Described herein is a multilayer microporous film or membrane that may exhibit improved properties, including improved dielectric break down and strength, compared to prior monolayer or tri-layer microporous membranes of the same thickness. The preferred multilayer microporous membrane comprises microlayers and one or more lamination barriers. Also disclosed is a battery separator or battery comprising one or more of the multilayer microporous films or membranes. The inventive battery and battery separator is preferably safer and more robust than batteries and battery separators using prior monolayer and tri-layer microporous membranes. Also, described herein is a method for making the multilayer microporous separators, membranes or films described herein.

A sealing device including a waterproofing membrane, a sealant layer covering at least a portion of the second primary exterior surface of the waterproofing membrane and an adhesive layer covering a portion of the outer major surface of the sealant layer facing away from the second primary exterior surface of the waterproofing membrane, wherein the sealant layer is composed of an adhesive sealant composition comprising at least one elastomer, at least one at 25° C. liquid polyolefin resin, and at least one inert mineral filler. A method produces a sealing device, a method waterproofs a substrate, and a waterproofed substrate.

Provided is a thermally conductive sheet having high thermal conductivity not only in a thickness direction of the sheet but also in one direction along a plane direction of the sheet. The thermally conductive sheet is a thermally conductive sheet containing a scaly filler 12 in a polymer matrix 11, wherein the scaly filler 12 is oriented such that a long axis direction of a scale surface is along one of a first direction that is a thickness direction of the thermally conductive sheet and a second direction that is perpendicular to the first direction, and a transverse axis direction that is perpendicular to the long axis direction in the scale surface is along the other of the first direction and the second direction.

A method of manufacturing a semiconductor device may include bonding a carrier substrate onto a device wafer using an adhesive member, wherein the adhesive member includes a base film, a device adhesive film disposed on a lower surface of the base film and contacting the device wafer, and a carrier adhesive film disposed on an upper surface of the base film and contacting the carrier substrate. The device adhesive film includes a gas blowing agent, and the carrier adhesive film may not include a gas blowing agent.

A material can have a layered structure with at least a first layer, including a carbon-based material or a substrate of a material other than a carbon-based material, a second layer, including a carbon-based material, and a third, intermediate layer that separates and interconnects the first and second layers. The carbon-based material includes at least 50 at. % carbon, has a hexagonal lattice and the layer or layers including the carbon-based material has/have a thickness of 1-20 times the size of a carbon atom. The intermediate layer is a layer that includes a salt having ions that include at least two separate cyclic, planar groups that are capable of forming π-π-stacking with the material of the second layer and that the third, intermediate layer is connected to at least the second layer by π-π-stacking caused by said cyclic planar groups of the salt ions.

A layered sheet 10 includes a substrate layer 1, and surface layers 2 and 3 configured to be layered on at least one surface of the substrate layer 1. The substrate layer 1 contains a first thermoplastic resin and inorganic fillers. The surface layers 2 and 3 contain a second thermoplastic resin and a conductive material. A content of the inorganic fillers in the substrate layer 1 is 0.3 to 28 mass % based on a total amount of the substrate layer.

The invention relates to a floor. The polymer solid wood composite flooring includes a SPC stone plastic layer, and a solid wood veneer layer or plywood layer forming the main body of the floor is arranged under the SPC stone plastic layer; the physical and chemical performance index of the polymer solid wood composite flooring is: color fastness≥Grade 6; average peel strength≥75 (N/50 mm), pollution resistance≥grade 5, heating dimensional change rate≤0.25%, heating warpage≤2.0 mm, moisture content 6-10%. The preparation process of polymer solid wood composite flooring includes: preparation of SPC stone plastic layer; preparation of solid wood veneer layer or plywood layer; composite pressing; first balance treatment; Slitting; second balance treatment; slotting; UV layer preparation. Thereby, the polymer solid wood composite flooring with good foot feeling, not easy to deform and crack, and small dimensional change rate is produced.

A sachet product that includes a biodegradable and/or home compostable sachet comprising a front film and a back film. In some examples, the front film and back film can include a middle layer that can contain paper with greater than 85% cellulose and an inner layer that can include different material, including but not limited to polyvinyl alcohol or polyhydroxylalkonate. The sachet can include a compartment adapted for storing a solid article where the solid article is an open cell foam. The open cell foam can include a water-soluble polymer and a surfactant.

Provided is a laminated film for easy material recycling and with excellent rigidity and thermal shrinkage resistance. The laminated film includes, in sequence, a layer A containing an ethylene polymer (A) containing 80 mol % or more of a structural unit derived from ethylene, a layer B containing an ethylene polymer (B) containing 70 mol % or more of a structural unit derived from ethylene and an inorganic filler, a layer C containing an ethylene polymer (C) containing 70 mol % or more of a structural unit derived from ethylene, at least one layer selected from the group consisting of a barrier layer and an adhesive layer, and a layer D containing an ethylene polymer (D) containing 70 mol % or more of a structural unit derived from ethylene.

This disclosure describes a composition that includes a bulk diffuser that includes a film having a major surface; the film includes a polymer, and a scattering element. The scattering element includes a silicone bead having a mean particle diameter in a range of 2 micrometers (μm) to 9 μm. The linear density of the film is at least 5.1 W.sub.i*μm, wherein the linear density equals the product of the mass fraction of the silicone bead (W.sub.i) and film thickness in micrometers (μm). This disclosure further describes methods of making the film and the bulk diffuser and methods of using the film including, for example, as a bulk diffuser in a sign box.