Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.

Methods of forming ceramic matrix composite structures include joining at least two lamina together to form a flexible ceramic matrix composite structure. Ceramic matrix composite structures include at least one region of reduced inter-laminar bonding at a selected location between lamina thereof. Thermal protection systems include at least one seal comprising a ceramic matrix composite material and have at least one region of reduced inter-laminar bonding at a selected location between lamina used to form the seal. Methods of forming thermal protection systems include providing one or more such seals between adjacent panels of a thermal protection system.

The ceramic structure 10 includes a discoid ceramic base 12 and an electrode 14 buried in the ceramic base 12. The ceramic base 12 is a sintered body composed principally of alumina or a rare-earth metal oxide and has a thermal expansion coefficient of 7.5 to 9.5 ppm/K over the range of 40° C. to 1200° C. The electrode 14 is composed principally of metal ruthenium. The electrode 14 may be formed in the shape of a sheet. Alternatively, the electrode 14 may be patterned in the manner of a one-stroke sketch so as to extend over the entire cross section of the ceramic base 12.

A composite body has a cermet member, a metal member and an intermediate member. The cermet member includes a cermet oxide phase and a cermet metal phase. The cermet oxide phase contains a Ni-containing oxide or an Fe-containing oxide. The cermet metal phase contains Ni. The intermediate layer contains Cu. The mass proportions of Cu in the cermet metal phase at points which are spaced apart by 10, 50, 100 and 1000 μm from the interface between the cermet member and the intermediate layer to the cermet member side are denoted by C10, C50, C100 and C1000 (mass %). When the mass proportions of Cu in the cermet oxide phase at points which are spaced apart by 10 and 100 μm from the interface to the cermet member side are denoted by M10 and M100 (mass %), C10>C50>C100>C1000, and 5>M10−M100>−5.

A coating architecture is disclosed that includes a substrate having a surface finish R.sub.a of 0.3μ or finer, an intermediate layer overlying and in contact with the substrate; and a solid lubricant layer overlying and in contact with the intermediate layer. The test results of applying the coating architecture to a reciprocating hammer drill utilizing the coating is also disclosed.

A composite substrate includes a supporting substrate and a functional substrate that are directly joined together, the supporting substrate being a sintered sialon body.

Cards made in accordance with the invention include a specially treated thin decorative layer attached to a thick core layer of metal or ceramic material, where the thin decorative layer is designed to provide selected color(s) and/or selected texture(s) to a surface of the metal cards. Decorative layers for use in practicing the invention include: (a) an anodized metal layer; or (b) a layer of material derived from plant or animal matter (e.g., wood, leather); or (c) an assortment of aggregate binder material (e.g., cement, mortar, epoxies) mixed with laser reactive materials (e.g., finely divided carbon); or (d) a ceramic layer; and (e) a layer of crystal fabric material. The cards may be dual interface smart cards which can be read in a contactless manner and/or via contacts.

The present invention provides a composite material of laminated curved glass and a manufacturing method thereof, the composite material of laminated curved glass includes a first glass plate, a prefabricated part, and an adhesive film configured between the first glass plate and the prefabricated part, the thickness of the first glass plate is 0.1 mm to 2.2 mm. The manufacturing method of the composite material of laminated curved glass includes processing the first glass plate with strengthening treatment, providing the adhesive film, laminating the first glass plate processed by the strengthening treatment, the adhesive film, and the prefabricated part in sequence, and then performing a low temperature press molding process to obtain the composite material of laminated curved glass. The method of the present bents the glass without high temperature to soften the glass.

An aluminum composite panel, containing an aerogel, includes an aerogel composite using a silica aerogel and a thermoplastic resin. A method for manufacturing the same includes providing an aluminum composite panel containing an aerogel, by molding an aerogel composite from a mixture of 1-90 wt % of a silica aerogel and 10-99 wt % of a thermoplastic resin, and then attaching aluminum plates on an upper surface and a lower surface of the aerogel composite, respectively, while an adhesive resin is coated on the upper surface and the lower surface. The aluminum composite panel containing an aerogel, manufactured according to the present invention, has a lower hygroscopic property than the conventional aluminum composite panel, due to the silica aerogel, and thus has an effect of exhibiting excellent adiabatic property and flame retardancy, retains excellent moldability, is light, and has an effect of facilitating a construction work.

A power module substrate allows prompt heat dissipation from a semiconductor device and avoids separation of a ceramic plate and a copper plate at their joint interface and cracks in the ceramic plate. A power module substrate for mounting a semiconductor device includes a ceramic plate, a copper circuit plate on a main surface of the ceramic plate, and a heat dissipation copper plate on a surface of the ceramic plate opposite to the main surface. The copper circuit plate includes at least one first copper circuit plate and at least one second copper circuit plate different from the first circuit board. The first copper circuit plate includes a first portion on which the semiconductor device is mountable, and a second portion outward from the first portion and surrounding the first portion and thinner than the first portion.