A method of manufacturing a hybrid security structure for a security document, the method comprising the steps of: providing a document substrate; applying to the document substrate, by a first process, a first element comprising a first electrically conductive region of the hybrid security structure; applying to the document substrate, by a second process, a second element comprising a second electrically conductive region of the hybrid security structure, wherein the first process is different from the second process; and electrically coupling the first and second electrically conductive regions of the hybrid security structure for detection by a capacitance sensor.

In order to provide a document of value or security document 1000 having an electronic circuit 1270 with increased mechanical stability, in particular to bending load, it is proposed to form the document of value or security document 1000 from at least two document layers 1100, 1200, 1300, 1400 arranged in a stack and connected to one another by means of a joining process, wherein the stack is formed by a supporting structure layer 1100 and a circuit carrier layer 1230 carrying the electronic circuit 1270. The supporting structure layer 1100 is formed from a fiber composite material.

In order to provide a document of value or security document 1000 having an electronic circuit 1270 with increased mechanical stability, in particular to bending load, it is proposed to form the document of value or security document 1000 from at least two document layers 1100, 1200, 1300, 1400 arranged in a stack and connected to one another by means of a joining process, wherein the stack is formed by a supporting structure layer 1100 and a circuit carrier layer 1230 carrying the electronic circuit 1270. The supporting structure layer 1100 is formed from a fiber composite material.

Apparatuses and methods are provided for manufacturing a transaction card. The disclosed apparatuses and methods may be used to form a transaction card frame configured to house a data storage component. The card frame may be formed of a resin mixture comprising a thermoplastic elastomer (TPE). The card frame may also have a Shore D hardness in the range of 20-80.

Apparatuses and methods are provided for manufacturing a transaction card. The disclosed apparatuses and methods may be used to form a transaction card frame configured to house a data storage component. The card frame may be formed of a resin mixture comprising a thermoplastic elastomer (TPE). The card frame may also have a Shore D hardness in the range of 20-80.

According to one example, there is provided a visual security feature. The visual security feature comprises a security feature printed on a media. The security feature includes a security code printed on the media, and a holographic image is embossed on the printed security feature.

According to one example, there is provided a visual security feature. The visual security feature comprises a security feature printed on a media. The security feature includes a security code printed on the media, and a holographic image is embossed on the printed security feature.

Thermal transfer image data is used to transfer part of a transfer material layer in a transfer ribbon to an image-receiving layer in an intermediate transfer ribbon to form a plurality of image cells on the intermediate transfer ribbon. A method for providing thermal transfer image data includes converting a multitone input image into a multitone image having fewer different tone values than the input image, based on a predetermined threshold; and dithering respective tone values of the image.

A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body, equipped with: an IC module having an IC chip capable of performing contactless communication; a hinge layer having a hinge section which can be bound into a booklet; a non-hinge layer which is laminated onto the hinge layer and does not have a hinge part, wherein the hinge layer is disposed over the entire surface of the laminated body having the hinge, the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and the IC module is housed and held inside the housing hole.

A plastic card is printed on by transferring an adhesive to a surface of the plastic card from a thermal transfer ribbon using a thermal printhead. A donor material is then applied over the transferred adhesive to adhere the donor material to the card surface with portions of the card surface not containing the transferred adhesive not being covered by the donor material. The techniques described herein permit the addition of high value features, such as three dimensional features, matte finishes, metallic or metallic appearing features, optical structures, and the like, to the surfaces of plastic cards. In addition, the techniques described herein can be integrated into existing card processing systems, such as central issuance card processing systems, that use thermal printing technology.