Methods for fabricating a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body. In some embodiments, a conductive column extends through the pre-molded body to allow electrical connection from a partially encapsulated lead frame to the conductive cover. Some embodiments may include a multi-tiered cavity within the mold body for mounting an integrated circuit separated by a gap above the MEMS device.

A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.

An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.

Embodiments of the invention describe hermetic encapsulation for MEMS devices, and processes to create the hermetic encapsulation structure. Embodiments comprise a MEMS substrate stack that further includes a magnet, a first laminate organic dielectric film, a first hermetic coating disposed over the magnet, a second laminate organic dielectric film disposed on the hermetic coating, a MEMS device layer disposed over the magnet, and a plurality of metal interconnects surrounding the MEMS device layer. A hermetic plate is subsequently bonded to the MEMS substrate stack and disposed over the formed MEMS device layer to at least partially form a hermetically encapsulated cavity surrounding the MEMS device layer. In various embodiments, the hermetically encapsulated cavity is further formed from the first hermetic coating, and at least one of the set of metal interconnects, or a second hermetic coating deposited onto the set of metal interconnects.

Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.

Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.

An example includes: a system board having a surface; bond fingers on a surface of the system board; a semiconductor device on the surface of the system board, the semiconductor device comprising a semiconductor die having a surface, the semiconductor die comprising bond pads on the surface; conductors coupling the bond pads to the bond fingers; and a datum structure on the surface of the system board, the datum structure having openings that form wells with sides around the bond fingers.

A MEMS AE transducer system is provided that takes advantage of the low power consumption and lightweight characteristics of MEMS AE transducers, while also achieving higher sensing sensitivity. To address the problem of low sensitivity typically associated with MEMS AE transducers, electrical responses of multiple MEMS AE transducers operating at different frequency ranges are combined to increase the bandwidth and sensitivity of the MEMS AE transducer system. As the frequencies are constructive, the combined response on a single channel is the actual summation of two signals with an improved signal to noise ratio. Additionally, each frequency can be decomposed because they are well separated from each other due to the super narrowband response and high Quality factor of MEMS AE transducers.

A semiconductor device that includes: a base member; a detecting element on the base member and having a first surface with a detector; an insulating protective film covering the detector and the first surface; and a resin package on the base member and including an exposure hole exposing the detector to an outside, a portion of the resin package covering the detecting element such that at least a portion of an outer periphery of the first surface is exposed through the exposure hole, and the resin package includes a recess extending along the portion of the outer periphery exposed through the exposure hole. The detecting element has: a second surface extending from the outer periphery toward the base member, a third surface extending outward from the second surface, and a fourth surface extending from the third surface toward the base member, and wherein the protective film covers the second surface.