Embodiments of the disclosure provide a comb drive, a comb drive system, and a method of operating the comb drive to rotate bi-directionally in a MEMS environment. An exemplary comb drive system may include a comb drive, at least one power source, and a controller. The comb drive may include a stator comb having a first electrically conductive layer spaced apart from a second electrically conductive layer. The comb drive may also include a rotor comb having a first electrically conductive layer spaced apart from a second electrically conductive layer. The controller may be configured to apply first and second voltage levels having opposite polarities to the first and second electrically conductive layers of the rotor comb, respectively. The controller may also be configured to apply an intermediate voltage level to one of the first or second electrically conductive layers of the stator comb.

A method of operating a microelectromechanical system (MEMS) includes, in a first operational mode, converting an analog output of the MEMS into a first internal data stream and a first external data stream having a first sampling rate; transitioning from the first operational mode to a second operation mode without restarting the MEMS; and in the second operational mode, converting the analog output of the MEMS into a second internal data stream having a second sampling rate different from the first sampling rate, and performing a sampling rate conversion of the second internal data stream to generate a second external data stream.

The present disclosure relates to an integrated chip including a semiconductor device substrate and a plurality of semiconductor devices arranged along the semiconductor device substrate. A micro-electromechanical system (MEMS) layer overlies the semiconductor device substrate. The MEMS layer includes a first moveable mass and a second moveable mass. A capping layer overlies the MEMS layer. The capping layer has a first lower surface directly over the first moveable mass and a second lower surface directly over the second moveable mass. An outgas layer is on the first lower surface and directly between the first pair of sidewalls. A lower surface of the outgas layer delimits a first cavity in which the first moveable mass is arranged. The second lower surface of the capping layer delimits a second cavity in which the second moveable mass is arranged.

A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

Arrangement for controlling micromechanical actuators, including a digital-to-analog converter and a plurality of micromechanical actuators; wherein the micromechanical actuators are coupled to a connecting structure; wherein the digital-to-analog converter is configured to provide a voltage to be applied to the connecting structure by an adjustable capacitive voltage division that is dependent on a digital input value of the digital-to-analog converter, wherein the digital-to-analog converter is configured to directly include a capacitance of the connecting structure in the capacitive voltage division.

A device comprising a micro-electro-mechanical system (MEMS) substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor (CMOS) substrate is presented herein. The MEMS substrate comprises defined protrusions of respective distinct heights from a surface of the MEMS substrate, and the MEMS substrate is bonded to the CMOS substrate. In an aspect, the defined protrusions can be formed from the MEMS substrate. In another aspect, the defined protrusions can be deposited on, or attached to, the MEMS substrate. In yet another aspect, the MEMS substrate comprises monocrystalline silicon and/or polysilicon. In yet even another aspect, the defined protrusions comprise respective electrodes of sensors of the device.

A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.

Compositions and methods related to straining defect doped materials as well as their methods of use in electrical circuits are generally described.

A method for tuning one or more sensor devices is provided, wherein each sensor device comprises one or more proof masses configured to move in response to an external stimulus of interest, and the one or more proof masses are also susceptible to move in response to one or more stimuli other than the external stimulus of interest. Each sensor device also comprises one or more pick-off mechanisms respectively associated with each of the one or more proof masses. The one or more pick-off mechanisms is proportionally responsive to a motion of the sensor device. The method for tuning includes adjusting gain of one or more of the pick-off mechanisms to reduce an output of each sensor device when the one or more proof masses move in response to the one or more stimuli other than the external stimulus of interest.

Compositions and methods related to straining defect doped materials as well as their methods of use in electrical circuits are generally described.