A method for processing carbon nanotubes includes positioning in a treatment chamber of a carbon nanotube processing apparatus a substrate having multiple carbon nanotubes bundled together and oriented substantially perpendicular to a surface of the substrate, and introducing a microwave into the treatment chamber from a planar antenna having multiple microwave radiation holes such that plasma of an etching gas is generated and that the plasma etches the carbon nanotubes starting from one end of the carbon nanotubes bundled together.

Disclosed are sulfur-containing compounds for plasma etching channel holes, gate trenches, staircase contacts, capacitor holes, contact holes, etc., in Si-containing layers on a substrate and plasma etching methods of using the same. The plasma etching compounds may provide improved selectivity between the Si-containing layers and mask material, less damage to channel region, a straight vertical profile, and reduced bowing in pattern high aspect ratio structures.

An inductively coupled plasma source for a focused charged particle beam system includes a conductive shield within the plasma chamber in order to reduce capacitative coupling to the plasma. The internal conductive shield is maintained at substantially the same potential as the plasma source by a biasing electrode or by the plasma. The internal shield allows for a wider variety of cooling methods on the exterior of the plasma chamber.

A method for fabricating a window member is provided. A transparent substrate including a transmitting region and a non-transmitting region may be prepared. A light curable adhesive layer may be disposed on the transparent substrate. A plurality of micro patterns may be disposed on the transparent substrate or the light curable adhesive layer in the non-transmitting region. The light curable adhesive layer may be cured by light irradiation. The light curable adhesive layer may include a transparent adhesive. A storage modulus of the transparent adhesive may be greater than or equal to about 10.sup.3 Pa and less than about 10.sup.6 Pa at room temperature before curing, and greater than or equal to about 10.sup.6 Pa at room temperature after curing.

A first etching rate of the first conductive film is calculated by acquiring correlation between an opening ratio of an etching mask and an etching rate of an etching target film, and then, performing a first dry etching to a first conductive film formed on a first wafer. Next, a second etching mask is formed on a second conductive film formed on a second wafer, and an etching time of the second conductive film is determined from the correlation between the opening ratio and the etching rate, the first etching rate, and a film thickness of the second conductive film when the second conductive film is subjected to a second dry etching in time-controlled etching.

This invention provides a method for manufacturing a decorative-part that makes it surely and easily possible to provide fine hairline-patterns that are similar to real texture by a laser-drawing process. By the method for manufacturing the decorative part, a laser-drawing process is done onto the coating-film 21 that has been formed on the surface 13 of the three-dimensional part-material 12. In this process a laser-processed groove-group 23 consists of a number of laser-processed grooves 24, 25, thus providing the hairline-pattern 22 on the coating-film 21. The laser processed groove-group 23 consists of various types of arc-like laser-processed grooves 24, 25 that comprise different curvature radii R of 1,000 mm or more. The arc-like laser-processed grooves 24, 25 are arranged extending appropriately in the same direction and of which each groove crosses at three degrees or less in irregular overlaps that show the line of each groove being wider than any other part.

A laser etching system for forming customized image patterns on workpieces, includes a computer that receives a product image and generates a label image, a laser head to emit a laser beam, a transport system that can scan the laser head across a workpiece or a label associated with the workpiece, a laser head driver that can modulate the laser beam in accordance to the product image or the label image that uniquely identifies the workpiece, and a power controller that can set the laser beam a first power level or a second power level. The laser head can scan across and etch the workpiece at the first power level in pixel-wise fashion to reproduce the product image on the workpiece. The laser head can scan across and etch the label at the second power level in pixel-wise fashion to reproduce the label image on the label.

A lighted assembly includes a perforated member having a plurality of relatively small openings therethrough. The openings are arranged to provide areas forming letters, designs, or the like. A light source may be positioned adjacent the perforated member whereby light from the light source travels through the openings to form illuminated letters, designs or the like. The perforations may be filled with a light-transmitting polymer material. The light source may comprise an LED and a light guide that distributes light along a lower side of the perforated member. The light source may be positioned in a waterproof housing that is sealed to the perforated member.

A method of manufacturing a structure includes (1) positioning a first resin layer provided on a first supporting member on a substrate having a through hole, with the first resin layer facing toward the substrate, and releasing the first supporting member from the first resin layer; and (2) positioning a second resin layer provided on a second supporting member on the first resin layer from which the first supporting member has been released, with the second resin layer facing toward the first resin layer, and releasing the second supporting member from the second resin layer. A first resin layer portion that is above the through hole is removed before or simultaneously with the releasing of the first supporting member.

A method of fabricating a thin film battery may comprise: depositing a first stack of blanket layers on a substrate, the first stack comprising a cathode current collector, a cathode, an electrolyte, an anode and an anode current collector; laser die patterning the first stack to form one or more second stacks, each second stack forming the core of a separate thin film battery; blanket depositing an encapsulation layer over the one or more second stacks; laser patterning the encapsulation layer to open up contact areas to the anode current collectors on each of the one or more second stacks; blanket depositing a metal pad layer over the encapsulation layer and the contact areas; and laser patterning the metal pad layer to electrically isolate the anode current collectors of each of the one or more thin film batteries. For electrically non-conductive substrates, cathode contact areas are opened-up through the substrate.