A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.

A curing process includes providing a hybrid material comprising a conductive filler in contact with a thermosetting resin. In addition, the curing process includes passing an electric current through the hybrid material to provide Joule heating until a temperature of the hybrid material reaches a temperature above a curing temperature of the thermosetting resin.

The laminate of the present disclosure includes multiple glass ceramic layers each containing quartz and a glass that contains SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, and M.sub.2O, where M is an alkali metal. The B concentration of a surface layer portion of the laminate is lower than the B concentration of an inner layer portion of the laminate.

A multicomponent dielectric film includes overlapping dielectric layers and outer layers that have a higher surface energy compared to the overlapping dielectric layers, the overlapping dielectric layers including at least a first polymer material, a second polymer material, and optionally a third polymer material, adjoining dielectric layers defining a generally planar interface therebetween which lies generally in an x-y plane of an x-y-z coordinate system, the interfaces between the layers delocalizing the charge build up in the layers.

A system and method for an energy storing electrical device includes a first conductive electrode, a second conductive electrode, an electrolyte disposed between the first conductive electrode and a second conductive electrode, each electrode further comprising an integrated first layer and a second layer, and; wherein the second layer comprises a substrate, the substrate comprising a textile portion or a polymer portion and a conductive layer formed by a noble metal disposed on and attached to the substrate.

A release film for high-capacity multilayer ceramic capacitor (MLCC) 0.5-0.8 μm ceramic slurry and a production method thereof. The release film includes at least three layers of co-extruded polyester resin having a layer A, a layer B and a layer C, and stretching the same in longitudinal and transverse directions. In addition, the layer B includes recycled polyester resin, the layers A and C include new polyester resin raw materials, and a releasing agent having a phenyl releasing control agent. The production method for the release film includes coating a releasing agent on one or both sides of a polyester film, and winding into a roll after drying and hardening.

It is intended to improve formability of a battery packaging material. A sealant film 20 for a battery packaging material is a multi-layer material composed of a first non-stretched film layer 21 in which one surface thereof serves as a surface of the innermost layer of the battery packaging material 1, and one or more other non-stretched film layers 22 and 23 laminated on the other surface side of the first non-stretched film layer 21. The first non-stretched film layer 21 contains a random copolymer containing a monomer other than propylene and propylene as a copolymerization component, a homopolymer of propylene, a lubricant, and a content rate of the homopolymer to a total amount of the random copolymer and the homopolymer is 5 wt % to 30 wt %.

A film-shaped packaging material for a cell in which a coating layer is provided as the outermost layer instead of a substrate layer and an adhesive layer in a conventional film-shaped packaging material for a cell, thereby making it possible to produce a thinner film; wherein the packaging material is provided with exceptional moldability and insulation performance and enables lead time to be reduced. The packaging material is a laminate having at least a coating layer, a barrier layer, and a sealant layer in the stated order, the coating layer including a single- or multiple-layer configuration formed by a cured product of a resin composition containing a heat-curable resin and curing accelerator, the laminate having a piercing strength of at least 5 N, as measured in compliance with JIS 1707:1997, and the coating layer having a breakdown voltage of at least 1.0 kV, as measured in compliance with JIS C2110-1.

Disclosed are biaxially stretched polyolefin films containing a) 10 to 45% by weight of a cycloolefin polymer with a glass transition temperature between 120 and 170° C., and b) 90 to 55% by weight of a semi-crystalline alpha-olefin polymer with a crystallite melting temperature between 150 and 170° C., wherein the glass transition temperature of component a) being less than or equal to the crystallite melting temperature of component b), and wherein the polyolefin film has a shrinkage at 130° C. after 5 minutes, as measured according to ISO 11501, of less than or equal to 2%.

These polyolefin films are excellent suited as dielectrics for capacitors but also for other applications and are distinguished by a low shrinkage at high temperatures.

A transfer film including, on a temporary support, a first transparent layer including at least a polymerizable monomer and a resin, a second transparent layer including at least metal oxide particles and a resin and having an average thickness of less than 200 nm, and a third transparent layer having an average thickness that is smaller than the average thickness of the second transparent layer sequentially from a temporary support side, and application thereof. The third transparent layer has a percentage of metal atoms in all atoms in the layer which is smaller than a percentage of metal atoms in all atoms in the second transparent layer, or a percentage of metal atoms in all atoms of 2% or less in a 300 μm×300 μm area in the case of being measured from an outermost surface opposite to a surface in contact with the second transparent layer using X-ray photoelectron spectroscopy.