This invention describes a modified electrospinning method for making uniformly patterned and porous nanofibrous scaffolds that can be utilized in a variety of applications. While traditional electrospinning method uses a foil collector that generates compact layers of nanofibrous structures, resulting on the superficial cell growth and differentiation, the present method comprises adopting additional patterned film(s) on top of the conventional collector to make a patterned porous structure of nanofibrous scaffolds that are capable of supporting cell growth. For example, the method uses a double layered collector composed of a water soluble stabilizer film mounted on a foil to make a uniformly patterned and porous nanofibrous membrane sheets, which enhance both cell growth and attachment.

The present invention is directed to a curable and one component (1K) debondable adhesive composition comprising: a) epoxy resin; b) a curing agent for said epoxy resin; c) an electrolyte; and, d) an electrically non-conductive filler; wherein said composition comprises at least one of: e) a combination of a solubilizer and a toughener; and, f) electrically conductive particles.

An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can fee used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cored, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.

An article is disclosed that includes a metal component comprising two anodized metal oxide layers thereon: an inner anodized metal oxide layer having a porosity of less than 20%, and an outer anodized metal oxide layer having a filament structure with a cross section areal filament density of more than 35%. The article also includes a composite component comprising electrically conductive fibers in a polymer matrix. The composite component is bonded to the metal component by an adhesive disposed between the composite component and the outer anodized metal oxide layer of the metal component.

An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can fee used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cored, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.

A method, for repairing a discrepant weld in a workpiece arrangement including at least two workpieces, comprising positioning a mechanical intermediary adjacent the discrepant weld and inserting the intermediary through the discrepant weld and into at least a distal workpiece of the two workpieces, wherein upon insertion, a proximate surface of the intermediary is exposed at a proximate side of the workpiece arrangement. The method further includes delivering weld energy to the intermediary. The intermediary is configured, and the weld energy provided, so that energy passes through the intermediary in a pre-determined manner. Energy passing through the intermediary in the pre-determined manner generates heat in material of the workpieces causing the material to melt at an arrangement interface. The method further comprises allowing or causing the material melted to cool, wherein the melted material, when cooled, forms and/or strengthens a robust joint connecting the workpieces.

The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: (meth)acrylate monomer; co-polymerizable acid; and, an electrolyte; and, ii) a second part comprising: a first curing agent for the monomers of said first part; a second curing agent for the monomers of said first part; a wax; and, a solubilizer, wherein said two-part (2K) adhesive composition further comprises a toughener, an oxygen scavenger and a rheology control agent and further wherein said two-part (2K) adhesive composition is characterized in that said electrolyte comprises or consists of at least one salt in accordance with Formula (I) or Formula (II):

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Methods, systems and apparatuses are disclosed comprising a tunable multilayered array reinforcement system having a supramolecular adhesive embedded with nanoparticles that are reoriented on-demand in response to or in advance of vibrational effects in a moving or stationary structure.

A method for forming an engineered veneer block includes stacking a plurality of laminate layers. The method also includes spreading a bonding agent between each layer of the plurality of laminate layers. The bonding agent includes an adhesive. The adhesive consists essentially of one or more no added formaldehyde adhesives. The method also includes slicing an engineered veneer from the engineered veneer block. The engineered veneer has a thickness in the range of 0.1 millimeters to 0.5 millimeters.

Interfacial delamination processes for physically separating a film structure from a substrate, and processes of fabricating a thin-film electronic device. The processes entail providing the substrate with an electrically-conductive separation layer on a surface of the substrate and optionally providing a pin hole free barrier layer on the electrically-conductive separation layer, forming a film structure on the electrically-conductive separation layer or, if present, the barrier layer, to yield a multilayer structure, and separating the film structure from the substrate by subjecting the multilayer structure to interfacial debonding that comprises contacting at least an interface between the film structure and the electrically-conductive separation layer or, if present, the barrier layer, with water or an electrolyte solution.