A method of making a light weight component is provided. The method including the steps of: forming a metallic foam core into a desired configuration; applying an external metallic shell to an exterior surface of the metallic foam core after it has been formed into the desired configuration; and attenuating the component to a desired frequency by forming a plurality of openings in the external metallic shell.

Noble metal-coated nanostructures and related methods are disclosed. According to an aspect, a nanostructure may include a structure comprising a base metal. As an example, the structure may be a nanowire. In a more specific example, the structure may be a copper nanowire or a nanowire made of a base metal such as nickel, tin, indium, zinc, the like, or combinations thereof. The base metal structure may be coated with a noble metal that conformally covers the base metal structure. Example noble metals include, but are not limited to, ruthenium, rhodium, palladium, silver, iridium, platinum, and gold. The coating may be made of one or more of the noble metals along with other materials.

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber. The present invention also needs to provide a method for manufacturing the heat equalization plate.

A sheet-type aerosol generating article includes at least two aerosol generating sheets each having aerosol generating material and an inductively heatable susceptor The inductively heatable susceptor is positioned between the aerosol generating sheets and each of the aerosol generating sheets has an exposed surface. Methods for manufacturing sheet-type aerosol generating articles are also disclosed.

A joined body of the embodiments is a joined body which includes copper and resin, wherein in a joint surface of the copper to the resin, a triazine thiol derivative, or the triazine thiol derivative and a silane coupling agent are bonded to a base surface and the silane coupling agent is bonded to an oxide film formed on part of the joint surface, respectively, and the copper and the resin are molecularly joined to each other. This configuration makes it possible to obtain a joined body having high reliability by molecularly joining both the base surface and the oxide film of the copper, and the resin securely and achieving a strong joint of the copper and the resin at a time of joining the copper and the resin even though the oxide film is formed on part of the joint surface of the copper.

There is provided herein a curing agent compound for curing thermosetting resins, e.g., epoxy resins, a composition comprising a thermoplastic and/or thermosetting resin, e.g., an epoxy resin and the curing agent, an article comprising the curing agent, and a method of making the curing agent.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

To provide a copper-clad laminate which maintains adhesion between a resin film and a conductor layer and which suppresses the occurrence of wrinkles. A copper-clad laminate has a base film containing a thermoplastic resin, an underlying metal layer film-formed on a surface of the base film by a dry plating method, and a copper layer film-formed on a surface of the underlying metal layer. The underlying metal layer has a mean thickness of 0.3 to 1.9 nm. Since the underlying metal layer has a mean thickness of 0.3 nm or more, it is possible to maintain adhesion between the base film and a conductor layer. Since the underlying metal layer has a mean thickness of 1.9 nm or less, it is possible to suppress an increase in the temperature of a film during film-forming of the underlying metal layer, and it is possible to suppress the occurrence of wrinkles.

Provided is an article of cookware and a method of making the same. The cookware has at least one stainless steel layer and at least one copper layer metallurgically bonded directly to the at least one stainless steel layer via solid state bonding. The at least one stainless steel layer may be a ferritic stainless steel layer, and the at least one copper layer may be a grain stabilized copper. The at least one stainless steel layer may be made from a 400 series stainless steel, such as a 436 stainless steel alloy, a 439 stainless steel alloy, or a 444 stainless steel alloy. The at least one copper layer may be made from a high purity, oxygen free copper alloy, such as a C101 copper alloy, a C102 copper alloy, or a C107 copper alloy.

Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D.sub.50) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D.sub.50) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.