Circuits and methods for compensating microelectromechanical system (MEMS) gyroscopes for quality factor variations are described. Quality factor variations arise when mechanical losses are introduced in the gyroscope's resonator, for example due to thermoelastic damping or squeeze-film damping, which may hinder the gyroscope's ability to accurately sense angular velocity. Quality factor compensation may be performed by generating a compensation signal having a time decay rate that depends on the quality factor of resonator. In this way, artifacts that may otherwise arise in gyroscope's output are limited. Additionally, or alternatively, quality factor compensation may be performed by controlling the force with which the gyroscope's resonator is driven. This may be achieved, for example, by controlling the average value of the drive signal.

A microelectromechanical (MEMS) sensor comprises MEMS components located within a MEMS layer and located relative to one or more electrodes. A plurality of proof masses are located within the MEMS layer and are not electrically coupled to each other within the MEMS layer. Both the first proof mass and the second proof mass move relative to at least a common electrode of the one or more electrodes, such that the relative position of each of the proof masses relative to the electrode may be sensed. A sensed parameter may be determined based on the sensed relative positions.

Microelectromechanical systems (MEMS) gyroscopes and related measurement and calibration techniques are described. Various embodiments facilitate phase estimation of an ideal phase for a demodulator mixer associated with an exemplary MEMS gyroscope using quadrature tuning, which can improve offset performance over life time for exemplary MEMS gyroscopes. Exemplary embodiments can comprise adjusting a quadrature component of an exemplary MEMS gyroscope sense signal, measuring a change in offset of the exemplary MEMS gyroscope at an output of a demodulator mixer associated with the exemplary MEMS gyroscope, estimating a phase error between the quadrature component and a demodulation phase angle of the demodulator mixer based on the change in the offset, and periodically adjusting the demodulation phase angle of the demodulator mixer based on the phase error.

Microelectromechanical and/or nanoelectromechanical device comprising a fixed part (4), at least one suspended part (2) intended to be moveable in the plane of said device with respect to the fixed part (4) along at least one first direction (Y), a first means (6) for suspending said suspended part (2), said first suspension means (6) comprising two suspension elements (8.1, 8.2) each suspension element (8.1, 8.2) comprising a first end fixed directly to the suspended part (2) and a second end connected to the fixed part (4), each suspension element (8.1, 8.2) having a half-ellipse shape in the plane and extending between the first end and the second end, the two suspension elements (8.1, 8.2) being arranged with respect to each other so as to form an ellipse.

Microelectromechanical and/or nanoelectromechanical device comprising a support and at least one moveable element so as to be able to be displaced translationally with respect to the support, a means (G1) for translationally guiding said element, said guiding means (G1) comprising two rigid arms (6), a rotating articulation (12, 10) between each arm (6, 8) and the moveable element (4) and a rotating articulation (10, 14) between each arm (6, 8) and the support, the guiding means (G1) also comprising a coupling articulation (18) between the two arms having at least rotating articulation, said rotating articulations having axes of rotation at least parallel with each other such that during a translational displacement of the moveable element (4) the arms (6, 8) pivot with respect to each other in opposite directions, the rotating articulations being made by torsionally deformable beams.

A microelectromechanical system (MEMS) test structure includes a plurality of capacitors formed from sense electrodes and capacitive plates having a predetermined geometry and size associated with a related MEMS device such as a MEMS sensor. Based on the predetermined relationships between the capacitors of the test structure, and between the test structure and the MEMS devices, an effect of fringing fields on the sensed capacitances of the MEMS devices may be eliminated, and the capacitive gap of the MEMS device may be accurately measured.

In some embodiments, a LIDAR system may include at least one processor configured to control at least one light source for projecting light toward a field of view and receive from at least one first sensor first signals associated with light projected by the at least one light source and reflected from an object in the field of view, wherein the light impinging on the at least one first sensor is in a form of a light spot having an outer boundary. The processor may further be configured to receive from at least one second sensor second signals associated with light noise, wherein the at least one second sensor is located outside the outer boundary; determine, based on the second signals received from the at least one second sensor, an indicator of a magnitude of the light noise; and determine, based on the indicator the first signals received from the at least one first sensor and, a distance to the object.

An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.

A method for manufacturing package structure is provided, including: providing a substrate having recesses; forming first MEMS chips on the substrate, each with a through-substrate via, and a first sensor or microactuator on the lower surface, located in one of the recesses; forming first intermediate chips on the substrate, each respectively on one of the first MEMS chips, having a through-substrate via, and including a signal conversion unit, a logic operation unit, control unit, or a combination thereof; forming second MEMS chips on the first intermediate chips, each with a through-substrate via, having a second sensor or microactuator on its upper surface, wherein the package structure includes at least one of the first sensor and the second sensor; and forming first capping plates on the second MEMS chips, each providing a receiving space for the second sensor or microactuator on the upper surface of each second MEMS chip.

In some embodiments, a LIDAR system may include at least one processor configured to control at least one light source for projecting light toward a field of view and receive from at least one first sensor first signals associated with light projected by the at least one light source and reflected from an object in the field of view, wherein the light impinging on the at least one first sensor is in a form of a light spot having an outer boundary. The processor may further be configured to receive from at least one second sensor second signals associated with light noise, wherein the at least one second sensor is located outside the outer boundary; determine, based on the second signals received from the at least one second sensor, an indicator of a magnitude of the light noise; and determine, based on the indicator the first signals received from the at least one first sensor and, a distance to the object.