The invention relates to a floor. The polymer solid wood composite flooring includes a SPC stone plastic layer, and a solid wood veneer layer or plywood layer forming the main body of the floor is arranged under the SPC stone plastic layer; the physical and chemical performance index of the polymer solid wood composite flooring is: color fastness≥Grade 6; average peel strength≥75 (N/50 mm), pollution resistance≥grade 5, heating dimensional change rate≤0.25%, heating warpage≤2.0 mm, moisture content 6-10%. The preparation process of polymer solid wood composite flooring includes: preparation of SPC stone plastic layer; preparation of solid wood veneer layer or plywood layer; composite pressing; first balance treatment; Slitting; second balance treatment; slotting; UV layer preparation. Thereby, the polymer solid wood composite flooring with good foot feeling, not easy to deform and crack, and small dimensional change rate is produced.

A system and method for dielectric bonding including a dielectric heater having a pair of opposing electrode plates, a nest removably coupled to a first electrode plate of the pair of electrode plates, and an interchangeable electrode assembly removably coupled to a second electrode plate of the pair of electrode plates. The nest having a plurality of cooling channels defined in a body thereof in which a cooling fluid circulates to cool a material assembly that is supported by the nest. The interchangeable electrode assembly having a plurality of concentrator members that are configured to concentrate energy from a voltage source in predetermined locations on the material assembly.

According to a processing method of a stone composite board, the two sides of a natural stone board are ground and flattened until a preset standard value of thickness variation is reached, then the surface planes and base material layers are subjected to pressure-compositing through adhesive layers, afterwards splitting is conducted, and the natural stone layer is subjected to calibrated planing with diamond roller and surface treatment to obtain the ultra-thin stone composite board.

Described are techniques and equipment (apparatus) for processing an electrostatic chuck at controlled process conditions, including, as an example, for processing an electrostatic chuck during a step of curing an adhesive that forms a bond between two layers of the electrostatic chuck.

Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

A fiber reinforced metal composite having a metal layer and a fiber layer which are arranged in a stack, and adjacent layers are fixed by bonding; the composite has a two-layered or three-layered structure, wherein one layer is closely adhered to another layer and the thickness of the layer is from 0.6 mm˜0.9 mm. Such structure changes the structure of the existing fiber metal composite characterized by generally having more than three layers, and greatly reduces the thickness of the composite while maintaining good mechanical properties. Also disclosed is an application of fiber reinforced metal composite in the field of luggage case manufacturing, providing two preparation methods for providing fiber reinforced metal case shell with simple and available operations.

A redox curable composition, methods for manufacturing same and uses thereof are disclosed. The redox curable composition is useful as a pre-applied adhesive. The redox curable composition is solid at room temperature, may be heated for application to a substrate, and cools to form a dry-to-touch adhesive layer on said substrate, which may be activated when required by mating with another substrate and exposure to an anaerobic environment. The composition is particularly suited to manufacturing complex products, such as mobile phones, computers and circuits.

A sheet laminator includes a sheet lamination device, a heater, and circuitry. The sheet lamination device performs a sheet laminating operation on an object by application of heat and pressure. The heater heats the sheet lamination device. The circuitry changes between a first mode in which the heater constantly heats the sheet lamination device while the sheet lamination device is turned on and a second mode in which the heater starts heating the sheet lamination device in response to a request of the sheet laminating operation and stops heating the sheet lamination device after a given time has elapsed from completion of the sheet laminating operation. The circuitry adjusts the given time in the second mode.

The invention relates to a bamboo floor, in particular to a composite bamboo floor. The composite bamboo floor comprises a floor surface board provided with a body, a pressed surface, a connecting surface connected with the core board, at least one cut surface board side face and surface board end faces, and the core board arranged under the floor surface board and provided with a core board surface connected with the floor surface board, a core board bottom surface, core board side faces and core board end faces, and the positions of the core board side faces or the core board side faces and the surface board side faces are provided with notch structures processed in two sides in the length direction of the composite bamboo floor. The composite bamboo floor is high in strength, high in processing efficiency and low in production cost.

A method to produce a panel. The method includes providing a core having a first surface, providing a surface layer including a substantially uncured amino resin, applying an hydrolysable adhesive on the first surface of the core and/or on a surface of the surface layer adapted to face the core, arranging the surface layer on the first surface of the core, pressing the surface layer to the core to form a panel by applying heat and pressure in a press, thereby adhering the surface layer to the core by the hydrolysable adhesive and curing the amino resin of the surface layer. Also such a panel.