (22). The cooling rollers (52) cool the layered structure (40) so that the thermoplastic resolidifies, retaining its bond with the skin to form the bonded panel (20). This approach greatly reduces manufacturing costs for structural panels.

A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.

A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.

The layered graphic decal arrow consists of an arrow base, decal, and a finishing layer. Two separate curing processes are used to create the arrow to prevent adhesive from penetrating the decal thereby degrading the visual appeal of the arrow. The decal is applied to the arrow base, or printed on the arrow base, then flashed at a first temperature then cured at a second temperature. After cooling the arrow, a finishing layer is applied to the arrow. A uniform pressure is applied around the finishing layer to hold it in place while curing. After curing, the uniform pressure is removed, the arrow is polished to remove undesired markings and the arrow is cut to the desired length. In an alternative embodiment, the finish layer is a polymer coating applied to the arrow without the need for uniform pressure.

The layered graphic decal arrow consists of an arrow base, decal, and a finishing layer. Two separate curing processes are used to create the arrow to prevent adhesive from penetrating the decal thereby degrading the visual appeal of the arrow. The decal is applied to the arrow base, or printed on the arrow base, then flashed at a first temperature then cured at a second temperature. After cooling the arrow, a finishing layer is applied to the arrow. A uniform pressure is applied around the finishing layer to hold it in place while curing. After curing, the uniform pressure is removed, the arrow is polished to remove undesired markings and the arrow is cut to the desired length. In an alternative embodiment, the finish layer is a polymer coating applied to the arrow without the need for uniform pressure.

Methods of forming semiconductor structures include providing a polymeric material over a carrier substrate, bonding another substrate to the polymeric material, and lowering a temperature of the polymeric material to below about 15° C. to separate the another substrate from the carrier substrate. Some methods include forming a polymeric material over a first substrate, securing a second substrate to the first substrate over the polymeric material, cooling the polymeric material to a temperature below a glass transition temperature of the polymeric material, and separating the second substrate from the first substrate. Semiconductor structures may include a polymeric material over at least a portion of a first substrate, an adhesive material over the polymeric material, and a second substrate over the adhesive material. The polymeric material may have a glass transition temperature of about 10° C. or lower and a melting point of about 100° C. or greater.