A MEMS sensor generates an output multiscale reading signal supplied to a full scale adjustment stage. The full scale adjustment stage includes a signal input configured to receive the reading signal, a saturation assessment block, and a full scale change block. The saturation assessment block is coupled to the signal input and configured to generate a scale increase request signal upon detection of a saturation condition. The full scale change block is coupled to the saturation assessment block and configured to generate a full scale change signal upon reception of the scale increase request signal.

Sense amplifiers for use in connection with microelectromechanical system (MEMS) gyroscopes are described. The sense amplifiers may be configured to change the level of a gyroscope signal, i.e., the signal produced by a gyroscope in response to angular motion, to a level suitable for processing circuitry arranged to infer the angular velocity. The sense amplifier may further provide a DC discharge path allowing for discharge of the DC component of the output signal. The DC discharge path may include an anti-aliasing filter and a resistive circuit. The anti-aliasing filter may filter the output signal to maintain the resistive circuit in the linear region. The anti-aliasing filter may be designed with a frequency response such that discrete frequency sub-bands are blocked or at least attenuated. The frequency sub-bands may be tuned to substantially match the gyroscope's resonant frequency and its integer multiples.

In accordance with an embodiment, a microelectromechanical transducer includes a displaceable membrane having an undulated section comprising at least one undulation trough and at least one undulation peak and a plurality of piezoelectric unit cells. At least one piezoelectric unit cell is provided in each case in at least one undulation trough and at least one undulation peak, where each piezoelectric unit cell has a piezoelectric layer and at least one electrode in electrical contact with the piezoelectric layer. The membrane may be formed as a planar component having a substantially larger extent in a first and a second spatial direction, which are orthogonal to one another, than in a third spatial direction, which is orthogonal to the first and the second spatial direction and defines an axial direction of the membrane.

A microphone package structure includes a substrate, a metal housing, a MEMS microphone component and at least one integrated circuit component. The substrate has a first surface and a second surface that are opposite to each other. The metal housing is located on the first surface such that the substrate and the metal housing collectively define a hollow chamber. The MEMS microphone component is located on the metal housing and within the hollow chamber. The at least one integrated circuit component is located within a region of the second surface on which the metal housing has a vertical projection.

A micro-electro-mechanical sensor comprises a first substrate comprising an element movable with respect to the first substrate and a second substrate comprising a first contact pad and a second contact pad. The first substrate is bonded to the second substrate such that a movement of the element changes a coupling between the first contact pad and the second contact pad.

A microphone assembly includes a substrate defining a port, a MEMS transducer, a guard ring, and a can. The MEMS transducer is coupled to the substrate such that the MEMS transducer is positioned over the port. The guard ring is coupled to the substrate and surrounds the MEMS transducer. The guard ring includes a plurality of edges that further includes a first edge and an opposing second edge. A portion of the first edge and a portion of the second edge have a reduced thickness relative to adjacent ones of the plurality of edges. The can is coupled to the guard ring such that the substrate and the can cooperatively define an interior cavity.

Described herein are methods and systems for controlling a sensor assembly with a plurality of same type sensors. Sensors are operated in active and inactive states and have a corresponding performance parameter and reliability parameter that may be determined. The activation state of at least one of the sensors is changed based on an operational parameter. The performance parameter and/or the reliability parameter can then be updated.

A planer silicon-based displacement amplification structure and a method are provided for latching the displacement. The displacement amplification structure may include a first actuation beam and a second actuation beam coupled to the first beam with an angle, the ends of the first beam and the second beam coupled to fixture sites, and an end of the second beam coupled to a motion actuator; a motion shutter coupled to an opposing end of the first and second beams; and a latching thermoelectric displacement structure blocking the shutter return path and have faster response than the shutter structure.

A MEMS device comprising a substrate comprising a die and a plurality of side-walls disposed upon the MEMS die, a proof-mass coupled to the substrate, the proof-mass is configured to be displaced within a first plane that is parallel to the die, wherein the proof-mass is configured to contact at least a sidewall, wherein the proof-mass is configured to adhere to the side-wall as a result of stiction forces, a driving circuit configured to provide a driving voltage in response to a driving signal indicating that the proof-mass is adhered to the side-wall, and an actuator coupled to the driving circuit disposed upon the side-wall, wherein the actuator is configured to receive a driving voltage and to provide an actuator force to the proof mass within the first plane in a direction away from the side-wall in response to the driving voltage, wherein the actuator force exceeds the stiction forces.

A microelectromechanical actuator, comprising: a substrate, having a surface; a conductive beam suspended parallel to the substrate, displaceable along an axis normal to the surface of the substrate; a center electrode on the substrate under the beam; a pair of side electrodes on the substrate configured, when charged, to exert an electrostatic force normal to the surface of the substrate on the beam that repulses the beam from the substrate, and exerts a balanced electrostatic force on the beam in a plane of the surface of the substrate, the center conductive electrode being configured to shield the beam from electrostatic forces induced by the side electrodes from beneath the beam, and the center electrode being configured to have a voltage different from a voltage on the beam, to thereby induce an attractive electrostatic force on the beam.