Patent classifications
B32B2311/16
RADIANT HEATING SYSTEM FOR A MOTOR VEHICLE
A radiant heating system is provided for a motor vehicle. That radiant heating system includes a first surface configured to reflect IR radiation toward a motor vehicle occupant and a first IR heating element oriented to direct IR radiation toward the first surface whereby the motor vehicle occupant is warmed indirectly by the IR radiation emitted from the first IR heating element.
Insulated radiant barriers in apparel
Fabrics made for apparel, tents, sleeping bags and the like, in various composites, constructed such that a combination of substrate layers and insulation layers is configured to provide improved thermal insulation. The fabric composites are constructed to form a radiant barrier against heat loss via radiation and via conduction from a body.
MULTI-LAYERED PEROVSKITES, DEVICES, AND METHODS OF MAKING THE SAME
Methods are described that include contacting an alkyl ammonium metal halide film with an alkyl ammonium halide, where the alkyl ammonium metal halide film includes a first halogen and a metal, the alkyl ammonium halide includes a second halogen, such that the contacting forms an alkyl ammonium metal mixed-halide film that interfaces with the alkyl ammonium metal halide film, where the alkyl ammonium metal mixed-halide film includes the first halogen, the second halogen, and the metal.
TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.
Tin-plated copper-alloy terminal material
A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a CuSn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the CuSn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu.sub.6Sn.sub.5 alloy with Ni; and parts of the CuSn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 m to 0.6 m (inclusive); and an area rate of the exposed portions of the CuSn alloy layer relative to a surface area of is 1% to 40% (inclusive).
METHOD OF MANUFACTURING LAMINATED ARMORING MATERIAL
In laminating resin layers on both surfaces of a metal foil layer by adhering a heat-resistant resin layer to a first surface of the metal foil layer and adhering a heat-sealable resin layer to a second surface thereof, as an adhering method, by employing an adhesive agent unapplied portion forming and adhering process in which the resin layer and the metal foil layer are adhered together by applying an adhesive agent to a region of a joining face of both the layers excluding a part of the region so that an adhesive agent unapplied section is formed, a laminated body having the adhesive agent unapplied section is manufactured. A resin layer removal process for removing a resin layer corresponding to the adhesive agent unapplied section of the laminated body to expose the metal foil layer is performed.
Thin Diamond Film Bonding Providing Low Vapor Pressure at High Temperature
A thin diamond film bonded to a diamond substrate made by the process of heating a diamond substrate inside a vacuum chamber to about 500 C., cooling the diamond substrate, coating a first surface of the diamond substrate with chromium, depositing an initial layer of palladium, heating the diamond substrate, allowing the chromium and the diamond substrate to form a chemical bond, inter-diffusing the adhesion layer of chromium and the initial layer of palladium, cooling, depositing palladium, placing a shadow mask, degassing the vacuum, depositing a tin layer, assembling the tin layer, heating the tin layer, melting the tin layer, and bonding the thin diamond film to the diamond substrate. A thin diamond film bonded to a diamond substrate comprising a thin diamond film, a layer of chromium, palladium, tin, and a diamond substrate.
METHOD FOR PRODUCING HIGH-STRENGTH TINPLATE AND TINPLATE PRODUCED THEREWITH
A method for producing high strength three piece steel can body and cans produced therewith.
Method of manufacturing laminated armoring material
In laminating resin layers on both surfaces of a metal foil layer by adhering a heat-resistant resin layer to a first surface of the metal foil layer and adhering a heat-sealable resin layer to a second surface thereof, as an adhering method, by employing an adhesive agent unapplied portion forming and adhering process in which the resin layer and the metal foil layer are adhered together by applying an adhesive agent to a region of a joining face of both the layers excluding a part of the region so that an adhesive agent unapplied section is formed, a laminated body having the adhesive agent unapplied section is manufactured. A resin layer removal process for removing a resin layer corresponding to the adhesive agent unapplied section of the laminated body to expose the metal foil layer is performed.
Bonding method for thin film diamond providing low vapor pressure at high temperature
A thin diamond film bonded to a diamond substrate made by the process of heating a diamond substrate inside a vacuum chamber to about 500 C., cooling the diamond substrate, coating a first surface of the diamond substrate with chromium, depositing an initial layer of palladium, heating the diamond substrate, allowing the chromium and the diamond substrate to form a chemical bond, inter-diffusing the adhesion layer of chromium and the initial layer of palladium, cooling, depositing palladium, placing a shadow mask, degassing the vacuum, depositing a tin layer, assembling the tin layer, heating the tin layer, melting the tin layer, and bonding the thin diamond film to the diamond substrate. A thin diamond film bonded to a diamond substrate comprising a thin diamond film, a layer of chromium, palladium, tin, and a diamond substrate.