The present invention relates to a method for producing an engineered wood, comprising the steps of: (a) breaking down a veneer to increase its porosity; (b) impregnating the veneer from step (a) with an adhesive material; (c) drying the veneer from step (b) to a predetermined moisture content level; (d) arranging a plurality of the veneers from step (c) in a mould; and (e) pressing the plurality of the veneers in the mould. The engineered wood has an appearance of natural timber, and is able to withstand extreme weather conditions and have minimum warping, rotting and termite infestation.

Apparatus (1) for additively manufacturing three-dimensional objects (2) by means of successive layerwise selective irradiation and consolidation of layers of a build material (3) which can be consolidated by means of an energy source (5), wherein a measurement beam source (4, 17) is provided which is adapted to generate a measurement beam (7), wherein a beam guiding unit (20) is provided that is adapted to guide the measurement beam (7) in the build plane (6) in the process chamber, wherein a determination device (8) is adapted to determine at least one parameter relating to the object (2) and/or a build material layer (9) based on interference.

Photocurable adhesion-promoting compositions containing organic titanates and/or organic zirconates and partially reacted alkoxysilanes and the use of the photocurable adhesion-promoting compositions to provide adhesion between metal substrates and an overlying radiation-cured sealant are disclosed.

Provided is a cured product using a composition that is capable of quick curing at low temperatures while having sufficient pot life at room temperature, a method of producing the same, a laminate, and an optical device. A method of producing an organopolysiloxane cured product is provided. The method includes: (i) performing, without irradiating with high-energy radiation, a hydrosilylation reaction upon a composition containing a first hydrosilylation reaction catalyst that exhibits activity in the composition and a second hydrosilylation reaction catalyst that does not exhibit activity when not irradiated with high-energy radiation, but exhibits activity in the composition when irradiated with high-energy radiation, to obtain a thickened material that is fluid at room temperature or a thermoplastic material that is non-fluid at room temperature but exhibits fluidity at 100° C.; and (ii) irradiating the thickened material or thermoplastic material obtained in step (i) with high-energy radiation to obtain a cured product.

Adhesion-promoting compositions containing organic titanates and/or organic zirconates and the use of the adhesion-promoting compositions to provide adhesion-promoting layers to enhance adhesion between metal substrates and an overlying free radical-polymerized sealant are disclosed.

When forming layer stacks in the presence of solder material, uncontrolled flow of the solder material at the interface of two different layers of the layer stack may significantly be mitigated by providing an area of increased pressure in the material of the overlaying foil layer. For example, the area of increased pressure may be generated during the lamination process by providing a pressure inducing structure, for instance on the underlying foil layer, which laterally surrounds the solder material and therefore, in combination with the material of the overlying foil layer, reliably confines the solder material.

The present invention provides an antifouling film that is excellent in antifouling properties, adhesion, rubbing resistance, and reliability, and reduces fingerprint emergence at high humidity. The antifouling film includes a substrate; and a polymer layer disposed on a surface of the substrate and including on a surface thereof an uneven structure provided with projections at a pitch not longer than a wavelength of visible light, the polymer layer being a cured product of a polymerizable composition, the polymerizable composition containing, in terms of active components, 20 to 90 wt % of a polyfunctional acrylate containing an ethylene oxide group, 5 to 25 wt % of a monofunctional amide monomer, and 0.5 to 10 wt % of a fluorine-based release agent, the polymerizable composition containing, in terms of active components, a total of 40 to 65 wt % of the ethylene oxide group in the polyfunctional acrylate and the monofunctional amide monomer.

The present application provides a method for preparing a composite material. The present application provides a method for preparing a composite material comprising a metal foam and a polymer component, wherein the polymer component is formed in an asymmetrical structure on both sides of the metal foam, and a composite material prepared in such a manner.

An anisotropic conductive film configured to suppress flowing of conductive particles attributable to the flowing of an insulating resin layer at the time of anisotropic conductive connection, improve the conductive particle capturing properties, and reduce short circuits has a conductive particle dispersion layer including the conductive particles dispersed (or distributed) in the insulating resin layer. The insulating resin layer is a layer of a photo-polymerizable resin composition. The surface of the insulating resin layer in the vicinity of each of the conductive particles has an inclination or an undulation with respect to the tangent plane of the insulating resin layer in the center portion between the adjacent conductive particles.

A curable resin composition for forming an adhesive layer on at least one surface of a substrate (C), the curable resin composition comprising: a compound (A) represented by formula (1): ##STR00001##
wherein X represents a functional group containing a reactive group, and R.sup.1 and R.sup.2 each independently represent a hydrogen atom or an optionally substituted, aliphatic hydrocarbon, aryl, or heterocyclic group; and an adhesion aid compound (B), the curable resin composition satisfying formula (X): 10HSP (A)HSP (B)10 and formula (Y): 10HSP (C)HSP (B)10, wherein HSP (A) is an HSP value of the compound (A), HSP (B) is an HSP value of the adhesion aid compound (B), and HSP (C) is an HSP value of the substrate (C).