A laminate film manufacturing method is capable of preventing thickness unevenness of a cured layer and preventing wrinkling of the entire laminate film. A laminate film is manufactured by applying a coating solution including an active radiation curable resin to a surface of a first film that is continuously transported in an application part to form a coated film in a lamination part, laminating a second film that is continuously transported on the coated film to sandwich the coated film between the first film and the second film, and in a state in which the coated film is sandwiched between the first film and the second film, winding the first film around a backup roller and irradiating the coated film with infrared rays from an ultraviolet irradiation device while continuously transporting the first film to cure the coated film in a curing part so as to form a cured layer.

An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150° C. for 30 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≦2%, and (2) after heating at 200° C. for 10 minutes, 0.4≦|thermal contraction percentage in MD direction/thermal contraction percentage in TD direction|≦2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction≧3%.

An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

A production method of a laminate including a substrate and a light-transmitting support plate that are laminated each other via an adhesive layer and a release layer that is altered through absorption of light, the method including a release layer forming step of coating a reactive polysilsesquioxane on a surface of the support plate, the surface being opposed to the substrate, and heating the reactive polysilsesquioxane to perform polymerization, thereby forming the release layer.

A heat dissipation sheet includes a first sheet composed of a plurality of first carbon nanotubes, and a second sheet composed of a plurality of second carbon nanotubes, wherein the first sheet and the second sheet are coupled in a stacked state, and the first carbon nanotubes and the second carbon nanotubes are different in an amount of deformation when pressure is applied.

Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.

A flexible substrate mount for holding a first substrate when the first substrate is being detached from a second substrate, and detachment means for debonding of the second substrate by bending the first substrate. Furthermore, this invention relates to a device for detaching a first substrate from a second substrate in one detachment direction (L) with the following features: a substrate mount for holding the first substrate, said first substrate mount being flexible in the detachment direction (L), a substrate mount for holding the second substrate and detachment means for the debonding of the first substrate from the second substrate as the first substrate bends, and a method of using the same.

Disclosed herein is a method comprising disposing a first composition comprising a first block copolymer upon a substrate; where the first block copolymer comprises a first segment and a second segment that are covalently bonded to each other and that are chemically different from each other; where the first segment has a first surface free energy and where the second segment has a second surface free energy; and disposing a second composition comprising an second copolymer upon a free surface of the first block copolymer; where the second copolymer comprises a surface free energy reducing moiety; where the surface free energy reducing moiety has a lower surface free energy than the first surface free energy and the second surface free energy; the second copolymer further comprising one or more moieties having an affinity to the first block copolymer; where the surface free energy reducing moiety is chemically different from the first segment and from the second segment.

A resin composition of the present invention is a resin composition used for forming a stress relaxation layer (102) of a metal base copper-clad laminate (100) configured by laminating a metal plate (101), the stress relaxation layer (102), and a piece of copper foil (103) in this order, the resin composition including: an epoxy resin having a polyether structure; a phenoxy resin; and a heat dissipation filler, in which the resin composition satisfies a characteristic of a storage elastic modulus at 25° C. being equal to or more than 0.01 GPa and equal to or less than 1.6 GPa.

A problem of The present invention is to provide a curable composition capable of forming a resist which can be easily washed after curing and which has high dry etching resistance and excellent precision of fine pattern transfer, also provide a resist film and a laminate each containing the curable composition, and further provide a pattern forming method using the resist film. The problem of the present invention can be solved by providing a curable composition containing a multifunctional polymerizable monomer (A) which has two or more groups having a polymerizable group and has at least one group Q having a polymerizable group represented by formula (1) below, the amount of silicon atoms in an nonvolatile content being 10 wt % or more.