A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

The present disclosure relates to a system for detecting movement of a microelectromechanical system (MEMS) device. The system uses a drive voltage signal source for generating a low frequency drive voltage signal for driving the MEMS device. An excitation signal source may be used for generating an excitation signal which is also applied to the MEMS device. The excitation signal has a frequency which is above a physical response capability of the MEMS device, such that operation of the MEMS device is not significantly affected by the excitation signal. A sensing impedance is used to help generate a signal which is responsive to the capacitance of the MEMS device. The capacitance of the MEMS device changes in response to movement of the MEMS device. An output subsystem is provided which responds to changes sensed by the sensing impedance, and which produces an output voltage signal. A filter filters the output voltage signal to produce a filtered output voltage signal. The filtered output voltage signal is indicative of a position of the MEMS device.

A device includes a nozzle including a discharge end for discharging a fluid, a shutter plate including an aperture, the shutter plate positioned at the discharge end of the nozzle, a plurality of tethers coupled to the shutter plate, and a plurality of electrostatic actuators. Each of the plurality of electrostatic actuators are coupled to one or more of the plurality of tethers. The plurality of electrostatic actuators are configured to move the shutter plate between an open position and a closed position relative the discharge end of the nozzle. In the open position, the aperture is in fluid communication with the discharge end of the nozzle to permit fluid from the discharge end of the nozzle to flow through the aperture. In the closed position, at least a portion of the shutter plate inhibits fluid from the discharge end of the nozzle from flowing through the aperture.

A microelectromechanical system includes a piezoelectric drive and a control unit coupled to the piezoelectric drive and designed to control the piezoelectric drive based on a change of the admittance and/or the impedance of the piezoelectric drive.

A circuit includes a cross-talk compensation component including a power profile reconstruction component for reconstructing the power profile of a digital microphone coupled to a microelectromechanical (MEMS) device, wherein the power profile represents power consumption of the digital microphone over time between at least two operational modes of the digital microphone, and a reconstruction filter for modeling thermal and/or acoustic properties of the digital microphone; and a subtractor having a first input for receiving a signal from the digital microphone, a second input coupled to the cross-talk compensation component, and an output for providing a digital output signal.

A MEMS device includes a MEMS sound transducer, and control circuitry. The control circuitry includes a supply signal provider for providing a high-level supply signal and read-out circuitry for receiving an output signal from the MEMS sound transducer, and a switching arrangement for selectively connecting the MEMS sound transducer to the supply signal provider, and for selectively connecting the MEMS sound transducer to the read-out circuitry based on a control signal. The control circuitry provides the control signal having an ultrasonic actuation pattern to the switching arrangement during a first condition TX of the control signal, wherein the ultrasonic actuation pattern of the control signal triggers the switching arrangement for alternately coupling the high-level supply signal to the MEMS sound transducer.

The present subject matter relates to charge pump devices, systems, and methods in which a first plurality of series-connected charge-pump stages is connected between a supply voltage node and a first circuit node, wherein the first plurality of charge-pump stages are operable to produce a first electrical charge at the first circuit node, the first electrical charge having a first polarity; and a second plurality of series-connected charge-pump stages is connected between the supply voltage node and a second circuit node, wherein the second plurality of charge-pump stages are operable to produce a second electrical charge at the second circuit node, the second electrical charge having a second polarity.

A system for diagnosing the operating state of a MEMS sensor includes a stimulation circuit, external to the MEMS sensor, configured to generate a stimulation signal designed to be detected by the MEMS sensor. The system has control circuitry, operatively coupled to the stimulation circuit and to the MEMS sensor, so as to control the stimulation circuit to generate the stimulation signal and receive a diagnostic signal generated by the MEMS sensor in response to the stimulation signal. The control circuitry determines an operating state of the MEMS sensor based on the diagnostic signal and an expected response to the stimulation signal by the MEMS sensor.

A MEMS microphone includes an ASIC chip, a first MEMS chip, a second MEMS chip, a housing and a circuit board. The ASIC chip is electrically connected to the first MEMS chip and the second MEMS chip, and the ASIC chip, the first MEMS chip and the second MEMS chip are mounted on the circuit board. The circuit board and the housing cooperatively form a first chamber configured to accommodate the ASIC chip and the first MEMS chip, and a second chamber configured to accommodate the second MEMS chip. The circuit board defines a first through hole corresponding to the first MEMS chip and a second through hole corresponding to the second MEMS chip. The MEMS microphone has both the function of the traditional microphone and the function of the distance sensor, which saves the space occupied by components in a mobile terminal and the cost of the components.

A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.