Accelerometer including a seismic mass in a plane and a first capacitor plate and a second capacitor plate arranged parallel to the plane. The seismic mass is arranged in between the first capacitor plate and the second capacitor plate. The first capacitor plate and the second capacitor plate are configured to detect movements of the seismic mass out of the plane. A pillar extending from the first capacitor plate to the second capacitor plate through a cut-out in the seismic mass for stiffening the accelerometer.

Actuators (140), which are a pair of members, are disposed one on either side of a movable frame (120) in the X-axis direction, and oscillate the movable frame (120) about the X axis in relation to a fixed frame (110) by deformation caused by stretching and contracting of piezoelectric elements. Actuators (150), which are a pair of members, are disposed one on either side of a mirror (130) in the Y-axis direction, and oscillate the mirror (130) about the Y axis in relation to the movable frame (120) by deformation caused by stretching and contracting of the piezoelectric elements. The length of each actuator (140) extending in the Y-axis direction is longer than a distance between an inner side of the fixed frame (110) to which the actuator (140) is connected and the middle point of an outer side of the movable frame (120) in the Y-axis direction.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.

A MEMS gyroscope including: a frame arranged parallel to a bottom wafer substrate; a sensor mass body excited at one degree of freedom in an excitation mode, and of which the displacement is sensed at two degrees of freedom by a Coriolis force in a sensing mode when an external angular velocity is input to the frame; and at least two sensing electrode for sensing a displacement of the sensor mass body, the displacement being sensed at the two degrees of freedom, wherein the sensor mass body comprises an inner mass body and an outer mass body surrounding the inner mass body, the outer mass body and the frame are connected by a first support spring, and the outer mass body and the inner mass body are connected by a second support spring.

Sensing devices are described. A sensing device includes an inertial sensor, a read-out circuit configured to determine first data indicative of an acceleration of the structure using an output of the inertial sensor, an energy harvester configured to capture energy, and a power management unit. The power management unit comprises a plurality of energy storage components coupled to the energy harvester and a plurality of switches coupled to respective energy storage components of the plurality of energy storage components. The power management unit monitors energy levels stored in the energy storage components, selectively charges the plurality of energy storage components by selectively activating the plurality of switches, and provides power to one or more of the inertial sensor and the read-out circuit based on the monitored energy levels.

A multi-axis MEMS assembly is configured to provide multi-axis movement and includes: a first in-plane MEMS actuator configured to enable movement along at least an X-axis; and a second in-plane MEMS actuator configured to enable movement along at least a Y-axis; wherein the first in-plane MEMS actuator is coupled to the second in-plane MEMS actuator.

Disclosed herein an inertial sensor and a method of manufacturing the same. An inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 that includes an adhesive part 123 disposed under a central portion 113 of the membrane 110 and provided at the central portion thereof and a patterning part 125 provided at an outer side of the adhesive part 123 and patterned to vertically penetrate therethrough, and a first adhesive layer 130 that is formed between the membrane 110 and the adhesive part 123 and is provided at an inner side of the patterning part 125. An area of the first adhesive layer 130 is narrow by isotropic etching using the patterning part 125 as a mask, thereby making it possible to improve sensitivity of the inertial sensor 100.

A micro-electrical-mechanical system (MEMS) assembly includes a stationary stage, a rigid stage, at least one flexure configured to slidably couple the stationary stage and the rigid stage, at least one flexible electrode coupled and essentially orthogonal to one of the stationary stage and the rigid stage, and at least one rigid electrode coupled and essentially orthogonal to the other of the stationary stage and the rigid stage.

A micro-electrical-mechanical system (MEMS) cantilever assembly includes an intermediary cantilever portion, a main cantilever arm configured to couple a moveable portion of a micro-electrical-mechanical system (MEMS) and the intermediary cantilever portion, and a plurality of intermediary links configured to couple the intermediary cantilever portion to a portion of the micro-electrical-mechanical system (MEMS).