A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

A method includes fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a first mask on a second side of the device wafer, wherein the second side is planar. A plurality of dimple features is formed on an exposed portion on the second side of the device wafer. The first mask is removed from the second side of the device wafer. A second mask is deposited on the second side of the device wafer that corresponds to a standoff. An exposed portion on the second side of the device wafer is etched to form the standoff. The second mask is removed. A rough polysilicon layer is deposited on the second side of the device wafer. A eutectic bond layer is deposited on the standoff. In some embodiments, a micro-electromechanical system (MEMS) device pattern is etched into the device wafer.

The present disclosure relates to a sensor chip, including a semiconductor substrate, a first sensor circuit monolithically integrated into the semiconductor substrate, at least one second sensor circuit monolithically integrated into the semiconductor substrate, wherein the first and second integrated sensor circuits are embodied identically.

A heat flux sensor comprising: an array of nanofilaments suspended with respect to a support, each nanofilament comprising an electrically conducting material, the array being able to be biased by an electric power source to circulate an electric current in each of the nanofilaments, at least one resonator of the nanoelectro-mechanical system (NEMS) type comprising: a beam consisting of a nanofilament forming a side of the array, an actuation device able to generate a vibration of the beam under the effect of an excitation signal, a detection device configured to measure a displacement of the beam during the vibration and emit an output signal having a resonance at the resonant frequency of the resonator, the resonant frequency depending on the intensity of the electric current flowing through the beam, a temperature variation of the array of heating nanofilaments induced by a variation in a characteristic of a fluid surrounding the array causing an intensity variation of the current flowing through the beam resulting in a variation in the resonant frequency of the resonator.

Described herein are methods and systems for controlling a sensor assembly with a plurality of same type sensors. Sensors are operated in active and inactive states and have a corresponding performance parameter and reliability parameter that may be determined. The activation state of at least one of the sensors is changed based on an operational parameter. The performance parameter and/or the reliability parameter can then be updated.

An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each transducer chip may comprise a microelectromechanical systems (MEMS) component that may include a plurality of ultrasound elements closely packed with one another, an Application-Specific Integrated Circuit (ASIC) that may be operatively coupled to the plurality of ultrasound elements of said MEMS component, and a control unit that may be electrically coupled to each ASIC of the plurality of transducer chips for control thereof. In some embodiments, at least two transducer chips of the plurality of transducer chips may be placed on the circuitry substrate with a separation distance that may be less than an operational wavelength of the ultrasound elements of the MEMS components of said at least two transducer chips.

A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

The MEMS actuator is formed by a substrate, which surrounds a cavity; by a deformable structure suspended on the cavity; by an actuation structure formed by a first piezoelectric region of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure formed by a second piezoelectric region of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.

A light beam deflection system is configured to transmit a light beam at an output deflection angle that changes over time. The system includes a first resonant structure configured to oscillate about a first rotation axis at first resonant frequency; a second resonant structure configured to oscillate about a second rotation axis at a second resonant frequency, where the first rotation axis is parallel to the second rotation axis, and where the first resonant frequency and the second resonant frequency are different and define a predetermined frequency difference; and a driver circuit configured to generate a first driving signal to drive the first resonant structure while further generating a second driving signal to drive the second resonant structure such that the output deflection angle of the light beam oscillates according to a beat pattern of a beat wave whose extrema amplitudes are modulated and defined by a periodic envelope.

A sensor device includes a substrate having a front surface and an opposing back surface. The back surface defines an indented region having an indented surface. The substrate defines a bottom port extending between the front surface and the indented surface. The sensor further includes a microelectromechanical systems (MEMS) transducer mounted on the front surface of the substrate over the bottom port. The sensor also includes a filtering material disposed on the indented surface and covering the bottom port. The filtering material provides resistance to ingression of solid particles or liquids into the sensor device. The filtering material is configured to provide high acoustic permittivity and have low impact on a signal-to-noise ratio of the sensor device.