A solar panel disassembling apparatus according to an embodiment of the present disclosure separates a glass plate of a solar panel and a film layer bonded to the glass plate from each other. The solar panel disassembling apparatus includes a supply module that stands and fixes the solar panel such that a bond line between the glass plate and the film layer is exposed upward and downward and that moves the solar panel in a parallel direction parallel to a bonding surface between the glass plate and the film layer, and a wire-shaped cutting blade that is disposed in front of the solar panel in a movement direction of the solar panel to have a distance from the supply module, is disposed in parallel to the bonding surface, and separates the glass plate and the film layer from each other.

After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.

Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to heat or electromagnetic energy. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a shape memory material. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Disclosed is a protective film, which includes: a protective film sheet; a protective layer; and a release layer, a lead tab is connected to an end part of the release layer, and a positioning mechanism is arranged on the protective layer to align the protective film sheet with a screen of an electronic device.

Embodiments provide methods of disassembling an apparel product. The methods include exposing an adhesive of the apparel product to electromagnetic energy. The adhesive is disposed at least partially between a major component and a minor component of the apparel product. The adhesive includes a polymer having a cyclodextrin moiety bonded to an azobenzene moiety. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

Embodiments provide methods of disassembling apparel products. The methods include exposing an adhesive of the apparel product to a composition. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a material having an imine bond or an iminium bond. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component via the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

The present invention is directed to a curable and one component (1K) debondable adhesive composition comprising: a) epoxy resin; b) a curing agent for said epoxy resin; c) an electrolyte; and, d) an electrically non-conductive filler; wherein said composition comprises at least one of: e) a combination of a solubilizer and a toughener; and, f) electrically conductive particles.

The invention provides an adhesive composition containing an adhesive component (S) and a release component (H) formed of a polyorganosiloxane having a complex viscosity of 3,400 (Pa.Math.S) or higher.

A method for recycling of packaging material is disclosed. The packaging material comprises a multilayer material (10) comprising a metal layer (30) and at least one polymer layer (20, 40). The method comprises placing the packaging material in a vat (310) comprising a separation fluid (330) to produce a mixture of metal shreds from the metal layer (30), plastic shreds from the polymer layer (20, 40) and residual components. The separation fluid comprises a mixture comprising a mixture of water, a short-chained carboxylic acid, phosphoric acid and an alkali metal hydroxide solution.

A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.