B81B3/0018

SCANNING MIRROR AND MANUFACTURING METHOD FOR SCANNING MIRROR
20220066198 · 2022-03-03 · ·

A scanning mirror can prevent the oxidation or hydroxylation of a torsion bar, thereby suppressing deterioration of the torsion bar and a manufacturing method for the scanning mirror. A scanning mirror has a torsion bar which is provided so as to support a mirror portion and of which the surface is covered with an ALD layer. The scanning mirror is configured such that the mirror portion can be rotated around an axis that extends along the torsion bar when torsional force is applied to the torsion bar. The scanning mirror is manufactured by forming the mirror portion and the torsion bar and then forming an ALD layer on at least the surface of the torsion bar using an atomic layer deposition method.

Quartz MEMS piezoelectric resonator for chipscale RF antennae

A RF antenna comprises a quartz resonator having electrodes disposed thereon with a magnetostrictive film disposed on the quartz resonator either on, partially under or adjacent at least one of the electrodes. A RF antenna having a magnetostrictive film may be made by patterning selected portions of a top surface of the quartz wafer for deposition of electrode metal and deposition of the magnetostrictive film and depositing the electrode metal and the magnetostrictive film; temporarily bonding the quartz wafer to a handle wafer; thinning the quartz wafer to a desired thickness; etching the quartz wafer to define the outlines of at least one quartz resonator bearing the electrode metal and the magnetostrictive film; patterning selected portions of a bottom surface the at least one quartz resonator for deposition of electrode metal and at least one bond pad and depositing the electrode metal and the at least one bond pad; bonding the at least one quartz resonator to a substrate wafer; and releasing the at least one quartz resonator from the handle wafer.

LIDAR PROJECTION APPARATUS
20210333405 · 2021-10-28 ·

Described herein are systems and methods for ToF imaging of a target. The ToF imaging system includes an optical splitter that splits the light beam from a light source into multiple transmitting light beams. The transmitting light beams are directed towards a target, and one or more portions return as reflected light beams. A detector generates detector signals, representative of the reflected light beams. An electronically-controlled mirror is used to change the angular position of the transmitting light beams incident on the target, so that different regions of the target can be measured at different time instants. The ToF imaging system uses a flash and scan process to flash one region(s) of the target with the transmitting light beams during one sub-frame exposure and to scan other region(s) of the target during subsequent sub-frame exposures. An image processing apparatus constructs target information from multiple sub-frame exposure.

METHOD FOR MANUFACTURING A MICROMECHANICAL STRUCTURE AND MICROMECHANICAL STRUCTURE
20210331916 · 2021-10-28 ·

A method for manufacturing a micromechanical structure and a micromechanical structure. The method includes: forming a first micromechanical functional layer; forming a plurality of trenches in the first micromechanical functional layer, which include an upper widened area at the upper side of the first micromechanical functional layer and a lower area of essentially constant width; depositing a sealing layer on the upper side of the first micromechanical functional layer to seal the plurality of trenches, a sealing point of the plurality of trenches being formed below the upper side of the first micromechanical functional layer and the first trenches being at least partially filled; thinning back the sealing layer by a predefined thickness; and forming a second micromechanical functional layer above the thinned-back sealing layer.

MEMS-Sensor

A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

ACTUATOR WITH BUCKLING MEMBER STABILITY
20210317868 · 2021-10-14 ·

A device includes a frame including a first end and a second end; a mechanism including a first side that faces the first end of the frame, and a second side that faces the second end of the frame; a first buckling member attached to the first side of the mechanism and the first end of the frame; a second buckling member attached to the second side of the mechanism and the second end of the frame; and at least one actuator that engages the mechanism, the first buckling member, and the second buckling member in a selective sequence causing the mechanism to articulate between the first end and the second end of the frame. Engagement of the first buckling member and the second buckling member by the at least one actuator causes the first buckling member and the second buckling member to buckle and unbuckle in the selective sequence.

MEMS microphone, a manufacturing method thereof and an electronic apparatus
11111131 · 2021-09-07 · ·

A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane monolithically integrated with the MEMS microphone chip; and a housing including an acoustic port, wherein the MEMS microphone device is mounted in the housing, and the mesh membrane is arranged between the MEMS microphone chip and the acoustic port as a particle filter for the MEMS microphone chip.

MICROELECTROMECHANICAL STRUCTURE INCLUDING A FUNCTIONAL ELEMENT SITUATED IN A CAVITY OF THE MICROELECTROMECHANICAL STRUCTURE
20210229986 · 2021-07-29 ·

A microelectromechanical structure, including a functional element situated in a cavity of the microelectromechanical structure. The functional element includes an aluminum nitride layer. The cavity is closed by a cap layer. The cap layer includes epitaxial silicon. A method for manufacturing a micromechanical structure is also described.

Micromachined multi-axis gyroscopes with reduced stress sensitivity

In a general aspect, a micromachined gyroscope can include a substrate and a static mass suspended in an x-y plane over the substrate by a plurality of anchors attached to the substrate. The static mass can be attached to the anchors by anchor suspension flexures. The micromachined gyroscope can include a dynamic mass surrounding the static mass and suspended from the static mass by one or more gyroscope suspension flexures.

NO-GEL PRESSURE SENSOR PACKAGE

A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.