Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.

A suction holder for sucking and holding a holding target member includes a sucker, a tube bellows connected to a lower end of the sucker, and a tube arranged inside the tube bellows and having an upper end positioned lower than an upper end of the sucker. A lower opening of the tube is communicated with a suction source and the holding target member is contacted with the upper end of the sucker to form a closed room, and the inside of the closed room is placed into a negative pressure state to hold the holding target member.

A manufacturing method of a flexible electronic substrate and a substrate structure are disclosed. The manufacturing method includes: providing a first substrate comprising a first surface and a second surface which are opposite; forming a separation layer on the first surface of the first substrate, the separation layer being in a film form; providing a second substrate on the separation layer, the second substrate being configured as a flexible substrate; and processing the separation layer, such that at least a part of the separation layer is cracked from the film form, thereby separating the second substrate from the first substrate.

The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.

The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: (meth)acrylate monomer; co-polymerizable acid; and, an electrolyte; and, ii) a second part comprising: a first curing agent for the monomers of said first part; a second curing agent for the monomers of said first part; and, a solubilizer.

A protective film removal device has a first removal station for releasing a protective film from an optical lens first surface, a lens holder which has an imaginary central axis, at least one fluid nozzle having a nozzle exit duct, and a rotary mounting between the lens holder and the fluid nozzle(s). The rotary mounting is configured such that a relative movement about the central axis is able to be carried out by the fluid nozzle(s), wherein the nozzle exit duct of the fluid nozzle(s) is in each case oriented inwards. A lifting device between the lens holder and the fluid nozzle(s) is configured in such that a relative movement in relation to the lens holder, said relative movement being oriented along the central axis, is able to be carried out by the fluid nozzle(s). A method for releasing a protective film from a lens surface is also disclosed.

Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. In the protection method, a protective sheet having a substrate and a PSA layer provided to at least one face of the substrate is applied for protection via the PSA layer to a Low-E glass plate having a Low-E layer that comprises a zinc component. The method is characterized by using the protective sheet wherein the PSA layer is formed from a water-dispersed PSA composition and includes less than 850 μg ammonia per gram of PSA layer weight.

A sheet separation device separates a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at a bonding portion of the two-ply sheet. The sheet separation device includes a winding roller, a conveyance roller pair, and a separation claw. The winding roller rotates and winds the two-ply sheet. The conveyance roller pair conveys the two-ply sheet toward the winding roller. The separation claw is inserted into a gap between the two sheets at a position between the winding roller and the conveyance roller pair. The separation claw is disposed in a space that is bounded by an imaginary plane and includes the winding roller. The imaginary plane passes through a nip of the conveyance roller pair and a winding start position at which the two-ply sheet starts to be wound around the winding roller.

Provided is a microporous film which has a surface A and a surface B opposite to the surface A. In one embodiment, the microporous film has a ratio (F.sub.B/F.sub.A) of a dynamic friction coefficient F.sub.B of the surface B to a dynamic friction coefficient F.sub.A of the surface A of 1.2 to 20. In another embodiment, the microporous film is a single layer having a thickness of 3-18 μm, a number N.sub.A of pores on the surface A is 10-100/μm.sup.2, a number N.sub.B of pores on the surface B is 20-200/μm.sup.2, and N.sub.A/N.sub.B is 0.2-0.96. In addition, a total area S.sub.A of pores on the surface A is 0.02-0.5 μm.sup.2/μm.sup.2, a total area S.sub.B of pores on the surface B is 0.01-0.3 μm.sup.2/μm.sup.2, and S.sub.A/S.sub.B is 1.1-10. Furthermore, in another embodiment, a number W.sub.B of protrusion-like bodies on the surface B is 0.2-1000/100 μm.sup.2.

A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.