Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Methods of manufacturing electrochromic windows are described. Insulated glass units (IGU's) are protected, e.g. during handling and shipping, by a protective bumper. The bumper can be custom made using IGU dimension data received from the IGU fabrication tool. The bumper may be made of environmentally friendly materials. Laser isolation configurations and related methods of patterning and/or configuring an electrochromic device on a substrate are described. Edge deletion is used to ensure a good seal between spacer and glass in an IGU and thus better protection of an electrochromic device sealed in the IGU. Configurations for protecting the electrochromic device edge in the primary seal and maximizing viewable area in an electrochromic pane of an IGU are also described.

An apparatus for making a nonwoven fabric from thermoplastic fibers has a spinneret for spinning fibers into continuous filaments and a cooler for cooling the filaments. The cooled filaments are then deposited on a conveyor to form a nonwoven web. A first consolidator surface treats the nonwoven web with a hot fluid or hot air as it is conveyed on the conveyor. A second consolidating downstream of the first consolidator has a dual-belt furnace in which the nonwoven web is passed between two circulating belts or continuous belts for surface treating the nonwoven web with a hot fluid or hot air and for applying surface pressure can be applied to the nonwoven web at the same time.

An embodiment provides an adhesive film having, in order from the surface layer side, a first hard coat, a second hard coat, a transparent resin film layer, and an adhesive layer. The first hard coat is formed from a coating that does not include inorganic particles. The second hard coat is formed from a coating that includes inorganic particles. The adhesive film satisfies the following conditions: (i) the total light transmittance is at least 85%; and (vii) the pencil hardness of the first hard coat surface is at least 5H. Another embodiment provides an adhesive film having, in order from the surface layer side, a first hard coat, a second hard coat, a transparent resin film layer, and an adhesive layer. The first hard coat is formed from a coating that does not include inorganic particles. The second hard coat is formed from a coating that includes inorganic particles. The adhesive film satisfies the following conditions: (i) the total light transmittance is at least 85%; (iv) the water contact angle at the first hard coat surface is at least 100 degrees; and (v) the water contact angle at the first hard coat surface after 20,000 reciprocal cotton rubs is at least 100 degrees.

A glass composite includes a first glass member and a second glass member. The first glass member and the second glass member are at least partially connected with each other at the surfaces, and a contact interface is formed on the contacting position of the first glass member and the second glass member. The contact interface is visually observed to have no crevices; and when the glass composite is in contact with an acid solution, crevices are suitably formed in the glass composite at the contact interface.

A glass lamination article includes a resin layer in contact with a base substrate such that a first interface is formed therebetween, and a glass substrate layer in contact with the resin layer such that a second interface is formed therebetween, wherein the resin layer may be an ultraviolet (UV)-curable resin layer. The glass lamination article has excellent impact resistance and strength, as well as excellent waviness.