An improved packaging machine, comprising: a rest surface (2) for supporting one or more blanks (B) intended to form a quadrangular packaging (C); containing means (3), structured for containing a plurality of blanks (B) destined to form the packaging; handier means (4), structured so as to pick up the blanks (B) from the containing means (3) and to arrange them on the rest surface (2), folder means (5), structured so as to fold the blanks (B) in such a way as to form the packaging; a store (31,32,33,34) for each side of the packaging (C); a handier (41,42,43,44) for each side of the packaging (C).

A transportation system for semiconductor substrates includes a tray, lid and packaging bag. The tray includes a bottom and circumferential sidewalls. The tray has an opening on a top side and is configured to receive semiconductor substrates through the opening, the substrates being stacked onto each other in the tray in parallel to the tray bottom. The lid includes a cover plate and at least two arms extending from the plate. The arms are configured to be inserted into the tray between the tray sidewalls and the semiconductor substrates. The cover plate is configured to cover the tray opening when the lid is fully mounted to the tray. The packaging bag is configured to enclose the tray with the substrates stacked therein and lid arranged thereon, and to be evacuated of air and sealed such that the tray and lid arranged in the bag are vacuum sealed inside the bag.

A transportation system for semiconductor substrates includes a tray, lid and packaging bag. The tray includes a bottom and circumferential sidewalls. The tray has an opening on a top side and is configured to receive semiconductor substrates through the opening, the substrates being stacked onto each other in the tray in parallel to the tray bottom. The lid includes a cover plate and at least two arms extending from the plate. The arms are configured to be inserted into the tray between the tray sidewalls and the semiconductor substrates. The cover plate is configured to cover the tray opening when the lid is fully mounted to the tray. The packaging bag is configured to enclose the tray with the substrates stacked therein and lid arranged thereon, and to be evacuated of air and sealed such that the tray and lid arranged in the bag are vacuum sealed inside the bag.

A method for realising a package that comprises the following steps: arranging a first longitudinal edge (2) of the package in a substantially horizontal position; stacking a predefined number of ceramic tiles (T) to form a pile (P) on the 5 first longitudinal edge (2); arranging a second longitudinal edge (3) of the package on the pile (P); associating a bottom (4) of the package with a first longitudinal side of the first and of the second longitudinal edge (2,3); associating a first transversal edge (5) of the package with a first 10 transversal side of the first and of the second longitudinal edge (2,3); associating a second transversal edge (6) of the package with a second transversal side of the first and of the second longitudinal edge (2,3); rotating the package resting on the bottom (4).

A method for realising a package that comprises the following steps: arranging a first longitudinal edge (2) of the package in a substantially horizontal position; stacking a predefined number of ceramic tiles (T) to form a pile (P) on the 5 first longitudinal edge (2); arranging a second longitudinal edge (3) of the package on the pile (P); associating a bottom (4) of the package with a first longitudinal side of the first and of the second longitudinal edge (2,3); associating a first transversal edge (5) of the package with a first 10 transversal side of the first and of the second longitudinal edge (2,3); associating a second transversal edge (6) of the package with a second transversal side of the first and of the second longitudinal edge (2,3); rotating the package resting on the bottom (4).

Spacers include a base configured to be placed within depressions of one of a cover or a baseplate of a reticle pod, and a contact surface configured to contact the other of the cover and the baseplate. The spacers are configured to space the cover and the baseplate apart from one another such that sealing surfaces of the cover and the baseplate are separated by a gap. The depressions can be gripper pockets of the baseplate. Multiple spacers can be used in a reticle pod to provide the gap between sealing surfaces. The spacers can be installed to prepare a reticle pod for shipment.

Spacers include a base configured to be placed within depressions of one of a cover or a baseplate of a reticle pod, and a contact surface configured to contact the other of the cover and the baseplate. The spacers are configured to space the cover and the baseplate apart from one another such that sealing surfaces of the cover and the baseplate are separated by a gap. The depressions can be gripper pockets of the baseplate. Multiple spacers can be used in a reticle pod to provide the gap between sealing surfaces. The spacers can be installed to prepare a reticle pod for shipment.

Disclosed is a method for packaging an optical lens including two faces and a peripheral edge, at least one of the faces having a convexity marked by a peak point, the method including the following steps: a step of depositing a protective strip made from a rigid material at least partially along the edge, the width of the strip extending beyond the peak point of the convex face of the lens; a step of inserting the lens into an envelope delimited by a wall; a step of positioning the lens in the envelope, such that the protective strip acts as a spacer in order to maintain a distance between the wall of the envelope and the convex face of the lens and thus preventing any contact between the wall and the face.

Disclosed are a method for packaging a display panel, a display panel packaging box, and a packaging box body (100). The method includes: placing and fixing one display panel in a packaging box body (100), and the part of the display panel having a driving circuit board faces a first direction, the part of the display panel having a panel module faces a second direction, the first direction is opposite to the second direction; and placing and fixing another display panel in the packaging box body (100), and the part of the another display panel having the panel module faces the first direction, the part of the another display panel having the driving circuit board facing the second direction.

Disclosed are a method for packaging a display panel, a display panel packaging box, and a packaging box body (100). The method includes: placing and fixing one display panel in a packaging box body (100), and the part of the display panel having a driving circuit board faces a first direction, the part of the display panel having a panel module faces a second direction, the first direction is opposite to the second direction; and placing and fixing another display panel in the packaging box body (100), and the part of the another display panel having the panel module faces the first direction, the part of the another display panel having the driving circuit board facing the second direction.