Disclosed is an actuator including a support member, an actuating unit rotatably installed in the support member and having a first electrode installed on one side and a stimulation providing unit installed on the other side to provide stimulation by rotation, and an attraction force providing unit having a second electrode to provide an attraction force to the first electrode, wherein when an electrostatic attraction force is provided to the first electrode through the second electrode, the actuating unit pivots to enable the stimulation providing unit to apply stimulation to a sensing unit.

Three-dimensional micro devices usable as electromagnetic and magnetomechanical energy converters, as micromagnetic motors or generators, and methods for their production. The three-dimensional micro devices exhibit high efficiency even at dimensions on the microscale and below, and the method for production, as well as mass production, is simple and economical. Moreover, the three-dimensional micro devices at least include one three-dimensional device produced using roll-up technology. This three-dimensional device includes all functional and structural components for full functionality. At least one functional or structural component is an element that is at least partially freely movable at least partially within a surrounding element and is arranged such that it can be rotated at least around one of its axes.

A micromechanical device capable of providing out-of-plane motion and force generation in response to an in-plane strain applied to the device is provided. Embodiments of the present invention comprise one or more islands that are operatively coupled with one or more hinges. The hinges are operative for inducing rotation of the islands when a lateral strain is applied to the structure. In some embodiments, the hinges are also electrically conductive such that they enable electrical communication between the one or more islands and devices external to the structure. Some embodiments of the present invention are particularly well suited for use in biological applications. Some devices in accordance with the present invention are fabricated using conventional planar processes, such as flex-circuit fabrication techniques.

The present application provides a micromechanical (MEMS) based zoom lens system, for use in miniature device applications, such as miniature electronic imaging devices. The MEMS-based zoom lens system comprises at least four optical elements, or two Alvarez or Lohmann lenses, that are configured for passage of optical signals therethrough along an optical signal path. Each optical element is MEMS-driven and displaceable in a direction substantially transverse to the optical signal path. In use, the transverse displacement of the optical elements vary an overall focal length of the MEMS zoom lens system such as to provide an optical zoom function. A method of manufacturing a MEMS zoom lens system is also provided in a further aspect.

The present invention generally relates to multi-layer glass structures and methods of making the same.

According to the present invention there is provided a MEMS device comprising, a mirror which is connected to a fixed portion by means of a first and second torsional arm, each of the first and second torsional arms are configured such that they can twist about torsional axes so as to oscillate the mirror about a first oscillation axes, and wherein the first and second torsional arms are each configured to have two or more meanders and wherein the first and second torsional arms are arranged symmetrically relative to the first oscillation axis.

A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.

A microphone is disclosed. The microphone includes a housing and a circuit board cooperatively forming an accommodation space to accommodate a MEMS chip. The housing forms a first sound channel and the circuit board forms a second sound channel. Further, the microphone includes a controller for controlling the switch of the first and second sound channels.

A MEMS device and method of forming the same includes paired masses suspended above a substrate includes linkages that couple pairs of masses to each other. Inner sense linkages couple interior edges of adjacent masses to each other. The inner sense linkages are configured to exhibit a first stiffness when the adjacent masses coupled to each inner sense linkage move out-of-phase relative to each other along a preferred axis of the inner sense linkages and to exhibit a second, increased stiffness in response to in-phase motion of the adjacent masses coupled to each inner sense linkage.

A strain sensor utilizes an ohmic-based contact switch to detect strain. The sensor can be incorporated into other structures, such as an artificial flapping wing, to detect strain and other parameters, including air flow disturbances. The sensors are fabricated using an additive manufacturing process, with a layer of gold or other conductive material applied for electrical conductivity and UV laser ablation for electrical isolation. The sensor design incorporates mechanical amplification, converting small strains into larger displacements that close contact pads, resulting in an ohmic switch activated at a specific strain threshold. Unlike traditional sensors, the switch provides a high or low state output directly without the need for additional amplification or post-processing. The device can detect disturbances in flapping wing cycles and obtain yaw rotation information, with potential applications in other aircraft for disturbance detection.