A microelectromechanical system (MEMS) device comprising a wafer including a MEMS device in a substrate of the wafer is mounted to a fluid dispenser stage. The MEMS device has a damping structure coupled to a suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to the fixed part of the substrate. The damping structure extends into a gap between the suspended element and fixed part of the substrate. The fluid confinement structures permit movement of the damping structure within a limited portion of the gap and confine a viscoelastic fluid to the limited portion of the gap. A viscoelastic fluid is deposited onto the wafer in an area of the wafer configured to communicate the viscoelastic fluid into the limited portion of the gap.

A MEMS based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens. The use of multiple flexures may reduce coupling between lens rotation and lens translation, and reduce effects of lever handle warping on lens position. The device can be optimized for various geometries.

A microelectromechanical system (MEMS) device includes a substrate, a suspended element and a damping structure connected to the suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to a fixed part of the substrate. The damping structure extends into a gap between the suspended element and the fixed part of the substrate. The damping structure includes one or more winglets that protrude over a recessed portion of the fixed part of the substrate. The fluid confinement structures are formed by the recessed portion of the fixed substrate and are configured to permit movement of the damping structure over the recessed portion of the substrate and confine a viscoelastic fluid to the limited portion of the gap underneath the winglets.

A scanning device includes a substrate, which is etched to define an array of two or more parallel rotating members and a gimbal surrounding the rotating members. First hinges connect the gimbal to the substrate and defining a first axis of rotation, about which the gimbal rotates relative to the substrate. Second hinges connect the rotating members to the support and defining respective second, mutually-parallel axes of rotation of the rotating members relative to the support, which are not parallel to the first axis.

A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

A scanning device includes a substrate, which is etched to define an array of two or more parallel rotating members and a gimbal surrounding the rotating members. First hinges connect the gimbal to the substrate and defining a first axis of rotation, about which the gimbal rotates relative to the substrate. Second hinges connect the rotating members to the support and defining respective second, mutually-parallel axes of rotation of the rotating members relative to the support, which are not parallel to the first axis.

There is set forth herein an optomechanical device which can comprise a first mirror and a second mirror forming with the first mirror a cavity. In one aspect the first mirror can be a movable mirror. The optomechanical device can be adapted so that the first mirror is moveable responsively to radiation force.

A MEMS based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens. The use of multiple flexures may reduce coupling between lens rotation and lens translation, and reduce effects of lever handle warping on lens position. The device can be optimized for various geometries.

A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

An integrated circuit includes an electrode voltage controller, a micro-electromechanical system (MEMS) structure, and a bias voltage generator. The MEMS structure has a first electrode, a conductive plate, and a reflective layer on the conductive plate. The first electrode is coupled to the electrode voltage controller, and the conductive plate is configured to move vertically with respect to the first electrode responsive to a voltage generated by the electrode voltage controller and applied to the first electrode. The bias voltage generator is coupled to the conductive plate. The bias voltage generator has an input configured to receive a bias control signal. The bias voltage generator is configured to apply a non-zero bias voltage to the conductive plate responsive to the bias control signal.