Disclosed herein are embodiments of a sensor device, systems incorporating the same, and methods of fabricating the same. In one embodiment, a sensor device comprises a free-standing sensing element, such as a micro-electromechanical system (MEMS) device. The sensor device further comprises a metallic band to facilitate mounting the MEMS device to a mounting plate. The sensor device further comprises a conformal coating on a least a portion of a sensor region of the sensor device.

Disclosed herein are embodiments of a mass flow control apparatus, systems incorporating the same, and methods using the same. In one embodiment, a mass flow control apparatus comprises a flow modulating valve configured to modulate gas flow in a gas flow channel, a sensor device, such as a micro-electromechanical (MEMS) device, configured to generate a signal responsive to a condition of the gas flow, and a processing device operatively coupled to the flow modulating valve and the sensor device to control the flow modulating valve based on a signal received from the sensor device.

A process for manufacturing a microelectromechanical device envisages: providing a wafer of semiconductor material; forming a buried cavity, completely contained within the wafer, and a structural layer formed by a surface portion of the wafer and suspended over the buried cavity; forming first trenches through the structural layer as far as the buried cavity, which define the suspended structure in the structural layer; filling the first trenches and the buried cavity with sacrificial material; forming a closing structure above the structural layer; removing the sacrificial material from the first trenches and from the buried cavity to release the suspended structure, the suspended structure being isolated and buried within the wafer in a buried environment formed by the first trenches and by the buried cavity.

A MEMS sensor is disclosed that includes dual pendulous proof masses comprised of sections of different thickness to allow simultaneous suppression of vertical and lateral thermal gradient-induced offsets in a MEMS sensor while still allowing for the normal operation of the accelerometer. In an embodiment, the structure and different sections of the MEMS sensor is realized using multiple polysilicon layers. In other embodiments, the structure and different thickness sections may be realized with other materials and processes. For example, plating, etching, or silicon-on-nothing (SON) processing.

A platform includes first and second actuation layers. The first actuation layer includes first and second frames and a plurality of actuators connected between the first frame and the second frame, wherein the plurality of actuators are adapted to move the first and second frames with respect to each other in a first direction. The second actuation layer includes third and fourth frames and a plurality of actuators connected between the third frame and the fourth frame, wherein the plurality of actuators are adapted to move the third frame and the fourth frame with respect to each other in a second direction, different from the first direction. Thereby, the fourth frame of the second actuation layer and the second frame of the first actuation layer are mechanically connected to each other, such that the second actuation layer experiences the movement in the first direction induced by the first actuation layer.

A micromechanical component having a movable seismic mass developed in a second and third silicon functional layer, a hollow body being developed in the second and third silicon functional layers, which has a cover element developed in a fourth silicon functional layer.

A package structure includes a cover and a cell disposed within the cover. The cell includes a membrane, an actuating layer and an anchor structure. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other in a top view. The actuating layer is disposed on the first membrane subpart and the second membrane subpart in the top-view direction. The membrane is anchored by the anchor structure. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

A sound producing cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

A micro-electromechanical-system (MEMS) switch (1) is formed in a substrate (2) and includes a first RF signal line (3) and a second RF signal line (4), a deformable membrane (5), an activator (7) configured to deform the membrane (5), a substrate track, and a membrane track. The RF signal lines (3, 4) are connected by one of the membrane track and the substrate track. A membrane RF ground (9, 10) is integrated into the membrane (5), and the membrane RF ground is electrically connected to a substrate RF ground (11, 12, 3, 14), the membrane RF ground framing and being formed parallel to at least one among the membrane track (8) and the substrate track, such that the RF ground (9, 10) closely follows the RF signal path, in order to guide the propagation of the RF signal of the first RF signal line (3) to the second RF signal line (4) when the switch is in the on state.

A micromechanical structure includes a fixing point, a silicon spring, and a movable part. The silicon spring is connected to the fixing point at a first end and to the movable part at a second end. At least one copper circuit trace is situated on the silicon spring and extends at least from the first end to the second end. The copper circuit trace has a layer structure including a plurality of contiguous copper layers.