In one embodiment, a method of aligning mirrors of a micro-electro-mechanical system (MEMS) photonic switch includes illuminating a first group of photodiodes associated with a first mirror of a first mirror array of the MEMS photonic switch by a first control beam during a first period of time and illuminating a second group of photodiodes associated with a second mirror of the first mirror array by a second control beam during a second period of time, where the second control beam is off during the first period of time, where the first control beam is off during the second period of time, and where the second period of time is after the first period of time. The method also includes illuminating the first group of photodiodes by the first control beam during a third period of time, where the second control beam is off during the third period of time, and where the third period of time is after the second period of time.

First reinforcement stripes are formed on a process surface of a base substrate. A first epitaxial layer covering the first reinforcement stripes is formed on the first process surface. Second reinforcement stripes are formed on the first epitaxial layer. A second epitaxial layer covering the second reinforcement stripes is formed on exposed portions of the first epitaxial layer. Semiconducting portions of transistor cells are formed in or portions of micro electromechanical structures are formed from the second epitaxial layer.

A display device capable of operating at high speed and with low power consumption is provided. A miniaturized display device occupying a small area is also provided. The display device includes a support; a display portion which includes a pixel; a light-blocking unit which is in the support and includes a light-blocking layer having a first opening overlapping with at least part of the pixel, and a movable light-blocking layer blocking light passing through the first opening; a transistor which is electrically connected to the light-blocking unit and includes an oxide semiconductor film; and a capacitor electrically connected to the transistor.

The present invention is related to a triaxial micro-electromechanical gyroscope, comprising: a ring-shaped detection capacitor located at the center; two sets of driving capacitors located at outer sides of the ring-shaped detection capacitor and symmetrically distributed at two sides of an origin along a y-axis; two sets of second detection capacitors located at the outer sides of the ring-shaped detection capacitor respectively and symmetrically distributed at the two sides of the origin along an x-axis; and a linkage part connected with movable polar plates of the driving capacitors, movable polar plates of the second detection capacitors, and an outer edge of ring-shaped upper polar plates of the ring-shaped detection capacitor, respectively. The triaxial micro-electromechanical gyroscope provided by the present invention adopts a single structure design, and integrates capacitive electrostatic driving and differential capacitive detection.

A MEMS sensor includes a sensing reference plane, an anchor, a proof mass, and sensing elements. The anchor is coupled to the sensing reference plane and to the proof mass that moves under an external excitation. The sensing elements detect motion normal to the sensing reference plane. A summation of a product of polarity for each sensing element, its area, and its distance to the anchor on one side of an axis line is unequal to a summation of a product of a polarity associated with each sensing element, its associated area, and its distance to the anchor on another side of the axis line. As such, external excitation creates an offset. The offset is substantially constant for curvature angles)(0°-360°) of the sensing reference plane. The offset is greater than zero and is less than a maximum offset for a MEMS sensor with perfect symmetry for its sensing elements.

Adjusting of calibration parameters for a sensor. The adjusted calibration parameters may be used to correct the raw data of the sensor. It is provided to calculate new calibration parameters only when accuracy of the calibration parameters currently available is no longer adequate, and suitable measurement data are available for a recalibration of the sensor. Otherwise, the components necessary for calibrating the sensor data may be deactivated in order to reduce energy consumption.

A moisture detector includes a sensor chip and a moisture determining unit. The sensor chip includes a humidity detector having a detection surface on which to measure humidity, and also includes a heater heating the detection surface, and the moisture determining unit is configured to, after causing the heater to start heating, determine whether moisture is present on the detection surface based on a difference in changes in the humidity measured by the humidity detector.

A MEMS device includes a first MEMS sensor associated with a first spatial plane and a second MEMS sensor is associated with a spatial second plane not co-planar with the first spatial plane, wherein the first MEMS sensor is configured to provide a first interrupt and a first data in response to a physical perturbation, wherein the second MEMS sensor is configured to provide a second interrupt and second data in response to the physical perturbation, and a controller configured to receive the first interrupt at a first time and the second interrupt at a second time different from the first time, wherein the controller is configured to determine a latency between the first time and the second time, and wherein the controller is configured to determine motion data in response to the first data, to the second data, and to the latency.

Aspects are directed to a MEMS device configurable to receive signals from a first, a second, a third, and a fourth signal source operating at a first, a second, a third, and a fourth frequency, respectively. The MEMS device may be configured to combine the first signal with the second signal generating a first combined signal, and to combine the third signal with the fourth signal generating a second combined signal. The first combined signal may be coupled to the first terminal of the MEMS device while the second combined signal may be coupled to the second terminal of the MEMS device. The first common terminal may be configured to produce an output associated with the second and fourth frequencies. The MEMS device may be further configured to derive from the produced output a signal indicative of nonlinearities or of changes in capacitance related to the MEMS device.

A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.