A method may be provided for manufacturing coated panels of the type including at least a substrate and a top layer with a motif. The top layer may be provided on the substrate. The method may involve providing a synthetic material layer on the substrate. A relief may be provided on the surface of said synthetic material layer provided on the substrate. The relief may include a pattern of recesses. The pattern may be at least partially determined by at least one print that is applied by inkjet printing. The relief may be obtained by printing a mask directly on the synthetic material layer. After providing the mask, the synthetic material layer may be cured. The mask may provide for selective curing of the synthetic material layer, such that the synthetic material layer is not solidified or solidified at a lesser extent in correspondence of the mask. The not solidified or less solidified portions of the synthetic material layer may be removed by performing a material-removing treatment on the synthetic material layer thereby obtaining the relief. The material-removing treatment may involve removing the mask.

A method may be provided for manufacturing coated panels of the type including at least a substrate and a top layer with a motif. The top layer may be provided on the substrate. The method may involve providing a synthetic material layer on the substrate. A relief may be provided on the surface of said synthetic material layer provided on the substrate. The relief may include a pattern of recesses. The pattern may be at least partially determined by at least one print that is applied by inkjet printing. The relief may be obtained by printing a mask directly on the synthetic material layer. After providing the mask, the synthetic material layer may be cured. The mask may provide for selective curing of the synthetic material layer, such that the synthetic material layer is not solidified or solidified at a lesser extent in correspondence of the mask. The not solidified or less solidified portions of the synthetic material layer may be removed by performing a material-removing treatment on the synthetic material layer thereby obtaining the relief. The material-removing treatment may involve removing the mask.

A method including: a first step of forming a mask member having a structure in which a magnetic metal member provided with through-holes is in tight contact with one surface of a film; a second step of forming a plurality of preliminary opening patterns by subjecting the film to penetration processing by irradiating laser beams at predetermined regular positions in the plurality of through-holes; and a third step of performing laser processing so as to form each opening pattern over the corresponding preliminary opening pattern, is provided.

The invention provides a chemical-mechanical polishing composition comprising: (a) colloidal silica particles that are surface modified with metal ions selected from Mg, Ca, Al, B, Be, and combinations thereof, and wherein the colloidal silica particles have a surface hydroxyl group density of from about 1.5 hydroxyls per nm.sup.2 to about 8 hydroxyls per nm.sup.2 of a surface area of the particles, (b) an anionic surfactant, (c) a buffering agent, and (d) water, wherein the polishing composition has a pH of about 2 to about 7, and wherein the polishing composition is substantially free of an oxidizing agent that oxidizes a metal. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon nitride, silicon oxide, and/or polysilicon.

A manufacturing method of contact probes for a testing head comprises the steps of:—providing a substrate made of a conductive material; and—defining at least one contact probe by laser cutting the substrate. The method further includes at least one post-processing fine definition step of at least one end portion of the contact probe, that follows the step of defining the contact probe by laser cutting, the end portion being a portion including a contact tip or a contact head of the contact probe. The fine definition step does not involve a laser processing and includes geometrically defining the end portion of the contact probe with at least a substantially micrometric precision.

A manufacturing method of contact probes for a testing head comprises the steps of:—providing a substrate made of a conductive material; and—defining at least one contact probe by laser cutting the substrate. The method further includes at least one post-processing fine definition step of at least one end portion of the contact probe, that follows the step of defining the contact probe by laser cutting, the end portion being a portion including a contact tip or a contact head of the contact probe. The fine definition step does not involve a laser processing and includes geometrically defining the end portion of the contact probe with at least a substantially micrometric precision.

The CMP polishing liquid of the invention comprises a metal salt containing at least one type of metal selected from the group consisting of metals of Groups 8, 11, 12 and 13, 1,2,4-triazole, a phosphorus acid, an oxidizing agent and abrasive grains. The polishing method of the invention comprises a step of polishing at least a palladium layer with an abrasive cloth while supplying a CMP polishing liquid between the palladium layer of a substrate having the palladium layer and the abrasive cloth, wherein the CMP polishing liquid comprises a metal salt containing at least one type of metal selected from the group consisting of metals of Groups 8, 11, 12 and 13, 1,2,4-triazole, a phosphorus acid, an oxidizing agent and abrasive grains.

Provided is a substrate processing method of filling a recess of a predetermined uneven pattern formed on a substrate with a film forming material by performing a first film forming processing, a first etching processing and a second film forming processing on the substrate, using a vertical substrate processing apparatus and a control apparatus controlling operations of the vertical substrate processing apparatus. The method includes calculating a first film forming condition, a first etching condition, and a second film forming condition by the control apparatus such that the film forming material is filled in the recess without any void after the second film forming processing; and performing the first film forming processing, the first etching processing and the second film forming processing on the substrate based on the calculated first film forming condition, first etching condition and second film forming condition.

An etching method includes etching a silicon substrate with a liquid composition containing an alkaline organic compound, water, and a boron compound with a content in the range of 1% by mass to 14% by mass. The boron compound is at least one of boron sesquioxide, sodium tetraborate, metaboric acid, sodium perborate, sodium borohydride, zinc borate, and ammonium borate.

A regular metallic, cylindrical tubular needle cannula (1) is subjected to a metal etching liquid (21) in the inside lumen (4) thereby increasing the inside diameter and enhancing the flow properties while maintaining the outside appearance. The inside diameter is only increased over a controlled length (7) of the full length of the needle cannula (1) leaving sufficient length and wall thickness to also taper the outside diameter.