Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films (100) may include a plurality of co-extensive electrical protolayers (22, 23, 24) forming an electrical protolayer stack (20), at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 10.sup.3 and 10.sup.4 Poise at a shear rate of 100/s when heated to a temperature between its Tg and T.sub.dec.

The present invention provides a process for producing a surface-modified layer system comprising a substrate (2) and a self-assembled monolayer (SAM) (1) anchored to its surface. The SAM (1) is comprised by aryl or rigid alicyclic moiety species. The process comprises providing a polymorphic SAM (1) anchored to the substrate (2), and thermally treating (4) the SAM to change from a first to a second structural form thereof. The invention also provides a thermolithographic form of process in which the thermal treatment (4) is used to transfer a pattern (3) to the SAM (1), which is then developed.

A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure also includes a first metallization plane and second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.

The present invention relates to a method for manufacturing a laminated object. A foam core and a skin are provided and the foam core and the skin are arranged relative to each other. The skin is heated. The skin is pierced by a vacuum application device. Further, vacuum is applied via the vacuum application device so as to withdraw a gaseous medium, in particular air, from within the foam core and from a space or spaces between the foam core and the skin, in order to draw the skin towards the foam core. Furthermore, the invention provides a manufacturing device for manufacturing a laminated object, laminated objects comprising a foam core and a skin, a method for producing pallets comprising a foam core and a skin, as well as pallets comprising a foam core and a skin.

Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

The optical assembly comprises: a first optical film having a first surface; an adhesive disposed on the first surface of the first optical film, wherein the adhesive comprises a photo-curable portion and a thermally-curable portion mixed with the photo-curable portion, wherein the weight ratio of the thermally-curable portion of the adhesive to the adhesive is less than 5%; and a second optical film comprising a photo-curable material, wherein the adhesive is bonded to the second optical film through the bonding between the photo-curable portion of the adhesive and the photo-curable material of the second optical film.

A preparation process of spunlace intertwining type recycled cow leather comprises a material preparation process, a cow leather fiber web forming process, as well as a mixed fiber web forming process, an overlapped web forming process, a base fabric manufacturing process and a cow leather finished product manufacturing process which are sequentially arranged according to a preparation process flow; the base fabric manufacturing process comprises a buffing process, a single-side immersion treatment process and an ironing process which are sequentially arranged for manufacturing the overlapped web into the base fabric; and the single-side immersion treatment process comprises the steps of subjecting a single side of the base fabric to single-side coating treatment of the water-based PU material or the oil-based PU material by adopting an inverted feeding device and using a water-based PU material or an oil-based PU material as a coating so as to form a single-side permeable immersion layer of the base fabric.

Transfer films, articles made therewith, and methods of making and using transfer films to form bridged nanostructures are disclosed.

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.
V.sub.2O.sub.5+TeO.sub.2+Fe.sub.2O+P.sub.2O.sub.5≧90(mass %)  (1)
V.sub.2O.sub.5>TeO.sub.2>Fe.sub.2O.sub.3>P.sub.2O.sub.5 (mass %)  (2)

A hot gas generation device with which a gas flow, for example, an air flow, is heated. This device is used for heating an edge band or another coating material, in particular an adhesive layer provided on this coating material. In this way, the coating material is prepared for being applied to a (wooden) work piece, which may, for example, be plate-shaped.